SMT inductors
SIMID series, SIMID 0805-F
Series/Type:
B82498F
Date:
September 2019
a~í~=pÜÉÉí
¤TDK Electronics AG 2019. Reproduction, publication and dissemination of this publication, enclosures hereto
and the information contained therein without TDK Electronics’ prior express consent is prohibited.
SMT inductors, SIMID series
B82498F
SIMID 0805-F
Size 0805 (EIA) and/or 2012 (IEC)
Rated inductance 2.7 ... 6800 nH
Rated current 80 ... 1000 mA
Construction
■ Cubic coil with ceramic or ferrite core
■ Epoxy-molded flat top for vacuum pickup
■ Winding ends welded to terminals
Features
■
■
■
■
High resonance frequency
Narrow inductance tolerance
Suitable for lead-free reflow soldering
RoHS-compatible
Applications
Resonant circuits, impedance matching for
■ Antenna amplifiers
■ Multimedia
■ Wireless communication systems
Terminals
■ Base material Al2O3 ceramic and ferrite
■ Thick-film coating of Ag/Pd/Pt
Marking
■ No marking on component
■ Minimum data on reel:
Manufacturer, ordering code, L value, quantity, date of packing
Delivery mode and packing unit
■ 8-mm blister tape, wound on 180-mm reel
■ Packing unit: 3000 pcs./reel
Please read Cautions and warnings and
Important notes at the end of this document.
2
09/19
SMT inductors, SIMID series
B82498F
SIMID 0805-F
Dimensional drawing and layout recommendation
A
B
C
1.5 r0.2
3.2 r0.4
1.0 r0.1
Dimensions in mm
Taping and packing
Blister tape
Reel
Dimensions in mm
Please read Cautions and warnings and
Important notes at the end of this document.
3
09/19
SMT inductors, SIMID series
B82498F
SIMID 0805-F
Technical data and measuring conditions
Rated inductance LR
Measured with impedance analyzer Agilent E4991A
or equivalent at frequency fL, 0.1 V, +20 °C
Q factor Qmin
Measured with impedance analyzer Agilent E4991A
or equivalent at frequency fQ, +20 °C
Rated temperature TR
+105 qC
Rated current IR
Maximum permissible DC with inductance decrease
'L/L0 d 10% and temperature increase
of d 20 K at rated temperature
Self-resonance frequency fres,min
Measured with network analyzer Agilent E8362B
and/or Agilent E4991A or equivalent, +20 °C
DC resistance Rmax
Measured at +20 °C
Solderability (lead-free)
Sn95.5Ag3.8Cu0.7: +(245 r5) °C, (5 r0.3) s
Wetting of soldering area t 90%
(based on IEC 60068-2-58)
Resistance to soldering heat
+260 qC, 20 s
Climatic category
55/125/56 (to IEC 60068-1)
Storage conditions
Mounted: 55 °C … +125 °C
Packaged: 25 °C … +40 °C, d 75% RH
Weight
Approx. 10 mg
Please read Cautions and warnings and
Important notes at the end of this document.
4
09/19
SMT inductors, SIMID series
B82498F
SIMID 0805-F
Characteristics and ordering codes
Tolerance
LR
nH
IR
Rmax
fres,min
MHz
mA
:
MHz
50
1500
1000
0.03
9000
B82498F3279K000
250
250
250
250
50
50
50
50
1000
1000
1000
500
900
800
700
700
0.04
0.05
0.09
0.09
7000
6000
5000
5000
B82498F3569K000
B82498F3689K000
B82498F3829K000
B82498F3100+000
250
250
250
50
50
60
500
500
500
700
650
700
0.09
0.13
0.08
4000
3300
3300
B82498F3120+000
B82498F3150+000
B82498F3180+000
250
250
250
60
60
65
500
500
500
700
700
600
0.08
0.09
0.11
2500
2500
2200
B82498F3220+000
B82498F3270+000
B82498F3330+000
250
200
200
65
65
60
500
500
500
600
600
600
0.12
0.13
0.14
2100
2000
1700
B82498F3390+000
B82498F3470+000
B82498F3560+000
200
150
150
60
60
55
500
500
500
500
500
450
0.18
0.19
0.28
1600
1500
1350
B82498F3680+000
B82498F3820+000
B82498F3101+000
150
100
100
50
45
45
250
250
250
440
400
340
0.31
0.42
0.53
1250
1150
1050
B82498F3121+000
B82498F3151+000
B82498F3181+000
100
100
100
45
45
45
250
250
250
320
270
220
0.70
1.0
1.5
950
900
800
B82498F3221+000
B82498F3271+000
B82498F3331+000
100
50
25
40
30
23
250
100
50
210
190
230
1.6
1.9
1.3
700
650
400
B82498F3391+000
B82498F3471+000
B82498F3561+000
25
25
23
23
50
50
190
180
1.7
1.9
300
300
B82498F3681+000
B82498F3821+000
Core material: ceramic
r10% ^ K
250
2.7
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
Qmin
MHz
5.6
6.8
8.2
r2%
r5%
^
^
G
J
Ordering code1)
fQ
fL
1) Replace the + by the code letter for the required inductance tolerance.
Please read Cautions and warnings and
Important notes at the end of this document.
5
09/19
SMT inductors, SIMID series
B82498F
SIMID 0805-F
Characteristics and ordering codes
LR
Tolerance
nH
fL
Qmin
MHz
fQ
IR
Rmax
fres,min
MHz
mA
:
MHz
Ordering code
Core material: ferrite
r5%
7.96
20
7.96
240
0.55
440
B82498F1102J000
1200
7.96
20
7.96
220
0.65
420
B82498F1122J000
1500
7.96
20
7.96
200
0.70
380
B82498F1152J000
1800
7.96
20
7.96
190
0.98
350
B82498F1182J000
2200
7.96
20
7.96
130
1.60
330
B82498F1222J000
2700
7.96
20
7.96
120
2.0
270
B82498F1272J000
3300
7.96
20
7.96
100
3.3
250
B82498F1332J000
3900
7.96
20
7.96
95
3.6
230
B82498F1392J000
4700
7.96
20
7.96
90
3.8
210
B82498F1472J000
5600
7.96
20
7.96
85
4.3
180
B82498F1562J000
6800
7.96
20
7.96
80
4.7
140
B82498F1682J000
1000
^
J
Please read Cautions and warnings and
Important notes at the end of this document.
6
09/19
SMT inductors, SIMID series
B82498F
SIMID 0805-F
Impedance |Z| vs. frequency f (ceramic core)
measured with impedance analyzer
Agilent E4991A, typical values at +20 °C
Impedance |Z| vs. frequency f (ferrite core)
measured with impedance analyzer
Agilent E4991A, typical values at +20 °C
Q factor versus frequency f (ceramic core)
measured with impedance analyzer
Agilent E4991A, typical values at +20 °C
Q factor versus frequency f (ferrite core)
measured with impedance analyzer
Agilent E4991A, typical values at +20 °C
Please read Cautions and warnings and
Important notes at the end of this document.
7
09/19
SMT inductors, SIMID series
B82498F
SIMID 0805-F
Current derating Iop/IR
versus ambient temperature TA
(rated temperature TR = +105 °C)
Inductance L versus DC load current IDC
measured with RF LCR meter
Agilent 4285A, typical values at +20 °C
Please read Cautions and warnings and
Important notes at the end of this document.
8
09/19
Cautions and warnings
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire, wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
– Many coating materials have a negative effect (chemically and mechanically) on the winding
wires, insulation materials and connecting points. Customers are always obligated to
determine whether and to what extent their coating materials influence the component.
Customers are responsible and bear all risk for the use of the coating material. TDK
Electronics does not assume any liability for failures of our components that are caused by the
coating material.
■ Ceramics / ferrites are sensitive to direct impact. This can cause the core material to flake, or
lead to breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Display of ordering codes for TDK Electronics products
The ordering code for one and the same product can be represented differently in data sheets, data
books, other publications, on the company website, or in order-related documents such as shipping
notes, order confirmations and product labels. The varying representations of the ordering
codes are due to different processes employed and do not affect the specifications of the
respective products. Detailed information can be found on the Internet under
www.tdk-electronics.tdk.com/orderingcodes.
Please read Cautions and warnings and
Important notes at the end of this document.
9
09/19
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements
about the suitability of our products for a particular customer application. As a rule, we
are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to
check and decide whether a product with the properties described in the product specification is
suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current
state of the art, even if they are operated as specified. In customer applications requiring a
very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event
of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the foregoing
for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms
and Conditions of Supply.
10
09/19
Important notes
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can
and will be implemented in our Quality Management System. For clarification purposes we
like to point out that obligations from IATF 16949 shall only become legally binding if individually
agreed upon.
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP,
CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD,
MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine,
PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,
ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at
www.tdk-electronics.tdk.com/trademarks.
Release 2018-10
11
09/19