F4052

Microwave Ceramics and Modules 4-Pole Filter XM Radio Filter F4052 Design Goal Features SMD filter consisting of coupled resonators with stepped impedances MgTiO3 - CaTiO3 (εr = 21/ TCf =0±10 ppm/K) with a coating of copper (10µm) and tin (>5µm) Excellent reflow solderability, no migration effect due to copper/tin metallization ESD insensitivity and ESD protecting due to filter characteristics Index Page 2 Component drawing Recommended footprint Page 3 Characteristics Maximum ratings Typical passband characteristic Page 4 Processing information Soldering requirements Delivery mode ISSUE DATE 20.08.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 1/4 Microwave Ceramics and Modules 4-Pole Filter XM Radio Filter F4052 Design Goal Component drawing View from below onto the solder terminals and view from beside Recommended footprint solder pads I/O Standard condition ISSUE DATE 20.08.04 ISSUE P1 connected to lines with an impedance of 50 Ohm FR4 material permitivity : 4.4 ground layers below footprint preferred thickness : 0.3 Vias : Ø0.3 / mm² For other thickness correlation might be necessary PUBLISHER SAW MWC PD PAGE 2/4 Microwave Ceramics and Modules 4-Pole Filter XM Radio Filter F4052 Design Goal Characteristics min. Center frequency typ. fc - max. 2338.755 - MHz 2.2 dB Passband αIL B 5.5 Amplitude ripple (peak - peak) ∆α 0.2 0.5 SWR 1.4 2.0 15 40 Insertion loss Standing wave ratio MHz Group delay in Passband Impedance Attenuation Z α at 2198.755 (fc –140MHz) at 2478.755 (fc +140MHz) 2.5 45 50 dB 50 Ω 49 54 dB dB Maximum ratings EC climatic category (IEC 68-1) - 40/+ 90/56 Operating temperature Top -20 / +80 °C Typical passband characteristic 2072 2122 2172 2222 2272 2322 2372 2422 2472 2522 2572 0 attenuation [dB] -10 -20 -30 S11 S21 -40 -50 -60 -70 frequency [MHz] ISSUE DATE 20.08.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 3/4 Microwave Ceramics and Modules 4-Pole Filter XM Radio Filter F4052 Design Goal Processing information Wettability acc. to IEC 68-2-58: ≥ 75% (after aging) Soldering Requirements Profile for eutectic SnPb solder paste Profile for leadfree solder paste Soldering type reflow Maximum soldering temperature 235 (max. 2 sec.) (measuring point on top surface of the component) 225 (max. 10 sec.) reflow 260 (max. 2 sec.) °C 250 (max. 10 sec.) °C Recommended soldering conditions (infrared): within 10 sec. Temp. [°C] within 10 sec. Temp. [°C] 245°C±5°C 215°C±10°C 20-40 sec. 30 sec. Time [sec.] 2.5 °C/s 40-80 sec. 2-3 min. Time [sec.] > - 5 °C/s Delivery mode Blister tape acc. to IEC 286-3, polyester, grey Pieces/tape: t.b.d. Note: This document is PRELIMINARY. All specifications are subject to change and are not guaranteed.  EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed. ISSUE DATE 20.08.04 ISSUE P1 PUBLISHER SAW MWC PD PAGE 4/4