B82476B1103M100

SMT power inductors Size 12.95 x 9.40 x 5.08 Series/Type: B82476B1xxxM100 Date: Version: June 2013 Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the table and then change the color to "white". This ensures that the table disappears (invisible) for the customer PDF. Don't change formatting when entering or pasting text in the table and don't add any cell or line in and to it! Identification/Classification 1 (header 1 + top left bar): SMT power inductors Identification/Classification 2 (header 2 + bottom left header bar): Size 12.95 x 9.40 x 5.08 Ordering code: (top right header bar) B82476B1xxxM100 Series/Type: (top right header bar) Preliminary data (optional): (if necessary) Department: MAG IN PD  EPCOS AG 2015. Reproduction, publication and dissemination of this publication, enclosures hereto and the information Date: June 2013 contained therein without EPCOS' prior express consent is prohibited. Version: EPCOS AG is a TDK Group Company. 5 SMT power inductors Size 12.95 x 9.40 x 5.08mm B82476B1xxxM100 Rated inductance 1 ... 1000 µH Construction ■ Ferrite core ■ Winding: enamel copper wire ■ Winding soldered to terminals ■ Rugged design with plastic terminal carrier Features ■ Temperature range up to +150 °C ■ High rated current ■ Low DC resistance ■ Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020D ■ Qualified to AEC-Q200 ■ RoHS-compatible Applications ■ Filtering of supply voltages ■ Coupling, decoupling ■ DC/DC converters ■ Automotive electronics ■ Industrial electronics ■ Consumer electronics Terminals ■ Base material CuSn6P ■ Layer structure Ni, Sn (lead-free) ■ Electro-plated Marking Marking on component: Manufacturer, L value (in µH), date code Minimum data on reel: Manufacturer, part number, ordering code, L value and tolerance quantity, date of packing Delivery mode and packaging unit ■ 24-mm blister tape, reel packing ■ Packaging quantity: 750 pcs./reel MAG IN PD Please read Cautions and warnings and Important notes at the end of this document. June 2013 Page 2 of 7 SMT power inductors Size 12.95 x 9.40 x 5.08mm B82476B1xxxM100 Dimensional drawing and layout recommendation Dimensions in mm Component tolerances ±0.2mm unless otherwise noted Taping and packing Blister tape Reel Dimensions in mm MAG IN PD Please read Cautions and warnings and Important notes at the end of this document. June 2013 Page 3 of 7 SMT power inductors Size 12.95 x 9.40 x 5.08mm B82476B1xxxM100 Technical data and measuring conditions Measured with LCR meter Agilent 4284A at frequency fL, 0.1 V Rated inductance LR Operating temperature range -55 °C .. +150 °C Rated current IR Max. permissible DC with temperature increase of ≤40 K at +20 °C Saturation current ISat Max. permissible DC with inductance decrease ∆L/L0 of approx. 10%, DC resistance Rtyp Measured at +20 °C Solderability (lead-free) Dip and look method Sn95.5Ag3.8Cu0.7: +(245 5) °C, (3 0.3) s Wetting of soldering area 90% (based on IEC 60068-2-58) Resistance to soldering heat +260 °C, 40 s (as referenced in JEDEC J-STD 020D) Climatic category 55/150/56 (to IEC 60068-1) Storage conditions Mounted: –55 °C … +150 °C Packaged: –25 °C … +40 °C, ≤75% RH Weight Approx. 2 g Characteristics and ordering codes LR µH 1.0 1.5 2.2 3.3 4.7 6.8 10 15 22 33 47 68 100 150 220 330 470 680 1000 Tolerance 20% = M fL IR MHz A 7.50 6.90 6.70 5.90 5.30 4.80 4.30 3.40 2.95 0.1 2.30 1.95 1.65 1.40 1.10 0.88 0.65 0.55 0.43 0.33 Isat,min Isat,typ A A 12.5 9.0 10.0 8.0 8.00 7.0 6.80 6.4 5.60 5.4 4.90 4.6 4.25 3.8 3.40 3.0 2.80 2.6 2.15 2.0 2.05 1.6 1.65 1.4 1.2 1.35 1.15 1.0 0.88 0.8 0.67 0.6 0.56 0.5 0.46 0.4 0.42 0.3 Rmax Ω 0.0080 0.0090 0.0105 0.0135 0.0165 0.0210 0.0270 0.0400 0.0500 0.0880 0.120 0.160 0.230 0.330 0.530 0.810 1.100 1.600 2.150 MAG IN PD Please read Cautions and warnings and Important notes at the end of this document. Rtyp Ω 0.0060 0.0070 0.0090 0.0115 0.0145 0.0190 0.0245 0.0350 0.0450 0.0810 0.110 0.150 0.215 0.305 0.480 0.730 1.010 1.500 1.950 Ordering code B82476B1102M100 B82476B1152M100 B82476B1222M100 B82476B1332M100 B82476B1472M100 B82476B1682M100 B82476B1103M100 B82476B1153M100 B82476B1223M100 B82476B1333M100 B82476B1473M100 B82476B1683M100 B82476B1104M100 B82476B1154M100 B82476B1224M100 B82476B1334M100 B82476B1474M100 B82476B1684M100 B82476B1105M100 June 2013 Page 4 of 7 SMT power inductors Size 12.95 x 9.40 x 5.08mm B82476B1xxxM100 Typical curves: Inductance vs. DC superposition measured with LCR meter Agilent 4284A at Ta=20 °C 10µH 1µH 1.25 12.5 10.0 0.75 L / µH L / µH 1.00 0.50 0.25 7.5 5.0 2.5 0.00 0 2000 4000 6000 8000 10000 12000 14000 16000 18000 20000 0.0 0 1000 2000 Idc [mA] 3000 4000 5000 6000 7000 600 700 Idc [mA] 100µH 1000µH 1250 125 1000 L / µH L / µH 100 75 750 500 50 250 25 0 0 0 250 500 750 1000 1250 1500 1750 2000 2250 2500 0 100 200 300 400 500 Idc [mA] Idc [mA] Current derating versus ambient temperature MAG IN PD Please read Cautions and warnings and Important notes at the end of this document. June 2013 Page 5 of 7 SMT power inductors Size 12.95 x 9.40 x 5.08mm B82476B1xxxM100 Cautions and warnings ■ Please note the recommendations in our Inductors data book (latest edition) and in the data sheets. – Particular attention should be paid to the derating curves given there. – The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing. ■ If the components are to be washed varnished it is necessary to check whether the washing varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation. ■ The following points must be observed if the components are potted in customer applications: – Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core or plastic housing mechanically. – It is necessary to check whether the potting material used attacks or destroys the wire insulation, plastics or glue. – The effect of the potting material can change the high-frequecy behaviour of the components. ■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core. ■ Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer. MAG IN PD Please read Cautions and warnings and Important notes at the end of this document. June 2013 Page 6 of 7 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and Conditions of Supply. 7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can and will be implemented in our Quality Management System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.tdkelectronics.tdk.com/trademarks. Release 2018-10 Page 7 of 7