Q22FA23V00019

RECIPIENT SPECIFICATIONS Product No. : Q22FA23V0001900 FA-238V MODEL : A18-068-4B SPEC. No. : DATE : May. 10. 2018 SEIKO EPSON CORPORATION 8548 Naka-minowa Minowa-machi Kamiina-gun Nagano-ken 399-4696 Japan CHECKED CHECKED CHECKED PREPARED Kunihito Yamanaka Masashi Shirotori Yoshitaka Kurahashi Emi Oguchi / TD Engineering Department Manager / TD Production Engineering Department Senior Staff / TD・CS Quality Assurance Department Manager / TD・CS Quality Assurance Department Senior Staff SPECIFICATIONS 1. Application 1) This document is applicable to the crystal unit that are delivered to DELTA ELECTRONICS, INC from Seiko Epson Corp. 2) This product complies with RoHS Directive. 3) This Product supplied (and any technical information furnished, if any) by Seiko Epson Corporation shall not be used for the development and manufacture of weapon of mass destruction or for other military purposes. Making available such products and technology to any third party who may use such products or technologies for the said purposes are also prohibited. 4) This product listed here is designed as components or parts for electronics equipment in general consumer use. We do not expect that any of these products would be incorporated or otherwise used as a component or part for the equipment, which requires an systems, and medical equipment, the functional purpose of which is to keep extra high reliability, such as satellite, rocket and other space life. 2. Product No. / Model The product No. of this crystal unit is Q22FA23V0001900. The model is FA-238V. 3. Packing It is subject to the packing standard of Seiko Epson Corp. 4. Warranty Defective parts which originate with us are replaced free of charge in the case of defects being found with 12 months after delivery. 5. Amendment and/or termination Amendment and/or termination of this specification is subject to the agreement between the two parties. 6. Contents Item No. Item Page [1] Absolute maximum ratings 2 [2] Operating range 2 [3] Static characteristics 2 [4] Environmental and mechanical characteristics 3 [5] Dimensions and circuit 4 [6] Recommended soldering pattern and marking layout 5 [7] Notes 6 1 Ver.20170607 [ 1 ] Absolute maximum ratings No. 1 Item Storage temperature range Symbol T_stg Rating value Min. Typ. Max. - 40 - +125 Unit Note Depends on the Environmental characteristics specifications. C [ 2 ] Operating range No. Item Symbol 1 Operating temperature range 2 Level of drive Rating value Unit Min. Typ. Max. T_use - 20 - +70 C DL 1 100 200 W Note [ 3 ] Static characteristics No. 1 Item Nominal Frequency Symbol Value Unit fo 12 MHz 2 Frequency tolerance f_tol 50 3 Motional resistance R1 100 Max. 4 Shunt capacitance C0 5.0 Max. 5 Frequency temperature characteristics 6 Isolation resistance 7 Frequency Aging f_tem 30 IR 500 Min. f_age 5 10-6 pF 10 Fundamental CL = 10 pF Ta = +25 3 C DL : 100 W Not include aging circuit IEC 60444-2 Ta = Operating temperature range DL : 100 W π circuit and N.A. -6 M 10-6/year 2 Conditions Ta = Operating temperature range (Ref. at Ta = +25 C 3 C) DL : 100 W DC 100 V 15, 60 seconds between each terminals Ta = +25 C 3 C Ver.20170607 [ 4 ] Environmental and mechanical characteristics (The company evaluation condition：We evaluate it by the following examination item and examination condition.) Value * 1 * 2 No. Item Test Conditions f / f [1 10-6] 100 g dummy Jig (Seiko Epson Standard) *3 10 1 Shock drop from 1 500 mm height on the Concrete 3 directions 10 times 10 Hz to 55 Hz amplitude 0.75 mm 55 Hz to 500 Hz acceleration 98 m/s2 *3 5 2 Vibration 10 Hz 500 Hz 10 Hz 15 min./cycle 6 h (2 hours , 3 directions) +85 C 1 000 h *3 5 3 High temperature storage 4 Low temperature storage *3 5 - 40 C 5 Temperature cycle *3 5 - 40 C + 85 C 30 minutes at each temp. 100 cycle 6 Temperature humidity storage *3 10 +85 C 7 Resistance to soldering heat 5 For convention reflow soldering furnace (3 times) 8 Substrate bending 9 Shear 10 Pull – off 11 Solderability No peeling-off at a soldered part No peeling-off at a soldered part No peeling-off at a soldered part Terminals must be 95 % covered with fresh solder. 1 000 h 85 %RH 1 000 h Bend width reaches 3.0 mm and hold for 5 s 1 s 1 time Ref. IEC 60068-2-21 10 N press for 10 s 1 s Ref. IEC 60068-2-21 10 N press for 10 s 1 s Ref. IEC 60068-2-21 Dip termination into solder bath at +235 °C 5 °C for 5 s (Using Rosin Flux) < Notes > 1. * 1 Each test done independently. 2. * 2 Measuring 2 h to 24 h later leaving in room temperature after each test. 3. * 3 Item No.1 to No.6 shall be tested after following pre conditioning. Measuring 24 h later leaving in room temperature after Pre conditioning. Pre conditioning : Reflow 3 times. 4. Item No.1 to No.7, Shift motional resistance at after above tests should be less than 20 % or less than 10 . ◆Reflow Pre Heating Temperature Tp1 ~ Tp2 = + 170 °C Heating Temperature TMlt = + 220 °C Peek Temperature TMax. = + 260 °C Point of measuring In case of Solderability Terminal. In case of Resistance to soldering heat Surface. Temperature TMax. TMlt Tp2 100 s Tp1 35 s Time 3 Ver.20170607 [ 5 ] Dimensions and Circuit 1) Dimension (Unit : mm) 3.2 ± 0.1 #3 2.5 ± 0.1 #4 0.2 #1 0.7 Max. #2 Internal connection TOP VIEW #2 #4 #3 #1 #2 0.7 0 0.8 #1 #4 1.2 0.9 Terminal #2, #4 are connected to the LID (Please connect GND) Terminal Plating : Au plating #3 4 Ver.20170607 [ 6 ] Recommended soldering pattern and Marking layout 1) Recommended soldering pattern 1.4 1.2 1.6 2.2 Unit ： mm 2) Marking layout Nominal frequency Unit : MHz 1200P V85AA Factory identity No. Symbol mark Production month Production year Production month January February 1 2 ...... ...... October X November Y December Z Nominal frequency is only one example. Nominal frequency omits the figure below the second place of decimals. ex) 12 MHz ...... [1200] The above marking layout shows only marking contents and their approximate position and it is not for font, size and exact position. 5 Ver.20170607 [ 7 ] Notes 1. Max. three(3) times re-flow is allowed. Its recommended to manually solder when not enough/no solder detected.( Using soldering iron at +350 C Max within 5 seconds) 2. Patterning on a board should follow our company recommended pattern. 3. Too much exciting shock or vibration may cause deterioration on damage. The product may damage depends on the condition such as a shock in assembly machinery. Please check your process condition in advance to minimize and maintain the shock level. 4. It is recommended to do patterning to the oscillator as short as possible. Abnormal oscillation may happened if the line is too long. 5. Condensation may occur when products are used/stored under remarkable temperature change. 6. This product may be affected to ultrasonic cleaning. It is depends on the cleaning conditions (Cleaning machine type/power/time/content/position etc.). The warranty will not cover any damage due to this type of usage. Check conditions prior to use. 7. When the substrate of oscillation become dewy, the crystal frequency is changed or stopped. Please use under without the dewfall. 8. Applying excessive excitation Drive Level to the crystal Unit may cause deterioration damage. 9. Few data or readings taken at user side may be different from our company’s data. Confirmation of the different value is necessary before application. 10. To avoid malfunction, no pattern across or near the crystal is allowed. 11. Start up time of oscillation may be increased or no oscillation may occur unless adequate negative resistance is allocated in the oscillation circuit In order to avoid this, please provide enough negative resistance to the circuit design. How to check the negative resistance (1) Connect the resister(R) to the circuit in series with the crystal Unit. Rf (2) Adjust R so that oscillation can start (or stop). INV (3) Measure R when oscillation just start (or stop) in above (2). Rd R X’tal Cg Cd (4) Get the negative resistance -R=R+CI value. (5) Recommended -R [-R] > CI 5 12. Please refer to packing specification for the storage method and packing standard. 6 Ver.20170607 PAKING SPECIFICATION SEIKO EPSON CORP. TAPING SPECIFICATION テープ梱包基準書 1. APPLICATION 適用範囲 This document is applicable to FA-238 / FA-238V 本基準書は､FA-238 / FA-238V のテーピング梱包について規定する。 2. CONTENTS 目次 Item No. Item Page [1] Taping specification 2 to 3 [2] Shipping carton [3] Marking [4] Quantity [5] Storage environment [6] FA238 / FA-238V_TL_1001 テーピング仕様 外装箱への収納 4 表示 収納数量 5 保管環境 Handling リール取扱い Page 1 PAKING SPECIFICATION [ 1 ] Taping specification SEIKO EPSON CORP. テーピング仕様 Subject to EIA-481 , IEC 60286 , JIS C0806.. 「EIA-481」「IEC 60286」「JIS C0806」に準拠する。 (1) Tape dimensions TE0804L Material of the Carrier Tape キャリアテープ材質: PS Material of the Top Tape トップテープ材質 : PET+PE +0.2 1.0 -0 φ 4 .0 ±0.1 1.05±0.05 3.5±0.1 0.25± 0.05 8.0±0.2 2.0±0.05 4.0±0.1 3.5±0.05 +0.1 φ1.5 -0 1.75±0.1 10 P: 40±0.1 2.8±0.1 Unit : mm * Inner carve of each corner 0.25 mm Max. *各コーナーの内 R は 0.25 Max. *各コーナーの抜きテーパーは 3°Max. (2) Reel dimensions (a) Center material 中心材質 : PS (b) Material of the Reel リール材質: PS Φ180.00 +0 -3 11.40 ±1 9.00 ±0.3 Φ160 Φ60.00 Φ76 HΦ3 2.00 +0.3 -0 G穴 Φ21 ±0.8 Φ13 ±0.2 Unit : mm FA238 / FA-238V_TL_1001 Page 2 PAKING SPECIFICATION (3) Packing 収納形態 (a) Tape & Reel Label SEIKO EPSON CORP. デバイス収納方法 Tape reel ラベル テープリール Top tape トップテープ Carrier tape キャリアテープ 4000 E95A 4000 E95A 4000 E95A 4000 E95A User Direction of feed 引き出し方向 (b) Start & End Point 引き出し先頭側及びリール側の処理 Start End Enpty pocket Tape Trailer Side 空ポケット Pull out direction 引き出し方向 リーダー部(引き出し先頭) トレーラー部(空きポケットリール側) Item Empty Space 項目 空きスペース Top Tape トップテープ Tape leader Empty pocket Reel side Tape Leader Top tape Min. 1 000 mm (引き出し先頭側) Note 備考 Feeding in the Top tape, the tip is fixed with tape. トップテープ単独で繰り出し、先端はテー プにより固定。 Carrier Tape Min. 100 mm Top Tape Carrier Tape Min. Min. 0 mm 160 mm Winding method is a diagram of the above リールへの巻き取り方法は、上図の通り。 Tape Trailer (リール側) (4) Tip is fixed to the reel. 先端はリールに固定。 Peel force of the cover tape トップテープの剥離強度 (a) angle : cover tape during peel off and the direction of unreeling shall be 165 to 180 . 剥離角度：テープの接着面に対し 165～180 度とする。 (b) peel speed : 300 mm/min 剥離速度：300 mm/min とする。 (c) peel strength : 0.1～1.0 N 剥離強度：0.1～1.0 N FA238 / FA-238V_TL_1001 Page 3 PAKING SPECIFICATION SEIKO EPSON CORP. [ 2 ] Shipping carton 外装箱への収納 a) Packing to antistatic bag 袋への収納 Sealing 熱シール Antistatic bag Label 静電防止袋 ラベル b) Packing to shipping carton 外装箱への収納 If there is space in the outer box, material is put in a shock absorbing together. 空間ができた時は、クッション材を入れる。 Card board 天地板 Taping 包装テープ Label ラベル [ 3 ] Marking 表示 (1) Reel marking リールへの表示 Reel marking shall consist of 下記内容をリール表面に表示できるラベルを貼る。: 1) Parts name 製品名称 2) Quantity 製品数量 3) Manufacturing Date or symbol 製品の製造年月又はこれを示す記号 4) Manufacturer’s Date or symbol 製品の製造業者又はその略号 5) Others (if necessary) その他必要事項 (2) Shipping carton marking 外装箱への表示 Shipping carton marking shall consist of : 下記内容を外装箱表面に表示できるラベルを貼る。: 1) Parts name 製品名称 2) Quantity 製品数量 FA238 / FA-238V_TL_1001 Page 4 PAKING SPECIFICATION SEIKO EPSON CORP. [ 4 ] Quantity 収納数量 3 000 pcs./reel (Standard) However it is not the limit, in case that the order quantity does not fill with 3 000 pieces. Packing quantity is defined by 14th and 15th digit of product number. 但し、注文数量が 3 000 pcs に満たない場合は、その限りではない。 収納数量は、製品型番の 14 桁、15 桁による。 14th and 15th digit of product number. Quantity 製品型番の 14 桁、15 桁 00 01 11 12 13 14 15 17 3 000 pcs Vinyl Bag(Bulk) Any Quantity 250 pcs 500 pcs 1 000 pcs 2 000 pcs 4 000 pcs [ 5 ] Storage environment 保管環境 (1) To storage the reel at +15 C to +35 C , 25 %RH to 85 %RH of Humidity. 常温常湿：温度 +15 C ～+35 C、湿度 25% ～85 %RH 以下での保管をして下さい。 (2) To open the packing just before using. 使用直前までは、開梱しないで下さい。 (3) Not to storage with some erosive chemicals. 化学薬品類との同居を避ける。 (4) Nothing is allowed to put on the reel or carton to prevent mechanical damage 外装箱がゆがまないようまた、外圧がかからないように保管して下さい。 [ 6 ] Handling リール取扱い To handle with care to prevent the damage of tape, reel and products. リールの取扱いについては、中のテープ・製品を変形させないようにして下さい。 FA238 / FA-238V_TL_1001 Page 5 - PROCESS QUALITY CONTROL SMD TYPE AT STRIP CRYSTAL FA-238V No.A-0303-02-AAE-7 FA238V_Q_0001 2014.05.08 Manufacturing process chart CRYSTAL BLOCK ▽ 1 In-coming Inspection Ｎo. １ Section Inspection Section １’ Inspection Section Standards Inspection,Control Items Inspection Methods Purchasing Specification Dimension Incoming Inspection Standard Outer Appearance 〃 Visual Inspection Inner Appearance 〃 Visual Inspection 〃 Dimension Outer Appearance ② Wafer Cutting ２ Ploduction Section Manufacturing Instruction Sheet Cut Angle Wafer Thickness ③ Wafer Lapping ３ Ploduction Section 〃 Frequency Wafer Thickness Seramic Base ④ Chip Cutting ４ Ploduction Section 〃 ⑤ Etching ５ Ploduction Section 〃 Sampling Instrument Sampling 〃 Sampling 〃 Sampling 〃 Dimension Sampling Frequency Sampling Length Gauge Comparator Record In-Coming Inspection Data Sheet 〃 Microscope X-ray Radio Grafic Process Data Sheet Comparator Blank Osillator 〃 Comparator Comparator 〃 Blank Osillator 〃 ▽ 1' In-coming Inspection Outer Appearance ⑥ Deposition ６ Ploduction Section 〃 Frequency Outer Appearance Lid 〃 Sampling 〃 Microscope Blank Osillator 〃 Microscope ⑦ Mounting ７ Ploduction Section 〃 Outer Appearance Sampling Microscope 〃 ⑧ Frequency ８ Ploduction Section 〃 Frequency Sampling Frequency Counter 〃 ９ Ploduction Section 〃 Outer Appearance Sampling Microscope 〃 １０ Ploduction Section 〃 Package Leak 100% Inspection Leak Tester 〃 １１ Ploduction Section 〃 Outer Appearance Sampling Microscope 〃 １２ Ploduction Section 〃 Crystal Impedance 100% Inspection Inspection M/C 〃 ▽ In-coming 1' Inspection Adjustment ⑨ Welding 10 Leak Test ⑪ Marking 12 Characteristic Frequency Inspection 13 Out-going Inspection Insulation Resistance １３ Inspection Section Out-going Inspection Standard Taping １４ Ploduction Section ⑮ Packing １５ Ploduction Controle Section 〃 〃 〃 Temp. Characteristic Sampling Crystal Impedance Sampling 〃 Inspection M/C Frequency 〃 〃 Insulation Resistance 〃 〃 〃 Microscope Outer Appearance ⑭ 〃 Manufacturing Instruction Sheet Tape-Peel Strength Sampling Peeling Force Tester Manufacturing Instruction Sheet Destination Packing Instruction Sheet Quantity Out-going Inspection Data Sheet Process Data Sheet Delivery Slip － － Structure Diagram 構造図 Model FA-238V 型式 Document No. FA-238V_D_0001 管理№ ① ② ④ ③ ⑤ No. Name of Part 部品名 ① Lid ② Package ③ Crystal Adhesive ④ Crystal chip ⑤ Terminal 端子 ﾘｯﾄﾞ パッケージ 水晶接着 水晶片 Rev.4