Q13MC1461000400

RECIPIENT SPECIFICATIONS PRODUCT No.: Q13MC1461000400 MODEL : MC-146 SPEC. No. : Q15-031-22A DATE: Apr. 29. 2015 SEIKO EPSON CORPORATION 8548 Naka-minowa Minowa-machi Kamiina-gun Nagano-ken 399-4696 Japan SPECIFICATIONS 1. Application 1) This document is applicable to the crystal unit that are delivered t 2) RoHS compliant MC-146 contains lead in high melting type solder which is exempted in RoHS directive. 3) This Product supplied (and any technical information furnished, if any) by Seiko Epson Corporation shall not be used for the development and manufacture of weapon of mass destruction or for other military purposes. Making available such products and technology to any third party who may use such products or technologies for the said purposes are also prohibited. 4) This product listed here is designed as components or parts for electronics equipment in general consumer use. We do not expect that any of these products would be incorporated or otherwise used as a component or part for the equipment, which requires an systems, and medical equipment, the functional purpose of which is to keep extra high reliability, such as satellite, rocket and other space life. 2. Product No. / Model The product No. of this crystal unit is Q13MC1461000400. The model is MC-146. 3. Packing It is subject to the packing standard of Seiko Epson Corp. 4. Warranty Defective parts which originate with us are replaced free of charge in the case of defects being found with 12 months after delivery. 5. Amendment and/or termination Amendment and/or termination of this specification is subject to the agreement between the two parties. 6. Contents Item No. Item Page [1] Absolute maximum ratings 2 [2] Operating range 2 [3] Static characteristics 2 [4] Environmental and Mechanical characteristics 3 to 4 [5] Dimensions and Marking layout 5 to 6 [6] Notes 7 1 [ 1 ] Absolute maximum ratings Rating value No. Item 1 Storage temperature range 2 Maximum level of drive Symbol Min. T_stg - 55 Typ. GL Max. Unit + 125 °C Note Suppose to be within CI STD at + 25 °C ± 3 °C. μW 1.0 [ 2 ] Operating range Rating value No. Item 1 Operating temperature range 2 Level of drive 3 Vibration mode Symbol Min. T_use - 40 DL 0.01 Typ. 0.1 Max. Unit + 85 °C 0.5 μW Note Fundamental [ 3 ] Static characteristics No. Item Symbol Value Unit 1 Nominal Frequency f_nom 32.768 kHz 2 Frequency tolerance f_tol ± 20 × 10 3 Motional resistance R1 65 Max. kΩ 4 Motional capacitance C1 1.9 Typ. fF 5 Shunt capacitance C0 0.8 Typ. pF Turnover temperature Ti + 25 ± 5 °C 6 Frequency temperature characteristics Parabolic coefficient B - 0.04 Max. × 10-6 /°C2 IR 500 Min. MΩ f_age ±3 × 10-6/year 7 Isolation resistance 8 Frequency Aging 2 -6 Conditions CL = 9 pF Ta = + 25 ± 3 °C Level of drive : 0.1 μW Not include aging CI meter : Saunders 140B Level of drive : 0.5 μW Values are calculated by The frequencies at + 10, + 25, + 40 °C with C-MOS circuit. DC 100 V ± 15, 60 seconds Between terminal # 1 and terminal # 4 Ta = + 25 °C ± 3 °C Level of drive : 0.1 μW [ 4 ] Environmental and Mechanical characteristics No. Items Value Conditions *1*2 Δ f/f [1 × 10−6] 100 g dummy (EPSON TOYOCOM Standard) 1 Shock *3 ±5 drop from 1500 mm height on to the concrete 3 directions 10 times 10 Hz to 55 Hz amplitude 0.75 mm 2 Vibration 55 Hz to 500 Hz acceleration 98 m/s2 *3 ±3 10 Hz → 500 Hz → 10 Hz 15 min./cycle 6 h (2 hours , 3 directions) 3 Resistance to soldering heat (Reflow characteristics) 4 High temperature storage 5 Low temperature storage *3 ± 10 - 55 °C × 1 000 h 6 Temperature humidity storage *3 ± 10 + 85 °C × 85 %RH × 1000 h 7 Temperature cycle *3 ± 10 8 Shear 9 Pull-off 10 Substrate bending 11 Solderability 12 Solvent resistance Note Treat the Reflow 2 times by the following *3 ±5 *3 a ) ± 20 a ) + 125 °C × 1 000 h b ) ± 10 b ) + 85 °C × 1 000 h profile in the next page - 55 °C ↔ + 125 °C 30 minutes at each temperature 100 cycles No peeling-off at a soldered part 10 N press the side for 10 s ±1 s. Ref. IEC 60068-2-21 No peeling-off at a soldered part 10 N press the side for 10 s ±1 s. Ref. IEC 60068-2-21 No peeling-off at a soldered part Bending width reaches 3mm and hold for 5 s ± 1 s × 1 time Ref. IEC 60068-2-21 Termination must be 95 % Dip termination into solder bath at covered with fresh solder + 235 ± 5 °C for 3 s (Using rosin flux) The marking shall be legible Ref. JIS C 0052 or IEC 60068-2-45 1. *1 Each test done independently. 2. *2 Measuring 1 h to 24 h later leaving in room temperature after each test. 3. *3 Pre conditionings 1. + 125 °C × 24 h to +85 °C × 85 %RH × 48 h → reflow 2 times 2. Initial value shall be after 24 h at room temperature. 4. Shift series resistance at after above tests should be less than ± 15 % or less than ± 5 kΩ In case Resistance to soldering heat, high temperature storage (± 125 °C ×1 000 h ) shift series resistance at after above tests should be less than ± 20 % or ± 10 kΩ 3 ♦Air- reflow Pre heating temperature : Tp1～Tp2 = + 170 °C Peak temperature must not exceed + 260 °C and the duration of over + 220 °C should be 35 s T (Temperature) + 260 °C TMax. + 220 °C Tmlt Tp2 Tp1 35 s 100 s t(time) 4 [ 5 ] Dimensions and Marking layout Dimensions ＃2 0.3±0.1 0.55 0.3±0.1 1.4 ＃1 ±0.1 ＃3 0.55 ＃4 0.3±0.1 6. 9±0.1 0.3±0.1 1. 6.7 0.1±0.05 0.15 1.3±0.1 0.1±0.05 +0.15 ※1 0.4 ※1 0.４ - 0.1 0.2 0.65 0.2 +0.2 - 0.1 ＃2 ＃4 ＃3 0.25 0.2 ＃1 0.2 ※1 : Available area for soldering ※2. Metal may be exposed on the top or bottom of this product. This will not affect any quality, reliability or electrical spec. 2. Internal Connection #4 #3 #1 #2 Do not connect # 2 and # 3 terminals to any external circuits (including GND). Type MC-146 Unit 5 1 = 1 mm 3. Recommended soldering pattern 0.6 0.6 0.3 Unit : 1 = 1 mm 1.2 1.2 5.1 4. Marking layout EAED Man ufa cture d m onth S ym bol m ark M a nufa cture d yea r Nom inal Frequenc y (A : 32.7 68 kH z) Symbol of Manufacturing year Year digit 1 2 3 Marking A B C 4 5 6 7 8 9 0 D E F G H J K 5 6 7 8 9 10 11 12 E F G H J K L M Year digit(1st) of the Production Symbol of Manufacturing month Month digit 1 2 3 4 Marking A B C D ( Halide free ) ♦ The above marking layout shows only marking contents and their approximate position and it is not for font, size and exact position. Type MC-146 Unit 6 1 = 1 mm [ 6 ] Notes 1. Max two (2) times reflow is allowed. Once miss soldering is happened, hand work soldering by soldering iron is recommended. (+ 350 °C × within 5 sec.) 2. Patterning should be followed by our recommended one. 3. Applying excessive excitation force to the crystal unit may cause deterioration damage. 4. Unless adequate negative resistance is allocated in the oscillation circuit, start up time of oscillation may be increased, or no oscillation may occur. How to check the negative resistance. Rf R X’tal Cg Cd Rd (1) Connect the resistance (R) to the circuit in series with the crystal unit. (2) Adjust R so that oscillation can start (or stop). (3) Measure R when oscillation just start (or stop) in above (2). (4) Get the negative resistance -R = R + CI value. (5) Recommended -R ⏐-R⏐> CI × (5 ~ 10) 5. The shortest patterning line on board is recommendable. Too long line on board may cause of abnormal oscillation. 6. To avoid mull function, no pattern under or near the crystal is allowed. Solder paste should be more than 150 μm thickness. 7. This device must be stored at the normal temperature and humidity conditions before mounting on a board. 8. Too much exciting shock or vibration may cause deterioration on damage. Depending on the condition such as a shock in assembly machinery, the products may be damaged. Please check your condition in advance to maintain shock level to be smallest. 9. Depending on the conditions, ultrasonic cleaning may cause resonant damage of the internal crystal unit. Since we are unable to determine the conditions (type of cleaning unit, power, time, conditions inside the bath, etc.) to be used in your company, we cannot guarantee the safety of this unit when it is cleaned in an ultrasonic cleaner. 10. Ink marking may be damaged by some kind of solvent, please take precautions when choosing solvent by your selves. 11. Please refer to packing specification regarding how to storage the products in the pack. 7