S1D13506F00A200

Microdevices Operations Division http://www.epson.com Doc.1 Feb, 20, 2015 To Our Valued Distributors, [NOTICE] Terminal Plating Change First of all, we would like to take this opportunity to thank you for the excellent business relationship between the two companies and we look forward to a successful continuous partnership in the future. 1. Change Item : Terminal plating (Sn-Bi to Pure-Sn) Please refer to attached Appendix for detail of the change and evaluation result. 2. Reason and Background In order to unify specifications of plating and to promote “Pure-Sn” plating of terminal As you know, demand for environmentally friendly semiconductor products has risen day by day. Number of customers who demand “Bismuth -free terminal plating” is also increasing. We have individually corresponded about the demand. By the individual correspondences, number of specification of the Pure-Sn plating has increased and the specifications made working efficiency worse. We like to unify specifications of terminal plating, promoting “Pure Sn” plating. 3. Applicable Products : Please see next page 4. Schedule : Sep, 1, 2015 ~ We will start shipment of pure Sn plated product in Sep 2015. Actual timing of each product will be fixed, depending on order volume & inventory status. If you have any questions, please let us know by Mar.31 2015. I appreciate your understanding and cooperation Sincerely yours, Tom Sakashita General Manager, Device Sales & Marketing Dep. Micro Devices Operations Division 1 Microdevices Operations Division http://www.epson.com Doc.1 Applicable Products P/N PKG TYPE S1C17564F111100 TQFP13-64Pins S1C17F57F401100 QFP15-128Pins S1C17M01F00C100 TQFP13-64Pins S1C17Y05F00C100 TQFP12-48Pins S1D13503F01A200 QFP15-100Pins S1D13504F00A200 QFP15-128Pins S1D13505F00A200 QFP15-128Pins S1D13506F00A200 QFP15-128Pins S1D13513F01A100 QFP22-208Pins S1D13515F00A100 QFP22-256Pins S1D13517F00A100 QFP15-128Pins S1D13700F01A100 TQFP13-64Pins S1D13700F02A100 TQFP13-64Pins S1D13704F00A200 QFP14-80Pins S1D13705F00A200 QFP14-80Pins S1D13706F00A200 TQFP15-100Pins S1D13719F00A100 QFP8-208Pins S1D13742F01A200 QFP20-144Pins S1D13743F00A200 QFP20-144Pins S1D13746F01A600 QFP15-128Pins S1D13748F00A100 QFP20-144Pins S1D13781F00A100 QFP15-100Pins S1D13A04F00A100 TQFP15-128Pins S1D13A05F00A100 QFP5-128Pins S1D13U11F00A100 QFP20-144Pins S1R72013F00A100 QFP13-64Pins S1R72U06F12E100 QFP12-48Pins S1V30120F01A100 TQFP13-64Pins S1V3G340F00A900 QFP13-52Pins S2D13515F00A100 QFP22-256Pins S2D13782F00A100 QFP15-100Pins S2S65P10F00A000 QFP15-100Pins 2 Engineering Change Notice of Pure-Sn plating for QFP Package：QFP SEIKO EPSON Corporation Micro Devices Operation Div. Microdevices Operations Div. 1-1-E Page.1 Background In order to unify specifications of plating and to promote “Pure-Sn” plating of terminal. As you know, demand for environmentally friendly semiconductor products has risen day by day. Number of customers who demand “Bismuth -free terminal plating” is also increasing. We have individually corresponded about the demand. By the individual correspondences, number of specification of the Pure-Sn plating has increased and the specifications made working efficiency worse. We like to unify specifications of terminal plating, promoting “Pure-Sn” plating. Please refer to following pages for detail of the change and evaluation result. Microdevices Operations Div. 1-1-E Page.2 Details of engineering change Details of engineering change as follows, Items Plating material Current New Sn-(1-3%)Bi Pure-Sn Microdevices Operations Div. 1-1-E Page.3 Reliability test results Reliability results is as follows, Test Items Test condition n Terms of Test Failure count Judg ment Solder ability1 Steam aging 4H→Solder dipping 245℃, 5sec 22 1 Time 0 Pass Solder ability2 150℃,16H →Solder dipping 245℃, 5sec 22 1 Time 0 Pass Solder ability3 -40℃～125℃ each 30 minute （After board assembly） 10 1,000 cyc. 0 Pass Whisker test 1 Normal temp storage： 30℃60％RH 22 4,000 H 0 Pass Whisker test 2 High temp high humidity storage： 60℃90％RH 22 2,000 H 0 Pass Whisker test 3 Temp cycle： -40℃～85℃ 22 1,000 cyc. 0 Pass No defective confirmation in evaluation. Microdevices Operations Div. 1-1-E Page.4 Solder ability test results ■Solder ability1 Steam aging Flux dipping time Solder temp. Solder dipping time ： ： ： ： 4hrs 5～10sec 245℃ 5sec Pure-Sn plating ■Solder ability2 High temp. storage Flux dipping time Solder temp. Solder dipping time ： ： ： ： 150℃16hrs 5～10sec 245℃ 5sec ■Criteria Solder wet rate more than 95% ■Result Pass. All terminal solder wets rate more than 95% Solder ability1 Solder ability2 Steam aging High temp storage Photo after solder dipping Microdevices Operations Div. 1-1-E Page.5 Board assembling test result ■Sample ■Board spec. -Dimension -Material -Layer count -Cu layer -Surface processing ■Solder paste ■Test condition ■Judgment criteria ■Test result Pure-Sn plating ： P-LQFP048-0707-0.50（QFP12-48Pin） N=10 ： 100mm × 100mm t = 1.6mm ： FR-4 ： 1 layer（ One side board ） ： 35μm ： Water-soluble pre-flux processing ： Sn-3.0Ag-0.5Cu ： -40℃ ⇔ 125℃ （each 30 minute） ： A conduction part being left in the section part by section observation ： Pass. Because a conduction part is left in the section part after 1000cycle ＜Representative photo after 1000 cycle ＞ Microdevices Operations Div. 1-1-E Page.6 Whisker test result Pure-Sn plating Sample : Pure-Sn plating Test condition : 1. Normal temp. storage ： 30℃60％RH, 4000 hours 2. High temp high humidity ： 60℃90％RH, 2000 hours 3. Temperature cycle ： -40℃～85℃, 1000 cycle Judgment criteria : Test result Whisker length under 50μm : 1. Normal temp. storage ：Pass No whisker growth 2. High temp high humidity ：Pass No whisker growth 3. Temperature cycle ：Pass Under criteria Normal temp. 4000hrs No whisker growth HT/HH 2000hrs No whisker growth Temp. cycle 1000cyc Max20μm SEM photo Microdevices Operations Div. 1-1-E Page.7 Conclusion ・EPSON will change Terminal plating of QFP products, in order to unify specifications of “Pure-Sn” plating. ・Heat-resistance and Reliability level are same as current products. ・No difference of Terminal-strength and Soldering conditions. ・There is no difference in storage condition and handling conditions at customer side that is same as current products. Microdevices Operations Div. 1-1-E Page.8