Q22FA12800043

MHz Range Crystal unit · Package size (2.0 mm × 1.6 mm × 0.5 mm) · Fundamental mode · Reference weight Typ.7.0 mg Q22FA12800043xx [ 1 ] Product Number / Product Name / Marking (1-1) Product Number / Ordering Code Q22FA12800043xx Last 2 digits code(xx) defines Quantity. The standard is "18", 5 000 pcs/Reel. (1-2) Product Name / Model Name FA-128 32.000000 MHz 8.0 +10.0-10.0 #N/A [ 2 ] Absolute maximum ratings Parameter Storage temperature Operating temperature range Symbol T_stg T_use Specifications Min. -40 -40 Typ. - Max. +125 +105 Unit ºC ºC Conditions Storage as single product - [ 3 ] Specifications(characteristics) Parameter Symbol Specifications Typ. Unit Nominal frequency Frequency tolerance Frequency Stability over temperature f_nom f_tol Min. -10 - Max. +10 x 10 f_tem -20 - +20 x 10-6 Operating temperature Level of drive Load capacitance Motional resistance (ESR) Motional capacitance Motional inductance Shunt capacitance Frequency aging T_use DL CL R1 C1 L1 C0 f_age -40 -1 10 8 2.48 9.97 0.70 - +85 100 60 +1 ºC µW pF Ω fF mH pF 32.000000 MHz -6 Conditions Fundamental @+25ºC -40ºC to +85ºC Recommended: 10 µW x10-6 /yea @+25ºC, First year [ For other general specifications, please refer to the attached Full Data Sheet below ] 2023/10/18 1 / 11 Page 　 2.0 x 1.6 mm size MHz range crystal unit: FA-128 Features • Package size: • Frequency range: 2.0 x 1.6 mm, t = 0.5 mm Max. 19.2 MHz to 54 MHz • Frequency tolerance (standard): ±10 x 10-6 / ±30 x 10-6 (@+25 °C) • Frequency vs. temperature characteristics (standard): ±10 x 10-6 (-20 °C to +75 °C) ±30 x 10-6 (-20 °C to +75 °C) • ESR: 150 Ω Max. (19.2 MHz < f_nom < 20 MHz) 　　　　　 100 Ω Max. (20 MHz < f_nom < 24 MHz) 80 Ω Max. (24 MHz < f_nom < 26 MHz) 60 Ω Max. (26 MHz < f_nom < 54 MHz) FA-128 ( 2.0 x 1.6 mm, t = 0.5 mm Max. ) Applications • Small communication module for consumer and industrial applications • Wearable devices • Clock for MCU Description The FA-128 has been commercialized as a reference clock for communication modules, which requires high accuracy, and as a clock for wireless communication and microcomputers for applications that require miniaturization (TWS (True Wireless Stereo), Smart Watch, etc.). The products created using the element processing technology cultivated over many years contribute to improving the performance of the customer's system. Outline Drawing and Terminal Assignment 2.0±0.1 #3 1.6±0.1 #4 2600M E66RA #1 0.5 Max. #2 0.65 0.6 Internal connection (TOP VIEW) 0.45 0.5 #2 #1 C 0.2 Min. #4 #3 #4 #1 #3 #2 #2 and #4 are connected to the cover. (Please connect to ground) Page 2 / 11 Pin Connection #1 X'tal #2 GND #3 X'tal #4 GND Spec No FA-128_E_Ver1.3 [ 1 ] Product Number / Product Name (1-1) Product Number 　　　　Q22FA1280xxxx18　　(Please contact Epson for details) (1-2) Product Name (Standard Form) FA-128 　24.000000MHz 　12.0 　+10.0-10.0 　　　　①　　　　　②　　　　　 ③　　　　④ ①Model　②Frequency　③Load capacitance (pF) ④Frequency tolerance (x10-6, +25 °C) 　　　　　In addition to the mentioned above specification items (① to ④), 　　　　　pleases specify the frequency vs. temperature characteristics. [ 2 ] Absolute Maximum Ratings Rating value Item Storage temperature range Symbol T_stg Unit Min. Typ. Max. -40 - +125 °C Note Satisfy environmental characteristics specifications [ 3 ] Operating Conditions Rating value Item Operating temperature range Level of drive Symbol Unit Min. Typ. Max. -40 - +85 -40 - +105 T_use DL Note °C 1 200 Please contact Epson μW Recommended: 10 μW [ 4 ] Static Characteristics Item Nominal frequency range Frequency tolerance (Standard) Frequency vs. temperature characteristics (Standard) Load capacitance Symbol Specifications Unit f_nom 19.2000 to 54.000 MHz ±10 ±30 f_tol x10-6 T_use = +25 °C ± 3 °C DL = 100 μW Does not include frequency aging Please contact Epson for requirements not listed in the specifications Reference at T_use = +25 °C ± 3 °C -20 °C to +75 °C Please contact Epson for requirements not listed in the specifications f_tem ±10 ±30 x10-6 CL 6 to ꝏ pF Please specify π circuit IEC 60444-2 T_use = Operating temperature range DL = 100 μW Motional resistance (ESR) R1 Table 1. Ω Shunt capacitance C0 3.0 Max. pF f_age ±1 Max. (19.2 MHz < f_nom < 40 MHz) ±2 Max. (40 MHz < f_nom < 54 MHz) x10-6 Frequency aging Condition / Remarks T_use = +25 °C ± 3 °C First year Table 1. Frequency 19.2 MHz < f_nom < 20 MHz 20 MHz < f_nom < 26 MHz 24 MHz < f_nom < 26 MHz 26 MHz < f_nom < 54 MHz R1 150 Ω Max. 100 Ω Max. 80 Ω Max. 60 Ω Max. Page 3 / 11 Spec No FA-128_E_Ver1.3 [ 5 ] Example of Frequency Temperature Characteristics 19.2 MHz n = 30 20 MHz n = 30 24 MHz n = 30 24.576 MHz n = 30 25 MHz n = 30 26 MHz n = 30 Page 4 / 11 Spec No FA-128_E_Ver1.3 27.12 MHz n = 30 32 MHz n = 30 Temperature [°C] 37.4 MHz n = 30 38.4 MHz n = 30 40 MHz n = 30 48 MHz n = 30 Page 5 / 11 Spec No FA-128_E_Ver1.3 52 MHz n = 30 Page 6 / 11 Spec No FA-128_E_Ver1.3 [ 6 ] Marking Description Internal ID Frequency 2400 P Symbol mark E09EA Year of manufacture (Last digit of the year) Month of manufacture (Table 1.) Table 1. Month of manufacture Month Jan Code 1 Feb 2 Mar 3 Apr 4 May 5 Jun 6 Jul 7 Aug 8 Sep 9 Oct X Nov Y Dec Z [ 7 ] Outline Drawing and Recommended Footprint 2.0±0.1 Unit: mm 1.6±0.1 1.45 #3 #4 1.15 2600M 0.85 E66RA #1 0.5 Max. #2 0.95 0.65 Internal connection (TOP VIEW) 0.6 0.45 0.5 #2 #1 C 0.2 Min. #4 #3 #4 #1 #3 #2 #2 and #4 are connected to the cover. (Please connect to ground) Pin #1 #2 #3 #4 Connection X'tal GND X'tal GND Reference weight Typ.: 7 mg 　　　Terminal coating: Au plating Page 7 / 11 Spec No FA-128_E_Ver1.3 [ 8 ] Moisture Sensitivity Level Specification LEVEL1 Parameter MSL Conditions JEDEC J-STD-020D.01 [ 9 ] Reflow Profile (JEDEC J-STD-020D.01) Temperature [ C ] 300 ; +260 C OVER TP +255 C 250 ; +217 C TL 200 150 Ts max ; +200 C Ts min tp ; at least 30 s Ramp-up rate +3 °C/s Max. tL Ramp-down rate -6 °C/s Max. 60 s to 150 s ; +150 C ( +217 C over ) ts 60 s to 120 s 100 ( +150 C to +200 C) 50 Time +25 C to Peak 0 60 120 180 240 300 360 420 480 540 600 660 720 780 Time [ s ] Page 8 / 11 Spec No FA-128_E_Ver1.3 [ 10 ] Packing Information 　　(1) Packing Quantity The last two digits of the Product Number (Q22FA1280xxxxxx) are a code that defines the packing quantity. The standard is "18" for a 5 000 pcs / Reel. 　(2) Taping Specification 　Subject to EAI-481, IEC 60286 and JIS C0806 (2-1) Tape Dimensions Carrier Tape Material : PS (Polystyrene) Top Tape Material : PET (Polyethylene Terephthalate) + PE (Polyethylene) Unit : mm Epson 4.0±0.1 Φ0.5±0.05 0.7±0.1 0.25±0.05 2.2±0.1 4.0±0.1 8.0±0.2 2.0±0.1 3.5±0.05 +0.1 Φ1.5 -0 1.75±0.1 10P: 40±0.15 1.8±0.1 User direction of feed (2-2) Reel Dimensions Center Material : PS (Polystyrene) Reel Material : PS (Polystyrene) +0 Φ180.00 -3 11.4 ± 1 Φ60 Φ76 Φ160 9.00 ± 0.3 H Φ3 2.00 +0.3 -0 Φ13 ± 0.2 G Φ21 ± 0.8 Page 9 / 11 Spec No FA-128_E_Ver1.3 [ 11 ] Handling Precautions Prior to using this product, please carefully read the section entitled “Precautions” on our Web site (https://www5.epsondevice.com/en/information/#precaution) for instructions on how to handle and use the product properly to ensure optimal performance of the product in your equipment. Before using the product under any conditions other than those specified therein, please consult with us to verify and confirm that the performance of the product will not be negatively affected by use under such conditions. In addition to the foregoing precautions, in order to avoid the deteriorating performance of the product, we strongly recommend that you DO NOT use the product under ANY of the following conditions: 1. Max three (3) times re-flow is allowed. Its recommended to manually solder when not enough/no solder detected. (Using soldering iron at +350 C Max  within 5 seconds) 2. Patterning on a board should follow our company recommended pattern. 3. Too much exciting shock or vibration may cause deterioration on damage. The product may damage depends on the condition such as a shock in assembly machinery. Please check your process condition in advance to minimize and maintain the shock level. 4. It is recommended to do patterning to the oscillator as short as possible. Abnormal oscillation may happened if the line is too long. 5. Condensation may occur when products are used/stored under remarkable temperature change. 6. This product may be affected to ultrasonic cleaning. It is depends on the cleaning conditions (Cleaning machine type/power/time/content/position etc.). The warranty will not cover any damage due to this type of usage. Check conditions prior to use. 7. When the substrate of oscillation become dewy, the crystal frequency is changed or stopped. Please use under without the dewfall. 8. Applying excessive excitation Drive Level to the crystal Unit may cause deterioration damage. 9. Few data or readings taken at user side may be different from our company’s data. Confirmation of the different value is necessary before application. 10. To avoid malfunction, no pattern across or near the crystal is allowed. 11. Start up time of oscillation may be increased or no oscillation may occur unless adequate negative resistance is allocated in the oscillation circuit In order to avoid this, please provide enough negative resistance to the circuit design. How to check the negative resistance. Rf 1) Insert a pure resistance R in series with the X'tal. 2) Adjust R and find the maximum R value that starts oscillation. Rd X'tal Cg R Cd 3) Check the value of R in the oscillation state of 2). Negative resistance of the circuit |-R| = R + Series resistance value R1 of the X'tal 4) Negative resistance |-R| guideline: |-R| > R1 Max. x 5 12. Please refer to packing specification for the storage method and packing standard. Page 10 / 11 Spec No FA-128_E_Ver1.3 PROMOTION OF ENVIRONMENTAL MANAGEMENT SYSTEM CONFORMING TO INTERNATIONAL STANDARDS At Seiko Epson, all environmental initiatives operate under the Plan-Do-Check-Action (PDCA) cycle designed to achieve continuous improvements. The environmental management system (EMS) operates under the ISO 14001 environmental management standard. All of our major manufacturing and non-manufacturing sites, in Japan and overseas, completed the acquisition of ISO 14001 certification. ISO 14000 is an international standard for environmental management that was established by the International Standards Organization in 1996 against the background of growing concern regarding global warming, destruction of the ozone layer, and global deforestation. WORKING FOR HIGH QUALITY In order provide high quality and reliable products and services than meet customer needs, Seiko Epson made early efforts towards obtaining ISO9000 series certification and has acquired ISO9001 for all business establishments in Japan and abroad. We have also acquired IATF 16949 certification that is requested strongly by major manufacturers as standard. ■ Explanation of marks used in this datasheet IATF 16949 is the international standard that added the sector-specific supplemental requirements for automotive industry based on ISO9001. ●Pb free. ●Complies with EU RoHS directive. *About the products without the Pb-free mark. Contains Pb in products exempted by EU RoHS directive (Contains Pb in sealing glass, high melting temperature type solder or other) NOTICE: PLEASE READ CAREFULLY BELOW BEFORE THE USE OF THIS DOCUMENT ©Seiko Epson Corporation 2020 1. The content of this document is subject to change without notice. 　Before purchasing or using Epson products, please contact with sales representative of Seiko Epson Corporation (“Epson”) for the latest information and be always sure to check the latest information published on Epson’s official web sites and resources. 2. 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