X1G0042610028

Clock OSC SG5032VAN SG5032VAN 74.250000 MHz KEGA Product name X1G0042610028xx Product Number / Ordering code Please refer to the 9.Packing information about xx (last 2 digits) Output waveform LVDS Pb free / Complies with EU RoHS directive Reference weight Typ. 52 mg 1.Absolute maximum ratings Parameter Symbol Min. Typ. Max. Unit Vcc-GND T_stg Vin -0.3 -40 -0.3 - +4 +125 Vcc+0.3 V ºC V 2.Specifications(characteristics) Parameter Symbol Min. Typ. Max. Unit 2.25 -40 -30 45 250 1.15 0.7Vcc -5 - 74.2500 100 2.2 1.5 18.6 TBD -84 -112 -129 -139 -144 -144 - 3.63 +85 30 30 0.0 20.0 55 450 50 1.35 150 0.3Vcc 300 300 3 5 - MHz V ºC x10-6 mA mA mA % mV mV V mV Ω Maximum supply voltage Storage temperature Input voltage Output frequency Supply voltage Operating temperature Frequency tolerance Current consumption Stand-by current Disable current Symmetry Output voltage(LVDS) Output load condition(LVDS) Input voltage Rise time Fall time Start-up time Jitter Phase jitter Phase noise Frequency aging f0 Vcc T_use f_tol Icc I_std I_dis SYM VOD dVOD Vos dVos L_LVDS VIH VIL tr tf t_str tDJ TRJ tRMS tp-p tacc tPJ L(f) f_age 1 Page Conditions / Remarks Storage as single product ST or OE Terminal Conditions / Remarks OE=Vcc L_LVDS=100 ohm OE=GND - ps ps ms ps ps ps ps ps ps dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz dBc/Hz Random Jitter Vcc=2.5V δ(RMS of total distribution) Vcc=2.5V Peak to Peak Vcc=2.5V Off set Frequency: 12kHz to 20MHz Vcc=2.5V Off set 10Hz Vcc=2.5V Off set 100Hz Vcc=2.5V Off set 1kHz Vcc=2.5V Off set 10kHz Vcc=2.5V Off set 100kHz Vcc=2.5V Off set 1MHz Vcc=2.5V -6 x10 /Year 25℃,1stYear - 3.Test circuit 1) To observe waveform and current (case 1) A +3.3 V By-pass capacitor 2 Vcc OUT OUT Power supply 1 OE NC GND OE pin* Differentila probe Oscilloscope 100 Ω By-pass capacitor 1 * The lines from OUT and OUT pin are same length. * To measure the disable current, OE pin is connected to GND 2) To observe waveform and current (case 2) A VOD +3.3 V By-pass capacitor 2 Vcc Power supply 1 OE OUT V OUT 50 Ω NC V GND VOS 50 Ω OE pin By-pass capacitor 1 * The lines from OUT and OUT pin are same length. 3) Measurement condition A) Oscilloscope •Bandwidth should be 5 times higher than DUT’s output frequency (4 GHz). •Probe ground should be placed closely from test point and lead length should be as short as possible. B) By-pass capacitor 1 (approx. 0.01 μF to 0.1 μF) places closely between Vcc and GND. C) By-pass capacitor 2 (approx. 10 μF) places closely between power supply terminals on the board. D) Use the current meter whose internal impedance value is small. E) Power supply • Start up time (0 Vg90 %Vcc) of power source should be more than 150 μs and slew rate should be less than 19.8 mV/μs. • Impedance of power supply should be as low as possible. 2 Page 4.Timing chart Each output waveform (OUT, and OUT) Vcc OUT 50 % of OUT amplitude 50 % of OUT amplitude OUT VOS1 VOS2 GND tw SYM = tw / t t dVOS =｜VOS1-VOS2｜ Differential output waveform (OUT – OUT) tr OUT 80 % of amplitude Differential tf VOD1 0V VOD2 20 % of amplitude OUT dVOD =｜VOD1-VOD2｜ 6.Footprint(Recommended) #6 (Unit: mm) 0.89 0.89 #5 #4 1.60 (Unit: mm) 2.60 5.External dimensions #1 #2 #3 2.54 To maintain stable operation, provide a 0.01uF to 0.1uF by-pass capacitor at a location as near as possible to the power source terminal of the crystal product (between Vcc - GND). 3 Page 7.Reflow profile Reflow condition (Follow of JEDEC STD-020D.01) Temperature[C] 300 TP  ;+260C +255C 250 ;+217C Tsmax;+200C TL 200 150 Tsmin;+150C Avg. Ramp-up 3C/sMax. tp;20sto40s tL 60sto150s (+217Cover) Ramp-down 6C/sMax. ts 60sto180s (+150Cto+200C) 100 50 Time +25CtoPeak 0 60 120 180 240 300 360 420 480 540 600 660 720 780 Time[s] 8.Example of schematic layout This figure shows an example of this product’s application schematic. As with any high speed analog circuitry, the power supply pins for this device are vulnerable to noise. In order to achieve optimum jitter performance, power isolation with filter device is required for power supply pins. In order to achieve best performance of the power isolation filter, it is recommended that the filter composing devices is placed on the device side of the PCB as close to the power pins as possible. The component value of this filter is just an example, it may have to be adjusted. 4 Page * By-pass capacitor (approx. 0.01 μF to 0.1 μF) places closely between Vcc and GND. * By-pass capacitor (approx. 10 μF) places closely between power supply terminals on the board. * Please design the two output lines by characteristic impedance 100 Ω and same length, and try to make the output lines as short as possible. 9.Packing information [ 1 ]Product number last 2 digits code(xx) description The recommended code is "00" X1G0042610028xx Code 01 11 12 Condition Any Q'ty vinyl bag(Tape cut) Any Q'ty / Reel 250pcs / Reel Code 13 00 Condition 500pcs / Reel 1000pcs / Reel 5 Page [ 2 ] Taping specification Subject to EIA-481 & IEC-60286 (1) Tape dimensions 　　　Material of the Carrier Tape : PS 　　　Material of the Top Tape : PET+PE Ａ Unit: mm Ｂ Ｈ Ｅ Ｄ Carrier tape Top tape Ｃ Symbol Value A φ1.5 +0.1/-0 B 4.0±0.1 C 8.0±0.1 Ｇ Ｆ D E F 7.25±0.2 12.0±0.2 1.40±0.1 Ｇ 3.5±0.1 Ｈ 5.4±0.1 (2) Reel dimensions Center material : PS Material of the Reel : PS 6 Page φ 180±2 φ 60±1 13.0±1.0 10.Notice  This material is subject to change without notice.  Any part of this material may not be reproduced or duplicated in any form or any means without the written permission of Seiko Epson.  The information about applied circuitry, software, usage, etc. written in this material is intended for reference only. Seiko Epson does not assume any liability for the occurrence of infringing on any patent or copyright of a third party. This material does not authorize the licensing for any patent or intellectual copyrights.  When exporting the products or technology described in this material, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations.  You are requested not to use the products (and any technical information furnished, if any) for the development and/or manufacture of weapon of mass destruction or for other military purposes. You are also requested that you would not make the products available to any third party who may use the products for such prohibited purposes.  These products are intended for general use in electronic equipment. When using them in specific applications that require extremely high reliability, such as the applications stated below, you must obtain permission from Seiko Epson in advance. / Space equipment (artificial satellites, rockets, etc.) / Transportation vehicles and related (automobiles, aircraft, trains, vessels, etc.) / Medical instruments to sustain life / Submarine transmitters / Power stations and related / Fire work equipment and security equipment / Traffic control equipment / And others requiring equivalent reliability.  All brands or product names mentioned herein are trademarks and/or registered trademarks of their respective. 7 Page