B82477D4103M900

SMT power inductors Size 12.5 u 12.5 u 8.5 (mm) Series/Type: B82477D4*M900 Date: May 2020 Data Sheet ¤TDK Electronics AG 2020. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics’ prior express consent is prohibited. SMT power inductors B82477D4*M900 Size 12.5 x 12.5 x 8.5 (mm) Rated inductance 2.0 ... 100 μH Rated current 1.61 ... 6.22 A Construction ■ ■ ■ ■ ■ Ferrite core Magnetically shielded Winding: Enamel copper wire Winding welded to terminals Special winding technology for low stray inductance Features Temperature range up to +150 °C High rated current Low DC resistance Tight coupling, coupling factor typically 99% Functional isolation up to 500 V Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020D ■ Qualified to AEC-Q200 ■ RoHS-compatible ■ ■ ■ ■ ■ ■ Applications ■ ■ ■ ■ Common-mode choke SEPIC matching circuit DC/DC converters 1:1 transformers Terminals ■ Base material CuSn6P ■ Lead-finish Sn (lead-free) ■ Electro-plated Marking ■ Marking on component: Manufacturer, L value (μH, coded), date of manufacture (YWWD), two last digits of production order, dot for Pin1 identification ■ Minimum data on reel: Manufacturer, ordering code, L value, quantity, date of packing Delivery mode and packing unit ■ 24-mm blister tape, wound on 330-mm ‡ reel ■ Packing unit: 350 pcs./reel Please read Cautions and warnings and Important notes at the end of this document. 2 05/20 SMT power inductors B82477D4*M900 Size 12.5 x 12.5 x 8.5 (mm) Dimensional drawing and layout recommendation Dimensions in mm Taping and packing Blister tape Reel Dimensions in mm Please read Cautions and warnings and Important notes at the end of this document. 3 05/20 SMT power inductors B82477D4*M900 Size 12.5 x 12.5 x 8.5 (mm) Technical data and measuring conditions Rated inductance L1, L2 Measured with LCR meter Agilent 4284A or equivalent at frequency fL, 0.1 V, +20 °C Leakage or stray inductance LS Test L1-3 (short 2 + 4): measured with LCR meter Agilent 4284A or equivalent at frequency fL, 0.1 V, +20 °C Coupling factor Ktyp Coupling in between the 2 windings Operating temperature range –55 °C … +150 °C Rated current IR Max. permissible DC with temperature increase of d 40 K (to IEC 62024-2) Saturation current Isat Max. permissible DC with inductance decrease 'L/L0 of approx. 10% DC resistance R1,max, R2,max Measured at +20 °C Isolation (functional) Tested with 500 V for 0.4 s at 100%, 3 s during qualification Solderability (lead-free) Dip and look method Sn95.5Ag3.8Cu0.7: +(245 ±5) °C, (5 +0/-0.5) s Wetting of soldering area t 90% (based on IEC 60068-2-58) Resistance to soldering heat As referenced in JEDEC J-STD 020D Climatic category 55/150/56 (to IEC 60068-1) Storage conditions Mounted: –55 °C … +150 °C Packaged: –25 °C … +40 °C, d 75% RH Weight Approx. 4 g Please read Cautions and warnings and Important notes at the end of this document. 4 05/20 SMT power inductors B82477D4*M900 Size 12.5 x 12.5 x 8.5 (mm) Characteristics and ordering codes LR LS,typ Ktyp Tolerance fL μH μH % 2.0 0.20 94.9 r20% 3.0 0.25 Isat,typ Isat,min IR MHz A R1,2,max R1,2,typ Ordering code A A : : M 0.1 15.0 13.0 6.22 0.020 0.0165 B82477D4202M900 95.7 0.1 12.0 10.25 5.84 0.022 0.0181 B82477D4302M900 4.7 0.25 97.3 0.1 10.0 8.75 5.24 0.026 0.0232 B82477D4472M900 6.8 0.25 98.1 0.1 8.25 7.25 4.75 0.035 0.0285 B82477D4682M900 ^ 10 0.25 98.7 0.1 6.50 5.75 4.54 0.042 0.0355 B82477D4103M900 15 0.30 99.0 0.1 5.50 4.80 3.70 0.060 0.0475 B82477D4153M900 22 0.30 99.3 0.1 4.50 4.00 3.11 0.078 0.0670 B82477D4223M900 33 0.35 99.5 0.1 3.80 3.30 2.68 0.110 0.0904 B82477D4333M900 47 0.45 99.5 0.1 3.30 3.10 2.44 0.145 0.109 B82477D4473M900 68 0.50 99.6 0.1 2.50 2.30 1.89 0.215 0.180 B82477D4683M900 100 0.60 99.7 0.1 2.20 2.00 1.61 0.280 0.250 B82477D4104M900 Inductance is per winding. When leads are connected in parallel, inductance LR is the same value. When leads are connected in series, inductance LR is four times the value.  R1 u R2  DCR is for each winding. When leads are connected in parallel, DCR = ----------------------- R1 + R2  . When leads are connected in series, DCR is R1+R2. Isat ist the current flowing through one winding. When leads are connected in parallel, Isat is the same. When leads are connected in series, Isat is half the value. IR is the total current through both windings I1 and I2 can be calculated like this: I12 + I22 = IR2 Please read Cautions and warnings and Important notes at the end of this document. 5 05/20 SMT power inductors B82477D4*M900 Size 12.5 x 12.5 x 8.5 (mm) Current derating Iop/IR versus ambient temperature TA Please read Cautions and warnings and Important notes at the end of this document. 6 05/20 Cautions and warnings ■ Please note the recommendations in our Inductors data book (latest edition) and in the data sheets. – Particular attention should be paid to the derating curves given there. – The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing. ■ If the components are to be washed varnished it is necessary to check whether the washing varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation. Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. ■ The following points must be observed if the components are potted in customer applications: – Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core or plastic housing mechanically. – It is necessary to check whether the potting material used attacks or destroys the wire, wire insulation, plastics or glue. – The effect of the potting material can change the high-frequency behaviour of the components. – Many coating materials have a negative effect (chemically and mechanically) on the winding wires, insulation materials and connecting points. Customers are always obligated to determine whether and to what extent their coating materials influence the component. Customers are responsible and bear all risk for the use of the coating material. TDK Electronics does not assume any liability for failures of our components that are caused by the coating material. ■ Ceramics / Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core. ■ Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer. Display of ordering codes for TDK Electronics products The ordering code for one and the same product can be represented differently in data sheets, data books, other publications, on the company website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes. Please read Cautions and warnings and Important notes at the end of this document. 7 05/20 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and Conditions of Supply. 8 05/20 Important notes 7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can and will be implemented in our Quality Management System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. Release 2020-05 9 05/20