X1E0003410465

RECIPIENT SPECIFICATIONS PRODUCT No. : X1E000341046500 MODEL : FA-238A A19-326-1B SPEC. No. : DATE: Aug. 23. 2019 SEIKO EPSON CORPORATION 8548 Naka-minowa Minowa-machi Kamiina-gun Nagano-ken 399-4696 Japan CHECKED CHECKED CHECKED PREPARED Kunihito Yamanaka Fumio Anzai / TD Production Engineering Department Manager / TD Production Engineering Department Senior Staff / TD･CS Quality Assurance Department Manager Yoshitaka Kurahashi Takashi kurumizawa / TD･CS Quality Assurance Department Senior Staff Ver.20170607 SPECIFICATIONS 1. Application 1) This document is applicable to the crystal FA-238A that are delivered. 2) This product complies with RoHS Directive. 3) This Product supplied (and any technical information furnished, if any) by Seiko Epson Corporation shall not be used for the development and manufacture of weapon of mass destruction or for other military purposes. Making available such products and technology to any third party who may use such products or technologies for the said purposes are also prohibited. 4) This product listed here is designed as components or parts for electronics equipment in general consumeruse. We do not expect that any of these products would be incorporated or otherwise used as a component or part for the equipment, which requires an systems, and medical equipment, the functional purpose of which is to keep extra high reliability, such as satellite, rocket and other space life. 5) This product conforms to automotive part standard " AEC-Q200 ". This FA-238A is authorized for use of navigation system for automobile only. 2. Product No. / Model The product No. of this crystal unit is X1E000341046500. The model is FA-238A. 3. Packing It is subject to the packing standard of Seiko Epson Corp. 4. Warranty Defective parts which originate with us are replaced free of charge in the case of defects being found with 12 months after delivery. 5. Amendment and/or termination Amendment and/or termination of this specification is subject to the agreement between the two parties. 6. Contents Item No. Item Page [1] Absolute maximum ratings 2 [2] Operating range 2 [3] Static characteristics 2 [4] Environmental and mechanical characteristics 3 [5] Dimensions and circuit 4 [6] Recommended soldering pattern and marking layout 5 [7] Notes 6 1 Ver.20170607 [ 1 ] Absolute maximum ratings No. 1 Item Storage temperature range Symbol T_stg Rating value Min. Typ. Max. - 40 + 125 Unit C Note Depends on the Environmental characteristics specifications. [ 2 ] Operating range Rating value No. Item Symbol 1 Operating temperature range T_use -40 2 Level of drive DL 1 Min. Typ. Max. 100 Unit +85 C 200 W Note [ 3 ] Static characteristics No. 1 Item Nominal Frequency Symbol Value Unit f_nom 28.636 36 MHz 2 Frequency tolerance f_tol + 20 to - 10 3 Motional resistance R1 50 Max. 4 Shunt capacitance C0 5 Max. 5 Frequency temperature characteristics f_tem 30 6 Unwanted responses RS/R1 6 Min. 7 Isolation resistance IR 500 Min. 8 Frequency Aging f_age 5 Max. 10-6 Fundamental CL = 10 pF Ta = +25 3 C DL : 100 W Not include aging circuit IEC 60444-2 Ta = Operating temperature range DL : 100 W pF π circuit and N.A. 10-6 Ta = Operating temperature range (Ref. at Ta = +25 C 3 C) DL : 100 W dB f_nom 10 % M 10-6/year 2 Conditions DC 100 V, 60 seconds between each terminals ( #1, #3 ) Ta = +25 C 3 C (first year, no bias) Ver.20170607 [ 4 ] Environmental and mechanical characteristics (The company evaluation condition：We evaluate it by the following examination item and examination condition.) Value * 1 * 2 No. Item Test Conditions f / f [1 10-6] 100 g dummy Jig (Epson Standard) drop 1 Shock from 1 500 mm height on the Concrete 3 *3 5 directions 10 times 10 Hz to 55 Hz amplitude 0.75 mm 2 Vibration 55 Hz to 500 Hz acceleration 98 m/s2 *3 5 10 Hz 500 Hz 10 Hz 15 min./cycle 6 h (2 hours , 3 directions) 3 High temperature storage *3 10 +125 C 4 Low temperature storage *3 5 - 40 C 5 Temperature cycle *3 10 - 40 C +125 C 30 minutes at each temp. 1 000 cycle 6 Temperature humidity storage *3 5 +85 C 7 Resistance to soldering heat 3 For convention reflow soldering furnace (3 times) 8 Substrate bending 9 Shear 10 Pull – off 11 Solderability No peeling-off at a soldered part No peeling-off at a soldered part No peeling-off at a soldered part Terminals must be 95 % covered with fresh solder. 1 000 h 1 000 h 85 %RH 1 000 h Bend width reaches 3.0 mm and hold for 20 s ± 1 s 1 time Ref. IEC 60068-2-21 10 N press for 10 s ±1 s Ref. IEC 60068-2-21 10 N press for 10 s ±1 s Ref. IEC 60068-2-21 Dip termination into solder bath at +235 °C ±5 °C for 5 s (Using Rosin Flux) < Notes > 1. * 1 Each test done independently. 2. * 2 Measuring 2 h to 24 h later leaving in room temperature after each test. 3. * 3 Item No.1 to No.6 shall be tested after following pre conditioning. Measuring 24 h later leaving in room temperature after Pre conditioning. Pre conditioning : Reflow 3 times. 4. Item No.1 to No.7, Shift motional resistance at after above tests should be less than 20 % or less than 10 . ◆Reflow condition (follow to IPC/JEDEC J-STD-020D.1） Temperature [ C ] 300 ; +260 C OVER TP +255 C 250 TL 200 150 ; +217 C Ts max ; +200 C Ts min tp ; at least 30 s Ramp-up rate +3 °C/s Max. tL Ramp-down rate -6 °C/s Max. 60 s to 150 s ( +217 C over ) ts ; +150 C 60 s to 120 s ( +150 C to +200 C) 100 50 Time +25 C to Peak 0 60 120 180 240 300 360 420 480 3 540 600 660 720 780 Time [ s ] Ver.20170607 [ 5 ] Dimensions and Circuit Dimension (Unit : mm) #3 2.5±0.1 #4 #1 3.2±0.1 #2 0.2 0.7 Max. #2 Internal Connection 0.8±0.1 #1 (TOP VIEW) #3 #1 #2 0.7±0.2 #4 Terminal #2, #4 are connected to the LID (Please connect GND) Terminal Plating : Au plating (1.5 μm Max.) #3 #4 1.2±0.2 0.9±0.1 4 Ver.20170607 [ 6 ] Recommended soldering pattern and Marking layout 1)Recommended soldering pattern 1.4 1.2 1.6 2.2 2) Marking layout Nominal frequency Unit : MHz 2 8 6 AA e98A8 Factory identity No. Symbol mark Production month Production year Production month January 1 February ...... October November December 2 ...... X Y Z Nominal frequency is only one example. Nominal frequency omits the figure below the first place of decimals. ex) 28.63636 MHz ...... [286] The above marking layout shows only marking contents and their approximate position and it is not for font, size and exact position. 5 Ver.20170607 [ 7 ] Notes 1. Max three (3) times re-flow is allowed. Its recommended to manually solder when not enough/no solder detected. ( Using soldering iron at +350 C Max within 5 seconds) 2. Too much exciting shock or vibration may cause deterioration on damage. The product may damage depends on the condition such as a shock in assembly machinery. Please check your process condition in advance to minimize and maintain the shock level. 3. It is recommended to do patterning to the oscillator as short as possible. Abnormal oscillation may happened if the line is too long. 4. Please normal temperature (+15 °C to +35 °C) and normal humidity (25 to 85 %RH) as much as possible for the frequency accuracy securing. Storing the crystal products under higher or lower temperature or high humidity for long period may affect frequency stability or solderability. Check conditions prior to use. 5. This product may be affected to ultrasonic cleaning.. Check conditions prior to use. 6. When do the be dewy of the oscillation circuit board, the frequency change or the oscillation stop is generated. Please use it under the condition without the be dewy. 7. Few data or readings taken at user side may be different from our company’s data. Confirmation of the different value is necessary before application. 8. To avoid malfunction, no pattern across or near the crystal is allowed. 9. Start up time of oscillation may be increased or no oscillation may occur unless adequate negative resistance is allocated in the oscillation circuit In order to avoid this, please provide enough negative resistance to the circuit design. How to check the negative resistance Rf (1) Connect the resister(R) to the circuit in series with the crystal unit. INV Rd R X’tal Cg (2) Adjust R so that oscillation can start (or stop). Cd (3) Measure R when oscillation just start (or stop) in above (2). * Get the negative resistance -R = R + Motional resistance (R1). * Recommended -R [-R] > R1 10 6 Ver.20170607 PACKING SPECIFICATION SEIKO EPSON CORP. TAPING SPECIFICATION テープ梱包基準書 1. APPLICATION 適用範囲 This document is applicable to FA-238A/FA-238VA 本基準書は､FA-238A / FA-238VA のテーピング梱包について規定する。 2. CONTENTS 目次 Item No. Item Page [1] Taping specification 1 to 2 [2] Shipping carton [3] Marking [4] Quantity [5] Storage environment [6] Handling FA238A_TL_1001 テーピング仕様 外装箱への収納 3 表示 収納数量 4 保管環境 リール取扱い Page 1 PACKING SPECIFICATION SEIKO EPSON CORP. [ 1 ] Taping specification テーピング仕様 Subject to EIA-481 , IEC 60286 , JIS C0806. 「EIA-481」「IEC 60286」「JIS C0806」に準拠する。 (1) Tape dimensions TE0804L Material of the Carrier Tape キャリアテープ材質: PS Material of the Top Tape トップテープ材質 : PET+PE +0.1 Φ1.0-0 4.0±0.1 0.25±0.05 3.5±0.1 3.5±0.05 4.0±0.1 1.05±0.05 8.0±0.2 +0.1 Φ1.5 -0 10P: 40.0±0.15 1.75±0.1 2.0±0.05 Top tape 2.8±0.1 Unit : mm * Inner carve of each corner 0.25 mm Max. 各コーナーの内 R は 0.25 Max. *各コーナーの抜きテーパーは 3°Max. (2) Reel dimensions Material of the Reel リール材質: PS 11.4±1.0 Φ180+0-3.0 Φ60+1-0 9±0.3 Φ10 2±0.5 Φ13±0.2 6-R0.5 Φ21±0.8 Form and Size of reel window shows are one of the example リールの窓の形状は代表例を掲載。 FA238A_TL_1001 Page 2 PACKING SPECIFICATION (3) Packing 収納形態 (a) Tape & Reel Label SEIKO EPSON CORP. デバイス収納方法 Tape Reel テープリール ラベル Top Tape トップテープ Carrier tape 2000 E45A 2000 E45A 2000 E45A 2000 E45A (b) Start & End Point キャリアテープ Direction of unreeling 引き出し方向 引き出し先頭側及びリール側の処理 End Start User Direction of feed Tape Trailer Side Empty Pocket 空ポケット 引き出し方向 Top Tape トップテープ Tape Leader Empty Pocket Reel Side リーダー部(引き出し先頭) トレーラー部(空きポケットリール側) Item Empty Space 項目 空きスペース Tape Leader Top Tape Min. 1 000 mm Note 備考 Feeding in the Top tape, the tip is fixed with tape. トップテープ単独で繰り出し、先端はテープに より固定。 (引き出し先頭側) Carrier Tape Min. 100 mm Winding method is a diagram of the above リールへの巻き取り方法は、上図の通り。 Tape Trailer (リール側) (4) Top Tape Carrier Tape Min. Min. 0 mm 160 mm Tip is fixed to the reel. 先端はリールに固定。 Peel force of the cover tape トップテープの剥離強度 (a) angle : cover tape during peel off and the direction of unreeling shall be 165° to 180°. 剥離角度：テープの接着面に対し 165～180 度とする。 (b) peel speed : 300 mm/min 剥離速度：300 mm/min とする。 (c) peel strength : 0.1～1.0 N 剥離強度：0.1～1.0 N FA238A_TL_1001 Page 3 PACKING SPECIFICATION SEIKO EPSON CORP. [ 2 ]Shipping Carton 外装箱への収納 a) Packing to antistatic bag 袋への収納 Sealing 熱シール Antistatic bag Label 静電防止袋 ラベル b) Packing to shipping carton 外装箱への収納 If there is space in the outer box, material is put in a shock absorbing together. 空間ができた時は、クッション材を入れる。 Card board 天地板 Taping 包装テープ Label ラベル [ 3 ] Marking 表示 (1) Reel marking リールへの表示 • Reel marking shall consist of 下記内容をリール表面に表示できるラベルを貼る。: 1) Parts name 製品名称 2) Quantity 製品数量 3) Manufacturing Date or symbol 製品の製造年月又はこれを示す記号 4) Manufacturer’s Name or symbol 製品の製造業者又はその略号 5) Others (if necessary) その他必要事項 (2) Shipping carton marking 外装箱への表示 • Shipping carton marking shall consist of : 下記内容を外装箱表面に表示できるラベルを貼る。: 1) Parts name 製品名称 2) Quantity 製品数量 FA238A_TL_1001 Page 4 PACKING SPECIFICATION SEIKO EPSON CORP. [ 4 ] Quantity 収納数量 • 4 000 pcs./reel (Standard) However it is not the limit, in case that the order quantity does not fill with 4000 pieces. Packing quantity is defined by 14th and 15th digit of product number. 但し、注文数量が 4 000 pcs に満たない場合は、その限りではない。 収納数量は、製品型番の 14 桁、15 桁による。 14th and 15th digit of product number. Quantity 製品型番の 14 桁、15 桁 00 01 11 12 13 14 15 16 4 000 pcs Vinyl Bag(Bulk) Any Quantity 250 pcs 500 pcs 1 000 pcs 2 000 pcs 3 000 pcs [ 5 ] Storage environment 保管環境 (1) Before open the packing, we recommend to keep less than +30 °C and 85 %RH of Humidity, and to use it less than 6 months after delivery. 開梱前の製品は、温度 +30 °C、湿度 85 %RH 以下での保管をして下さい。 貴社納入後、袋未開封で 6 ヶ月以内の実装を推奨します。 (2) We recommend to open Package in immediately before use. After open Package, We recommend to keeps less than 6 month. No need dry air before soldering work if it is less than temperature +30 °C, 85 humidity %RH. 使用直前まで開梱せず、袋開封後は 6 ヶ月以内の実装を推奨します。 温度 +30 °C、湿度 85 %RH 以下では、はんだ付け作業前に乾燥不要です。 (3) Not to storage with some erosive chemicals. 化学薬品類との同居を避ける。 (4) Nothing is allowed to put on the reel or carton to prevent mechanical damage 外装箱がゆがまないようまた、外圧がかからないように保管して下さい。 [ 6 ] Handling リール取扱い To handle with care to prevent the damage of tape, reel and products. リールの取扱いについては、中のテープ・製品を変形させないようにして下さい。 FA238A_TL_1001 Page 5 - PROCESS QUALITY CONTROL 2015.02.23 SMD TYPE AT STRIP CRYSTAL FA-238A No.A-1302-01-AAE-2 Manufacturing process chart CRYSTAL BLOCK ▽ 1 In-coming Inspection Ｎo. １ FA238A_Q_0001 Section Inspection Section Standards Purchasing Specification Incoming Inspection Standard １’ Inspection Section 〃 Inspection,Control Items Dimension Wafer Cutting ２ Ploduction Section Manufacturing Instruction Sheet Outer Appearance 〃 Visual Inspection 〃 Visual Inspection Dimension Cut Angle Wafer Thickness ③ Wafer Lapping ３ Ploduction Section 〃 Frequency Wafer Thickness Ceramic Package Instrument Length Gauge Inner Appearance Outer Appearance ② Inspection Methods Sampling Sampling 〃 Sampling 〃 Sampling 〃 ④ Chip Cutting ４ Ploduction Section 〃 Dimension Sampling ⑤ Etching ５ Ploduction Section 〃 Frequency Sampling Record In-Coming Inspection Data Sheet 〃 Comparator Microscope X-ray Radio Grafic Process Data Sheet Comparator 〃 Blank Osillator Comparator Comparator 〃 Blank Osillator 〃 ▽ 1' In-coming Inspection Outer Appearance ⑥ Deposition ６ Ploduction Section 〃 Frequency Outer Appearance Lid 〃 Sampling 〃 Microscope 〃 Blank Osillator Microscope ⑦ Mounting ７ Ploduction Section 〃 Outer Appearance 100% Inspection Microscope 〃 ⑧ Frequency ８ Ploduction Section 〃 Frequency Sampling NetworkAnalyzer 〃 ９ Ploduction Section 〃 Outer Appearance 100% Inspection Microscope 〃 １０ Ploduction Section 〃 Package Leak 100% Inspection Leak Tester 〃 １１ Ploduction Section 〃 Outer Appearance Sampling Microscope 〃 １２ Ploduction Section 〃 Crystal Impedance 100% Inspection Inspection M/C 〃 ▽ In-coming 1' Inspection Adjustment ⑨ Welding 10 Leak Test ⑪ Marking 12 Characteristic Frequency Inspection 13 Out-going Inspection Insulation Resistance １３ Inspection Section ⑭ Taping １４ Ploduction Section ⑮ Packing １５ Ploduction Controle Section Out-going Inspection Standard Manufacturing Instruction Sheet 〃 〃 〃 〃 〃 Temp. Characteristic Sampling Outer Appearance 100% Inspection Microscope Crystal Impedance Sampling Inspection M/C Frequency 〃 Insulation Resistance 〃 〃 Outer Appearance 〃 Microscope Tape-Peel Strength Manufacturing Instruction Sheet Destination Packing Instruction Sheet Quantity Sampling 〃 Peeling Force Tester Out-going Inspection Data Sheet Process Data Sheet Delivery Slip － － Structure Diagram 構造図 Model Rev.02 FA-238A 型式 Document No. FA238A_D_0001 管理№ ④ ① ② ③-2 ③-1 ⑤ No. Name of Part 部品名 Remarks 備考 ① Lid ② Package ③ Crystal adhesive Over 27 MHz ( 2 Point Bonding) 接着剤 27MHz 超える周波数は 2 点固定 ④ Crystal chip ⑤ Terminal リッド パッケージ 水晶片 端子 RELIABILITY TEST DATA Product Name : FA-238A The Company evaluation condition We evaluate environmental and mechanical characteristics by the following test condition . VALUE *1 *2 ∆f/f No. ITEM TEST CONDITIONS [1 × 10 -6] 100g dummy Jig (Epsontoyocom Standard) *3 drop from 1500 mm height on the Concrete ± 5 1 Drop 3 directions 10 times 10 Hz to 55 Hz amplitude 0.75 mm *3 55 Hz to 500 Hz acceleration 98 m/s2 2 Vibration ± 5 10 Hz→500 Hz→10 Hz 15 min./cycle 6 h (2 hours , 3 directions) *3 High temperature +125 °C × 1 000 h 3 ± 10 storage No. DTA-1314-1 TEST FAIL Qty Qty [n] [n] 22 0 22 0 22 0 ± 5 22 0 ± 10 22 0 *3 4 Low temperature storage -40 °C × 1 000 h 5 Temperature cycle -40 °C ⇔ + 125 °C 30 min at each temp. 1000 cycles 6 Temperature humidity storage +85 °C × 85 %RH × 1 000 h ± 5 22 0 7 Resistance to soldering heat For convention reflow soldering furnace (3 times) ± 3 22 0 8 Substrate bending Bend width reaches 3.0 mm and hold for 20 s ± 1 s × 1 time Ref. IEC 60068-2-21 No peeling-off at a soldered part 11 0 9 Shear 10 N press for 10 s ± 1 s Ref. IEC 60068-2-21 No peeling-off at a soldered part 11 0 10 Pull – off 10 N press for 10 s ± 1 s Ref. IEC 60068-2-21 No peeling-off at a soldered part 11 0 11 Solderability Dip termination into solder bath at +230°C ± 10 °C for 5 s (Using Rosin Flux) Termination must be 95 % covered with fresh solder 11 0 *3 *3 Notes 1. *1 Each test done independently. 2. *2 measuring 24 h later leaving in room temperature after each test. 3. *3 Item No.1 to No.6 shall be tested after following pre conditioning. Measuring 24 h later leaving in room temperature after Pre conditioning. Pre conditioning : Reflow 5 times. 4. Item No.1 to No.7, Shift motional resistance at after above tests should be less than 20 % or less than 10 Ω. Qualification Data Product Name : FA-238A ∆f/f No. DTA-1314-2 1. Drop 2. Vibration 100g × 1500 mm × 3 directions × 10 times 10 Hz to 500 Hz acceleration 98 m/s2 15 min /cycle, 8cycle ×3 directions [ 1 × 10-6 ] [ 1 × 10-6 ] 5.0 2.5 0.0 7.5 7.5 5.0 5.0 2.5 0.0 2.5 0.0 -2.5 -2.5 -2.5 -5.0 -5.0 -5.0 -7.5 -7.5 -7.5 0 10 20 30 0 [ pcs. ] 10 20 0 30 [ pcs. ] 20 5. Temp. cycle 6. Temp. humidity storage -40 °C × 1 000 h -40 °C ⇔ +125 ℃ 1000 cycles +85 °C × 85 %RH × 1 000 h 7.5 7.5 5.0 5.0 5.0 0.0 [ 1 × 10-6 ] 7.5 2.5 2.5 0.0 2.5 0.0 -2.5 -2.5 -5.0 -5.0 -5.0 -7.5 -7.5 0 10 [ pcs. ] 20 30 7. Resistance to soldering heat For convention reflow soldering furnace (5 times) 7.5 5.0 2.5 0.0 -2.5 -5.0 -7.5 0 10 [ pcs. ] Qualification Data 20 30 30 [ pcs. ] -2.5 [ 1 × 10-6 ] 10 4. Low temp. storage [ 1 × 10-6 ] [ 1 × 10-6 ] +125 °C × 1 000 h [ 1 × 10-6 ] 7.5 3. High temp. storage -7.5 0 10 20 [ pcs. ] 30 0 10 [ pcs. ] 20 30 Product Name : FA-238A No. DTA-1314-3 1. Drop 2. Vibration 3.High temp. storage 100g × 1500 mm × 3 directions × 10 times 10 Hz to 500 Hz acceleration 98 m/s2 15 min /cycle, 8cycle ×3 directions +125 °C × 1 000 h 15.0 10.0 10.0 5.0 5.0 0.0 15.0 10.0 [Ω] 15.0 [Ω] [Ω] ∆ CI 0.0 5.0 0.0 -5.0 -5.0 -5.0 -10.0 -10.0 -10.0 -15.0 -15.0 -15.0 10 [ pcs. ] 20 0 30 10 [ pcs. ] 20 4. Low temp. storage 5.Temp. cycle -40 °C × 1 000 h -40°C ⇔+125°C 1000cycles 0 30 10.0 10.0 10.0 5.0 5.0 5.0 [Ω] 15.0 0.0 -5.0 -5.0 -10.0 -10.0 -10.0 -15.0 -15.0 -15.0 10 [ pcs. ] 20 30 7. Resistance to soldering heat For convention reflow soldering furnace (5 times) 15.0 [Ω] 10.0 5.0 0.0 -5.0 -10.0 -15.0 0 10 [ pcs. ] Qualification Data 20 30 0 10 [ pcs. ] 20 30 0.0 -5.0 0 20 6. Temp. humidity storage +85 °C × 85 %RH × 1 000 h 15.0 0.0 10 [ pcs. ] 15.0 [Ω] [Ω] 0 30 0 10 [ pcs. ] 20 30