ERU chokes
ERU 27, SMT flat wire high current inductors
Series/Type:
B82559B*A027
Date:
August 2020
Data Sheet
¤TDK Electronics AG 2020. Reproduction, publication and dissemination of this publication, enclosures hereto
and the information contained therein without TDK Electronics’ prior express consent is prohibited.
ERU chokes
B82559B*A027
ERU 27
Helically wound
Rated inductance 1.0 .... 15 μH
Saturation current 22.9 ... 101.5 A
Construction
■
■
■
■
■
■
High temperature ferrite core
Magnetically shielded
Helical winding
Self-leaded construction
Under body termination
3 pins for improved reliability
Features
■
■
■
■
■
■
■
High rated current
Extremely low DC resistance
Very low profile and extremely small footprint
Suitable for pick and place processes
RoHS-compatible
Easily customized
AEC-Q200 qualified
Applications
Energy storage chokes for
■ DC-DC converters
■ VRM modules
■ POL converters
■ Solar converters
Terminals
Lead-free tinned
Marking
Manufacturer, ordering code, date of manufacture and
production place (YYWWD/X),
Delivery mode and packing units
■ Blister tape
Please read Cautions and warnings and
Important notes at the end of this document.
2
08/20
ERU chokes
B82559B*A027
ERU 27
Helically wound
Dimensional drawing and layout recommendation
Dimensions in mm
Circuit diagram
Please read Cautions and warnings and
Important notes at the end of this document.
3
08/20
ERU chokes
B82559B*A027
ERU 27
Helically wound
Taping and packing
Tape:
Dimensions in mm
Reel:
Dimensions in mm
Height (mm)
component h cavity H (blister tape)
nom.
max.
Packing unit
pcs. per reel
11.9
13.4
100
13.5
15.0
90
14.6
16.4
80
14.9
16.4
80
15.8
17.3
75
16.9
18.4
65
Please read Cautions and warnings and
Important notes at the end of this document.
4
08/20
ERU chokes
B82559B*A027
ERU 27
Helically wound
Technical data and measuring conditions
Rated inductance LR
Measured at 100 kHz, 0.1 V, +25 °C
Inductance tolerance
r10%
Saturation current ISat
Current that will result in an approximately 20% drop in
the inductance values at the specified temperature
Rated current IR
Current that will cause a '40 K self-heating at room
temperature
DC resistance RDC
Measured at +25 °C, tolerance r10%, typical values
Self-resonant frequency
! 2 MHz
High voltage: N1 - core
200 V DC, 1 s
Solderability
(test of wettability of the pins)
(245 r5) °C, (3 r0.3) s,
wetting of soldering area t95%
(based on IEC 60068-2-58, solder bath method)
Resistance to soldering heat
To JEDEC J-STD 020D (Tc: +245 °C on pin)
Operating temperature
40 °C … +150 °C (component)
Storage conditions (packaged)
–25 °C … +40 °C, d75% RH
Characteristics and ordering codes
LR
Isat, 25°C
Isat, 100°C IR
RDC (typ)
Height h Approx. Ordering code
(nom.) weight
PH
A
A
A
m:
mm
g
1.0
101.5
87.0
52.0
0.46
11.9
27.1
B82559B2102A027
1.5
67.0
59.5
52.5
0.46
11.9
27.4
B82559B2152A027
2.2
68.0
58.5
46.5
0.68
13.5
31.5
B82559B3222A027
3.3
60.3
51.3
42.5
0.88
14.9
35.4
B82559B4332A027
4.7
53.5
45.5
37.0
1.39
14.6
35.3
B82559B5472A027
6.8
44.0
37.2
34.5
1.66
15.8
38.2
B82559B6682A027
10.0
34.8
29.7
33.0
1.92
16.9
41.7
B82559B7103A027
15.0
22.9
19.4
33.0
1.92
16.9
42.0
B82559B7153A027
Please read Cautions and warnings and
Important notes at the end of this document.
5
08/20
ERU chokes
B82559B*A027
ERU 27
Helically wound
Inductance L versus DC load current IDC
The temperature rise 'T is measured at an ambient temperature of +25 °C. A current is applied
for 30 minutes and the temperature is measured
on top of the inductor which is monted on a printed circuit board. No forced air cooling is applied.
B82559B2102A0127
The inductance vs current curves are generated
by measuring the inductors at +25 °C and
+100 °C.
B82559B2152A027
Please read Cautions and warnings and
Important notes at the end of this document.
B82559B3222A027
6
08/20
ERU chokes
B82559B*A027
ERU 27
Helically wound
B82559B4332A027
B82559B5472A0127
B82559B6682A027
B82559B7103A027
Please read Cautions and warnings and
Important notes at the end of this document.
7
08/20
ERU chokes
B82559B*A027
ERU 27
Helically wound
B82559B7153A027
Please read Cautions and warnings and
Important notes at the end of this document.
8
08/20
Cautions and warnings
■ Please note the recommendations in our Inductors data book (latest edition) and in the data
sheets.
– Particular attention should be paid to the derating curves given there.
– The soldering conditions should also be observed. Temperatures quoted in relation to wave
soldering refer to the pin, not the housing.
■ If the components are to be washed varnished it is necessary to check whether the washing
varnish agent that is used has a negative effect on the wire insulation, any plastics that are used,
or on glued joints. In particular, it is possible for washing varnish agent residues to have a
negative effect in the long-term on wire insulation.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
■ The following points must be observed if the components are potted in customer applications:
– Many potting materials shrink as they harden. They therefore exert a pressure on the plastic
housing or core. This pressure can have a deleterious effect on electrical properties, and in
extreme cases can damage the core or plastic housing mechanically.
– It is necessary to check whether the potting material used attacks or destroys the wire
insulation, plastics or glue.
– The effect of the potting material can change the high-frequency behaviour of the components.
■ Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to
breakage of the core.
■ Even for customer-specific products, conclusive validation of the component in the circuit can
only be carried out by the customer.
Display of ordering codes for TDK Electronics products
The ordering code for one and the same product can be represented differently in data sheets, data
books, other publications, on the company website or in order-related documents such as shipping
notes, order confirmations and product labels. The varying representations of the ordering
codes are due to different processes employed and do not affect the specifications of the
respective products. Detailed information can be found on the Internet under
www.tdk-electronics.tdk.com/orderingcodes.
Please read Cautions and warnings and
Important notes at the end of this document.
9
08/20
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements
about the suitability of our products for a particular customer application. As a rule, we
are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to
check and decide whether a product with the properties described in the product specification is
suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current
state of the art, even if they are operated as specified. In customer applications requiring a
very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event
of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the foregoing
for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms
and Conditions of Supply.
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08/20
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can
and will be implemented in our Quality Management System. For clarification purposes we
like to point out that obligations from IATF 16949 shall only become legally binding if individually
agreed upon.
8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas,
CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell,
MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap,
PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID,
SineFormer, SIOV, ThermoFuse, WindCap, XieldCap are trademarks registered or pending
in Europe and in other countries. Further information will be found on the Internet at
www.tdk-electronics.tdk.com/trademarks.
Release 2020-06
Please read Cautions and warnings and
Important notes at the end of this document.
11
08/20