B82464Z4682M

SMT Power Inductors Series/Type: B82464Z4 The following products presented in this data sheet are being withdrawn. Ordering Code Substitute Product Date of Withdrawal B82464Z4821M000 B82464Z4684M000 B82464Z4683M000 B82464G*, B82464P* B82464G*, B82464P* B82464G*, B82464P* 2010-07-23 2010-07-23 2010-07-23 Deadline Last Orders 2010-10-31 2010-10-31 2010-10-31 Last Shipments 2011-01-31 2011-01-31 2011-01-31 Ordering Code Substitute Product Date of Withdrawal B82464Z4682M000 B82464Z4474M000 B82464Z4473M000 B82464Z4472M000 B82464Z4334M000 B82464Z4333M000 B82464Z4332M000 B82464Z4224M000 B82464Z4223M000 B82464Z4222M000 B82464Z4154M000 B82464Z4153M000 B82464Z4152M000 B82464Z4105M000 B82464Z4104M000 B82464Z4103M000 B82464Z4102M000 B82464G*, B82464G*, B82464G*, B82464G*, B82464G*, B82464G*, B82464G*, B82464G*, B82464G*, B82464G*, B82464G*, B82464G*, B82464G*, B82464G*, B82464G*, B82464G*, B82464G*, 2010-07-23 2010-07-23 2010-07-23 2010-07-23 2010-07-23 2010-07-23 2010-07-23 2010-07-23 2010-07-23 2010-07-23 2010-07-23 2010-07-23 2010-07-23 2010-07-23 2010-07-23 2010-07-23 2010-07-23 B82464P* B82464P* B82464P* B82464P* B82464P* B82464P* B82464P* B82464P* B82464P* B82464P* B82464P* B82464P* B82464P* B82464P* B82464P* B82464P* B82464P* Deadline Last Orders 2010-10-31 2010-10-31 2010-10-31 2010-10-31 2010-10-31 2010-10-31 2010-10-31 2010-10-31 2010-10-31 2010-10-31 2010-10-31 2010-10-31 2010-10-31 2010-10-31 2010-10-31 2010-10-31 2010-10-31 Last Shipments 2011-01-31 2011-01-31 2011-01-31 2011-01-31 2011-01-31 2011-01-31 2011-01-31 2011-01-31 2011-01-31 2011-01-31 2011-01-31 2011-01-31 2011-01-31 2011-01-31 2011-01-31 2011-01-31 2011-01-31 For further information please contact your nearest EPCOS sales office, which will also support you in selecting a suitable substitute. The addresses of our worldwide sales network are presented at www.epcos.com/sales. SMT power inductors B82464Z4 Size 10.4 × 10.4 × 4.8 (mm) Rated inductance 0.82 µH to 1000 µH Rated current 0.34 A to 7.6 A Construction ■ ■ ■ ■ Ferrite core Magnetically shielded Winding: enamel copper wire Winding welded to terminals Features ■ ■ ■ ■ ■ Temperature range up to 125 °C High rated current Low DC resistance Suitable for lead-free reflow soldering RoHS-compatibel Applications ■ ■ ■ ■ ■ Filtering of supply voltages Coupling, decoupling DC/DC converters Telecom, EDP, consumer electronics Industrial electronics Terminals ■ Base material CuSn6P ■ Layer composition Ni, Sn (lead-free) ■ Electro-plated Marking ■ Marking on component: Manufacturer, L value (µH, coded), manufacturing date (YWWD) ■ Minimum data on reel: Manufacturer, ordering code, L value, quantity, date of packing Delivery mode and packing unit ■ 24-mm blister tape, wound on 330-mm ∅ reel ■ Packing unit: 750 pcs./reel Please read Cautions and warnings and Important notes at the end of this document. 2 03/08 SMT power inductors B82464Z4 Size 10.4 × 10.4 × 4.8 (mm) Dimensional drawing and layout recommendation 3.6 1) 3±0.1 1) 2.7 2.7 11 2±0.2 4.8 max. IND0474-K 0.1 10±0.2 10.4 max. Marking 10.4 max. Dimensions in mm 1) Soldering area IND0603-T-E Taping and packing Reel 21±0.5 4±0.1 2±0.05 4.1 2.5±0.5 13±0.2 24±0.3 75±1 1.0 10.4±0.1 0.5±0.05 _0 1.5 +0.1 11.5±0.1 1.75±0.1 Blister tape 330±1 30.4 max. IND0348-6 5.3±0.1 1.5 10.4±0.1 Component 16±0.1 Direction of unreeling IND0911-L-E Dimensions in mm Please read Cautions and warnings and Important notes at the end of this document. 3 03/08 SMT power inductors B82464Z4 Size 10.4 × 10.4 × 4.8 (mm) Technical data and measuring conditions Rated inductance LR Measured with LCR meter Agilent 4284A at frequency fL, 0.1 V, 20 °C Rated temperature TR 85 °C Rated current IR Max. permissible DC with temperature increase of ≤ 40 K at rated temperature Saturation current Isat Max. permissible DC with inductance decrease ∆L/L0 of approx. 10% DC resistance Rmax Measured at 20 °C Solderability (lead-free) Dip and look method Sn95.5Ag3.8Cu0.7: (245 ±5) °C, (5 ±0.3) s, Wetting of soldering area ≥ 90% (based on IEC 60068-2-58) Resistance to soldering heat 260 °C, 10 s (as referenced in JEDEC J-STD 020C) Climatic category 55/125/56 (to IEC 60068-1) Storage conditions Mounted: –55 °C … +125 °C Packaged: –25 °C … +40 °C, ≤ 75% RH Weight Approx. 2 g Please read Cautions and warnings and Important notes at the end of this document. 4 03/08 SMT power inductors B82464Z4 Size 10.4 × 10.4 × 4.8 (mm) Characteristics and ordering codes LR Tolerance fL IR Isat Rmax A A Ω M 0.1 7.60 10.3 0.007 B82464Z4821M000 1.0 0.1 7.50 10.0 0.007 B82464Z4102M000 1.5 0.1 7.00 8.50 0.009 B82464Z4152M000 2.2 0.1 6.50 7.00 0.010 B82464Z4222M000 3.3 0.1 5.50 5.90 0.012 B82464Z4332M000 4.7 0.1 4.90 5.20 0.015 B82464Z4472M000 6.8 0.1 4.30 4.60 0.020 B82464Z4682M000 10 0.1 3.40 3.50 0.030 B82464Z4103M000 15 0.1 2.75 3.10 0.040 B82464Z4153M000 22 0.1 2.25 2.50 0.052 B82464Z4223M000 33 0.1 1.85 2.10 0.075 B82464Z4333M000 47 0.1 1.55 1.80 0.095 B82464Z4473M000 68 0.1 1.30 1.45 0.13 B82464Z4683M000 100 0.1 1.05 1.15 0.22 B82464Z4104M000 150 0.1 0.85 0.90 0.32 B82464Z4154M000 220 0.1 0.70 0.75 0.44 B82464Z4224M000 330 0.1 0.59 0.65 0.65 B82464Z4334M000 470 0.1 0.50 0.55 0.93 B82464Z4474M000 680 0.1 0.42 0.46 1.30 B82464Z4684M000 1000 0.1 0.34 0.35 2.20 B82464Z4105M000 µH MHz 0.82 ±20% ^ Please read Cautions and warnings and Important notes at the end of this document. 5 03/08 Ordering code SMT power inductors B82464Z4 Size 10.4 × 10.4 × 4.8 (mm) Current derating Iop/IR versus ambient temperature TA (rated temperature TR = 85 °C) IND0508-Z 1.2 I op IR 1.0 0.8 0.6 0.4 0.2 0 0 20 40 60 80 100 120 ˚C 150 TA 6 03/08 Cautions and warnings ■ Please note the recommendations in our Inductors data book (latest edition) and in the data sheets. – Particular attention should be paid to the derating curves given there. – The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing. ■ If the components are to be washed varnished it is necessary to check whether the washing varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation. ■ The following points must be observed if the components are potted in customer applications: – Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core or plastic housing mechanically. – It is necessary to check whether the potting material used attacks or destroys the wire insulation, plastics or glue. – The effect of the potting material can change the high-frequency behaviour of the components. ■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core. ■ Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer. Please read Cautions and warnings and Important notes at the end of this document. 7 03/08 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms of Delivery for Products and Services in the Electrical Industry” published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP, MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. 8 03/09