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B82469G1472M000

B82469G1472M000

  • 厂商:

    EPCOS

  • 封装:

  • 描述:

    B82469G1472M000 - SMT power inductors - EPCOS

  • 详情介绍
  • 数据手册
  • 价格&库存
B82469G1472M000 数据手册
SMT power inductors Low profile Size 3.8 x 3.6 x 1.2 (mm) Series/Type: B82469G1 February 2008 7f…fÁRspp… Date: © EPCOS AG 2008. Reproduction, publication and dissemination of this publication and the information contained therein without EPCOS’ prior express consent is prohibited. SMT power inductors Size 3.8 s 3.6 s 1.2 (mm) Preliminary data Rated inductance 0.39 NH to 22 NH Rated current 0.53 A to 2.8 A Construction ■ ■ ■ ■ B82469G1 Magnetically shielded Special ferrite core shape Winding: enamel copper wire Winding welded to terminals Features ■ ■ ■ ■ ■ Low profile High rated current Low DC resistance Suitable for lead-free reflow soldering RoHS-compatible Applications ■ ■ ■ ■ ■ ■ Filtering of supply voltages Coupling, decoupling DC/DC converters Handheld devices EDP (Electronic Data Processing) Consumer electronics Terminals ■ Base material CuSn6P ■ Layer composition Ni, Sn (lead-free) ■ Electro-plated Marking ■ Marking on component: To be definded ■ Minimum data on reel: Manufacturer, ordering code, L value, quantity, date of packing Delivery mode and packing unit ■ 12-mm blister tape, wound on 180-mm ∅ reel ■ Packing unit: 1000 pcs./reel Please read C autions and warnings and I mportant notes at the end of this document. 2 02/08 SMT power inductors Size 3.8 s 3.6 s 1.2 (mm) Preliminary data Dimensional drawing and layout recommendation 1.7±0.1 1.2±0.1 1) B82469G1 2.3±0.11) 1.7±0.1 2.3±0.11) 1.5 4.7 IND0841-C 1.1±0.11) 1.2 max. 3.6±0.2 3.8±0.2 1) Soldering area 0.3±0.1 1) Dimensions in mm IND0840-Z-E Taping and packing Blister tape 1.75±0.1 5.5±0.05 Reel 13±0.5 0.3±0.05 1.5+0.1 2±0.05 4±0.11) 3.8 _ 0.1 12 +0.3 4.1±0.05 5.2 max. 12.5±0.1 16.5±1 60±0.5 2±0.5 178 IND0397-K 0.1 min. 1.3±0.05 8±0.1 1.5+0.1 Direction of unreeling 1) Limit tolerance over 10 pitches ±0.2 IND0833-N-E Dimensions in mm Please read C autions and warnings and I mportant notes at the end of this document. 3 02/08 SMT power inductors Size 3.8 s 3.6 s 1.2 (mm) Preliminary data Technical data and measuring conditions Rated inductance LR Rated temperature TR Rated current IR Saturation current Isat,typ DC resistance Rtyp Solderability (lead-free) B82469G1 Measured with LCR meter Agilent 4284A at frequency fL, 0.1 V, 20 °C 85 °C Max. permissible DC with temperature increase of ≤ 40 K at rated temperature Max. permissible DC with inductance decrease ΔL/L0 of approx. 30%, typical values Measured at 20 °C, typical values Dip and look methode Sn95.5Ag3.8Cu0.7: (245 ±5) °C, (3 ±0.3) s Wetting of soldering area ≥ 90% (based on IEC 60068-2-58) 260 °C, 10 s (based on IEC 60068-2-58) 55/125/56 (to IEC 60068-1) Mounted: –55 °C … +125 °C Packaged: –25 °C … +40 °C, ≤ 75% RH Approx. 0.2 g Resistance to soldering heat Climatic category Storage conditions Weight Characteristics and ordering codes LR μH 0.39 0.91 1.5 2.2 3.3 4.7 6.8 10 15 22 ±20% ^ Tolerance fL MHz M 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 IR A 2.80 2.00 1.70 1.55 1.30 1.20 0.90 0.80 0.60 0.53 Isat,typ A 3.00 1.95 1.55 1.33 1.10 1.00 0.80 0.66 0.57 0.45 Rtyp Ω 0.016 0.033 0.046 0.065 0.085 0.13 0.17 0.27 0.37 0.53 Ordering code B82469G1391M000 B82469G1911M000 B82469G1152M000 B82469G1222M000 B82469G1332M000 B82469G1472M000 B82469G1682M000 B82469G1103M000 B82469G1153M000 B82469G1223M000 Please read C autions and warnings and I mportant notes at the end of this document. 4 02/08 SMT power inductors Size 3.8 s 3.6 s 1.2 (mm) Preliminary data Current derating Iop/IR versus ambient temperature TA (rated temperature TR = 85 °C) 1.2 I op IR IND0508-Z B82469G1 1.0 0.8 0.6 0.4 0.2 0 0 20 40 60 80 100 120 ˚C 150 TA Please read Cautions and warnings and Important notes at the end of this document. 5 02/08 SMT power inductors Size 3.8 s 3.6 s 1.2 (mm) Preliminary data Cautions and warnings B82469G1 ■ Please note the recommendations in our data book “Chokes and Inductors” (latest edition). – Particular attention should be paid to the derating curves given there. – The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing. ■ If the components are to be washed varnished it is necessary to check whether any washing var- nish agent that is used has an negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation. ■ The following points must be observed if the components are potted in customer applications: – Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core mechanically. – It is necessary to check whether the potting material used attacks or destroys the wire insulation, plastics or glue. – The effect of the potting material can change the high-frequency behaviour of the components. ■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core. Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer. Please read C autions and warnings and I mportant notes at the end of this document. 6 02/08 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of passive electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of a passive electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of a passive electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms of Delivery for Products and Services in the Electrical Industry” published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSSP, DSSP, MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. 7 02/08
B82469G1472M000
### 物料型号 - 型号:B82469G1

### 器件简介 - 尺寸:3.8 x 3.6 x 1.2 mm - 特点:低轮廓、高额定电流、低直流电阻、适合无铅回流焊接、RoHS兼容

### 引脚分配 - 引脚材料:CuSn6P(基材),Ni, Sn(无铅层) - 电镀:电镀

### 参数特性 - 额定电流:0.53 A至2.8 A - 额定电感:0.39H至22H - 饱和电流Isattyp:最大允许直流电,电感下降约30%的典型值 - 直流电阻Rtyp:20°C时测量的典型值 - 焊接性(无铅):浸焊法,焊料Sn95.5Ag3.8Cu0.7:245±5°C,3±0.3秒,焊接区域润湿度≥90%(基于IEC 60068-2-58) - 耐焊热性:260°C,10秒(基于IEC 60068-2-58)

### 功能详解 - 应用:供电电压过滤、耦合、去耦、DC/DC转换器、手持设备、电子数据处理、消费电子 - 构造:磁屏蔽、特殊铁氧体核心形状、漆包铜线绕制、绕组焊接到端子

### 应用信息 - 应用领域:供电电压过滤、耦合、去耦、DC/DC转换器、手持设备、电子数据处理、消费电子

### 封装信息 - 封装尺寸:3.8 x 3.6 x 1.2 mm - 包装方式:12-mm泡罩胶带,绕在180-mm直径的卷轴上,每卷1000件
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