SMT power inductors
Size 6.0 u 6.0 u 3.0 (mm)
Series/Type:
B82462A4
Date:
October 2019
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¤TDK Electronics AG 2019. Reproduction, publication and dissemination of this publication, enclosures hereto
and the information contained therein without TDK Electronics’ prior express consent is prohibited.
SMT power inductors
B82462A4
Size 6.0 x 6.0 x 3.0 (mm)
Rated inductance 1 ... 1000 μH
Rated current 0.11 ... 3 A
Construction
■ Ferrite core
■ Winding: enamel copper wire
■ Winding welded to terminals
Features
Temperature range up to +150 °C
High rated current
Low DC resistance
Suitable for lead-free reflow soldering
as referenced in JEDEC J-STD 020D
■ Qualified to AEC-Q200
■ RoHS-compatible
■
■
■
■
Applications
■
■
■
■
■
Filtering of supply voltages
Coupling, decoupling
DC/DC converters
Automotive electronics
Industrial electronics
Terminals
■ Base material CuSn6
■ Layer composition Ag, Sn (lead-free)1)
■ Electro-plated
Marking
■ Marking on component:
Manufacturer, L value (nH, coded),
L tolerance (coded), manufacturing date (YWWD)
■ Minimum data on reel:
Manufacturer, ordering code, L value,
■ quantity, date of packing
Delivery mode and packing unit
■ 12-mm blister tape, wound on 330-mm reel
■ Packing unit: 2500 pcs./reel
1) Ni-barrier-plated terminals on request (B82462A4*50).
Please read Cautions and warnings and
Important notes at the end of this document.
2
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SMT power inductors
B82462A4
Size 6.0 x 6.0 x 3.0 (mm)
Dimensional drawing and layout recommendation
Dimensions in mm
Taping and packing
Blister tape
Reel
Dimensions in mm
Please read Cautions and warnings and
Important notes at the end of this document.
3
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SMT power inductors
B82462A4
Size 6.0 x 6.0 x 3.0 (mm)
Technical data and measuring conditions
Rated inductance LR
Measured with impedance analyzer Agilent 4294A or equivalent
at frequency fL, 0.1 V, +20 °C
Operating temperature range
–55 ... + 150 °C
Rated current Itemp, typ
Max. permissible DC with temperature increase of d 40 K
at +85 °C
Saturation current Isat
Max. permissible DC with inductance decrease
'L/L0 of approx. 10%
DC resistance Rmax
Measured at +20 °C
Solderability (lead-free)
Dip and look method Sn95.5Ag3.8Cu0.7:
+(245 r5) °C, (5 r0.3) s
Wetting of soldering area t90%
(based on IEC 60068-2-58)
Resistance to soldering heat
+260 °C, 40 s as referenced in JEDEC J-STD 020D
Climatic category
55/150/56 (to IEC 60068-1)
Storage conditions
Mounted: –55 °C … +150 °C
Packaged: –25 °C … +40 °C, d75% RH
Weight
Approx. 0.2 g
Please read Cautions and warnings and
Important notes at the end of this document.
4
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SMT power inductors
B82462A4
Size 6.0 x 6.0 x 3.0 (mm)
Characteristics and ordering codes
LR
Tolerance fL
Isat,min
Itemp,typ Rmax
A
A
A
M 0.1
6.80
5.8
3.00
0.024
0.018 B82462A4102M000
1.5
0.1
5.50
4.6
2.60
0.030
0.024 B82462A4152M000
2.2
0.1
4.40
3.8
2.30
0.042
0.033 B82462A4222M000
3.3
0.1
3.25
3.2
2.00
0.06
0.047 B82462A4332M000
4.7
0.1
3.20
2.8
1.65
0.08
0.055 B82462A4472M000
6.8
0.1
2.65
2.3
1.40
0.10
0.081 B82462A4682M000
0.1
2.08
1.8
1.15
0.14
0.113 B82462A4103M000
K 0.1
1.72
1.5
0.90
0.21
0.185 B82462A4153K000
22
0.1
1.32
1.28
0.80
0.26
0.24
B82462A4223K000
33
0.1
1.12
1.04
0.63
0.42
0.34
B82462A4333K000
47
0.1
0.93
0.82
0.54
0.64
0.52
B82462A4473K000
68
0.1
0.84
0.69
0.43
0.86
0.75
B82462A4683K000
100
0.1
0.67
0.57
0.35
1.28
1.15
B82462A4104K000
150
0.1
0.57
0.49
0.29
1.76
1.67
B82462A4154K000
220
0.1
0.46
0.40
0.24
2.72
2.3
B82462A4224K000
330
0.1
0.36
0.34
0.20
3.9
3.5
B82462A4334K000
470
0.1
0.33
0.28
0.17
5.6
5.1
B82462A4474K000
680
0.1
0.24
0.23
0.14
8.0
7.3
B82462A4684K000
1000
0.1
0.19
0.18
0.11
13.0
11.4
B82462A4105K000
PH
MHz
1.0
r20%
^
10
15
r10%
^
:
1) For Ni-barrier-plated terminals replace the last two digits “00” by “50”.
Please read Cautions and warnings and
Important notes at the end of this document.
5
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Rtyp
Ordering code1)
Isat,typ
:
SMT power inductors
B82462A4
Size 6.0 x 6.0 x 3.0 (mm)
Impedance |Z| versus frequency f
measured with impedance analyzer
Agilent 4294A, typical values at +20 °C
Inductance L versus DC load current IDC
measured with LCR meter Agilent 4285A,
typical values at +20 °C
Current derating Iop/IR
versus ambient temperature TA
(rated temperature TR = +85 °C)
Please read Cautions and warnings and
Important notes at the end of this document.
6
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Cautions and warnings
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire, wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
– Many coating materials have a negative effect (chemically and mechanically) on the winding
wires, insulation materials and connecting points. Customers are always obligated to
determine whether and to what extent their coating materials influence the component.
Customers are responsible and bear all risk for the use of the coating material. TDK
Electronics does not assume any liability for failures of our components that are caused by the
coating material.
■ Ceramics / ferrites are sensitive to direct impact. This can cause the core material to flake, or
lead to breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Display of ordering codes for TDK Electronics products
The ordering code for one and the same product can be represented differently in data sheets, data
books, other publications, on the company website, or in order-related documents such as shipping
notes, order confirmations and product labels. The varying representations of the ordering
codes are due to different processes employed and do not affect the specifications of the
respective products. Detailed information can be found on the Internet under
www.tdk-electronics.tdk.com/orderingcodes.
Please read Cautions and warnings and
Important notes at the end of this document.
7
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Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements
about the suitability of our products for a particular customer application. As a rule, we
are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to
check and decide whether a product with the properties described in the product specification is
suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current
state of the art, even if they are operated as specified. In customer applications requiring a
very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event
of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the foregoing
for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms
and Conditions of Supply.
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Important notes
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can
and will be implemented in our Quality Management System. For clarification purposes we
like to point out that obligations from IATF 16949 shall only become legally binding if individually
agreed upon.
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP,
CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD,
MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine,
PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,
ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at
www.tdk-electronics.tdk.com/trademarks.
Release 2018-10
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