Crystal Oscillator (SPXO)
· Package size (2.0 mm × 1.6 mm × 0.7 mm)
· Fundamental mode SPXO
· Output: CMOS
· Reference weight Typ.9.9 mg
X1G0048010013xx
[ 1 ] Product Number / Product Name / Marking
(1-1) Product Number / Ordering Code
X1G0048010013xx
Last 2 digits code(xx) defines Quantity.
The standard is "00", 3 000 pcs/Reel.
(1-2) Product Name / Model Name
SG2016CAN
50.000000 MHz TJGA
[ 2 ] Operating Range
Parameter
Supply voltage
Operating temperature range
CMOS load condition
Symbol
VCC
GND
T_use
L_CMOS
Specifications
Min.
1.60
0
-40
-
Typ.
-
[ 3 ] Frequency Characteristics
Parameter
Output frequency
Frequency tolerance *1
Frequency aging
Symbol
fo
f_tol
f_age
Unit
Max.
3.63
0
+85
15
V
V
°C
pF
Conditions
-
(Unless stated otherwise [ 3 ] Operating Range)
Specifications
Min.
-50
-3
Typ.
50.000000
-
Unit
Max.
+50
+3
MHz
-6
×10
×10-6
Conditions
T_use
+25 ºC, First year
*1 Frequency tolerance includes initial frequency tolerance, temperature variation, supply voltage change and load drift.
[ 4 ] Electrical Characteristics
Parameter
(Unless stated otherwise [ 3 ] Operating Range)
Symbol
Specifications
Unit
I_std
VOH
VOL
Min.
90 % Vcc
-
Typ.
-
Max.
3.0
2.6
2.7
10 % Vcc
Rise time
tr
-
-
3.5
ns
Fall time
tf
-
-
3.5
ns
SYM
VIH
VIL
45
80 % Vcc
-
-
55
20 % Vcc
100
3
%
V
V
ns
ms
Start-up time
Current consumption
Stand-by current
Output voltage
Symmetry
Input voltage
Output disable time (ST)
Output enable time (ST)
t_str
ICC
tstp_st
tsta_st
ms
mA
μA
V
V
Conditions
t = 0 at 90 % Vcc
No load condition, Vcc = 3.3 V
S̅T̅ = GND, Vcc = 3.3 V
Ioʜ = -4 mA @Vcc = 3.3 V
Ioʟ = 4 mA @Vcc = 3.3 V
20 % Vcc to 80 % Vcc Level,
L_CMOS = 15 pF, Vcc = 1.8
V ± 10 %
80 % Vcc to 20 % Vcc Level,
L_CMOS = 15 pF, Vcc = 1.8
V ± 10 %
50 % Vcc Level, L_CMOS ≤ 15 pF
S̅T̅ terminal
S̅T̅ terminal
S̅T̅ terminal HIGH → LOW
S̅T̅ terminal LOW → HIGH
[ For other general specifications, please refer to the attached Full Data Sheet below ]
2023/6/15
1 / 35 Page
Crystal oscillator: SG2016 / 3225 / 5032 / 7050CAN & SG-210STF
Features
●
Crystal oscillator (SPXO)
●
Frequency:
20 standard frequencies
(4 MHz to 72 MHz)
●
Output:
CMOS
●
Supply voltage:
1.6 V to 3.63 V
●
Operating temperature:
-20 °C to +70 °C
SG2016CAN
(2.0 × 1.6 mm)
-40 °C to +105 °C
SG-210STF
(2.5 × 2.0 mm)
SG3225CAN
(3.2 × 2.5 mm)
SG5032CAN
(5.0 × 3.2 mm)
SG7050CAN
(7.0 × 5.0 mm)
Applications
●
IoT, Wearable device
●
Data center, Storage
●
Medical, Industrial automation
Description
Epson’s SGxxxxCAN & SG-210STF are Simple Packaged Crystal Oscillator (SPXO) series with CMOS output.
These SPXO’s are ideal for variety of applications from IoT, wearables, medical, industrial automation, etc.
These SPXO have low current consumption, wide operating voltage from 1.6 V to 3.63 V and wide operating
temperature range from -40 °C to 85 °C, in addition operation up to 105 °C is available.
These SPXO’s are available in five different package size from 2.0 × 1.6 mm to 7.0 × 5.0 mm and available in
standard pin out’s.
Outline Drawing and Terminal Assignment
SG2016CAN
SG-210STF
SG3225CAN
SG5032CAN
SG7050CAN
Terminal Assignment
Pin #
Connection
#1
S̅T̅
#2
GND
#3
#4
OUT
Page 2 / 35
VCC
Function
S̅T̅ terminal
S̅T̅ function
Osc. Circuit
Output
“H” or OPEN
Oscillation
Specified frequency: Enable
“L”
Oscillation stop
High impedance: Disable
GND terminal
Output terminal
VCC terminal
Spec No : SGxxxxCAN_E_Ver2.16
[ 1 ] Product Name / Product Number
(1-1) SG2016CAN
(1) Product Name (Standard Form)
SG2016 C AN 25.000000MHz T J H A
①
②
③
④⑤⑥⑦
①Model ②Output (C:CMOS) ③Frequency ④Supply voltage
⑤Frequency tolerance ⑥Operating temperature ⑦Internal identification code ("A" is default)
④Supply voltage Refer to Figure 1
⑤Frequency tolerance / ⑥Operating temperature
T 1.8 V to 3.3 V Typ.
DB ±25 × 10-6 / -20 ºC to +70 ºC
K 2.5 V to 3.3 V Typ.
JG ±50 × 10-6 / -40 ºC to +85 ºC
*Figure 1 is on the next page
JH ±50 × 10-6 / -40 ºC to +105 ºC
(2) Product Number / Ordering Code
Frequency [MHz]
4
8
10
12
12.288
14.7456
16
20
24
24.576
25
26
27
32
33.33
33.3333
40
48
50
72
Frequency tolerance / Operating temperature
DB
JG
JH
±25 × 10-6
±50 × 10-6
±50 × 10-6
-20 ºC to +70 ºC
-40 ºC to +85 ºC
-40 ºC to +105 ºC
X1G004801003000
X1G004801004900
X1G004801004500
X1G004801004600
X1G004801002900
X1G004801002700
X1G004801005000
X1G004801000700
X1G004801005100
X1G004801005200
X1G004801004400
X1G004801005300
X1G004801005400
X1G004801005500
X1G004801001400
X1G004801005600
X1G004801005700
X1G004801005800
X1G004801001800
X1G004801005900
X1G004801000200
X1G004801004000
X1G004801006000
X1G004801003100
X1G004801002400
X1G004801001200
X1G004801003500
X1G004801000300
X1G004801003900
X1G004801006100
X1G004801002100
X1G004801006200
X1G004801006300
X1G004801006400
X1G004801006500
X1G004801002600
X1G004801006600
X1G004801006700
X1G004801003600
X1G004801006800
X1G004801002000
X1G004801006900
X1G004801007000
X1G004801001300
X1G004801002800
X1G004801007100
X1G004801007200
X1G004801007300
Page 3 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(1-2) SG-210STF
(1) Product Name (Standard Form)
SG-210 S T F 25.000000MHz Y
①
②③
④
⑤
①Model ②Function (S:Standby) ③Supply voltage
④Frequency ⑤Frequency tolerance / Operating temperature
⑤Frequency tolerance / Operating temperature
③Supply voltage Refer to Figure 1
S ±25 × 10-6 / -20 ºC to +70 ºC
T 1.8 V to 3.3 V Typ.
L ±50 × 10-6 / -40 ºC to +85 ºC
*Figure 1 is on the next page
Y ±50 × 10-6 / -40 ºC to +105 ºC
(2) Product Number / Ordering Code
Frequency [MHz]
4
8
10
12
12.288
14.7456
16
20
24
24.576
25
26
27
32
33.33
33.3333
40
48
50
72
Frequency tolerance / Operating temperature
Y
L
S
±50 × 10-6
±50 × 10-6
±25 × 10-6
-40 ºC to +105 ºC
-40 ºC to +85 ºC
-20 ºC to +70 ºC
X1G004171029900
X1G004171000900
X1G004171006900
X1G004171001500
X1G004171036500
X1G004171001600
X1G004171028000
X1G004171001800
X1G004171016300
X1G004171036600
X1G004171001900
X1G004171006100
X1G004171036700
X1G004171002500
X1G004171015400
X1G004171002700
X1G004171023800
X1G004171002900
X1G004171021800
X1G004171019700
X1G004171003100
X1G004171015600
X1G004171036800
X1G004171003200
X1G004171005900
X1G004171003300
X1G004171007700
X1G004171024400
X1G004171003400
X1G004171025000
X1G004171003500
X1G004171012700
X1G004171004000
X1G004171030000
X1G004171011900
X1G004171007500
X1G004171012000
X1G004171020600
X1G004171004500
X1G004171036900
X1G004171004600
X1G004171007800
X1G004171012600
X1G004171004700
X1G004171007900
X1G004171037100
X1G004171012400
X1G004171037000
Page 4 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(1-3) SG3225CAN
(1) Product Name (Standard Form)
SG3225 C AN 25.000000MHz T J H A
①
②
③
④⑤⑥⑦
①Model ②Output (C:CMOS) ③Frequency ④Supply voltage
⑤Frequency tolerance ⑥Operating temperature ⑦Internal identification code ("A" is default)
④Supply voltage Refer to Figure 1
⑤Frequency tolerance / ⑥Operating temperature
T 1.8 V to 3.3 V Typ.
DB ±25 × 10-6 / -20 ºC to +70 ºC
K 2.5 V to 3.3 V Typ.
JG ±50 × 10-6 / -40 ºC to +85 ºC
*Figure 1 is on the next page
JH ±50 × 10-6 / -40 ºC to +105 ºC
(2) Product Number / Ordering Code
Frequency [MHz]
4
8
10
12
12.288
14.7456
16
20
24
24.576
25
26
27
32
33.33
33.3333
40
48
50
72
Frequency tolerance / Operating temperature
DB
JG
JH
±25 × 10-6
±50 × 10-6
±50 × 10-6
-20 ºC to +70 ºC
-40 ºC to +85 ºC
-40 ºC to +105 ºC
X1G005961001115
X1G005961001215
X1G005961000415
X1G005961001315
X1G005961000515
X1G005961001415
X1G005961001515
X1G005961000615
X1G005961001615
X1G005961001715
X1G005961001815
X1G005961001915
X1G005961002015
X1G005961002115
X1G005961002215
X1G005961002315
X1G005961002415
X1G005961000715
X1G005961002515
X1G005961002615
X1G005961000115
X1G005961002715
X1G005961000815
X1G005961002815
X1G005961002915
X1G005961000215
X1G005961003015
X1G005961003115
X1G005961003215
X1G005961003315
X1G005961003415
X1G005961003515
X1G005961003615
X1G005961003715
X1G005961003815
X1G005961003915
X1G005961004015
X1G005961000915
X1G005961004115
X1G005961004215
X1G005961000315
X1G005961004315
X1G005961004415
X1G005961001015
X1G005961004515
X1G005961004615
X1G005961004715
X1G005961004815
Page 5 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(1-4) SG5032CAN
(1) Product Name (Standard Form)
SG5032 C AN 25.000000MHz T J H A
①
②
③
④⑤⑥⑦
①Model ②Output (C:CMOS) ③Frequency ④Supply voltage
⑤Frequency tolerance ⑥Operating temperature ⑦Internal identification code ("A" is default)
④Supply voltage Refer to Figure 1
⑤Frequency tolerance / ⑥Operating temperature
T 1.8 V to 3.3 V Typ.
DB ±25 × 10-6 / -20 ºC to +70 ºC
K 2.5 V to 3.3 V Typ.
JG ±50 × 10-6 / -40 ºC to +85 ºC
*Figure 1 is on the next page
JH ±50 × 10-6 / -40 ºC to +105 ºC
(2) Product Number / Ordering Code
Frequency [MHz]
4
8
10
12
12.288
14.7456
16
20
24
24.576
25
26
27
32
33.33
33.3333
40
48
50
72
Frequency tolerance / Operating temperature
DB
JG
JH
±25 × 10-6
±50 × 10-6
±50 × 10-6
-20 ºC to +70 ºC
-40 ºC to +85 ºC
-40 ºC to +105 ºC
X1G004451003400
X1G004451019600
X1G004451002100
X1G004451019700
X1G004451001300
X1G004451017800
X1G004451019800
X1G004451002800
X1G004451019900
X1G004451020000
X1G004451000100
X1G004451020100
X1G004451001900
X1G004451020200
X1G004451000200
X1G004451020300
X1G004451020400
X1G004451001100
X1G004451020500
X1G004451017200
X1G004451000300
X1G004451020600
X1G004451002900
X1G004451020700
X1G004451009700
X1G004451000400
X1G004451020800
X1G004451008200
X1G004451020900
X1G004451000500
X1G004451021000
X1G004451001400
X1G004451021100
X1G004451021200
X1G004451021300
X1G004451016700
X1G004451021400
X1G004451001200
X1G004451021500
X1G004451014900
X1G004451000700
X1G004451011200
X1G004451011500
X1G004451000800
X1G004451003600
X1G004451021600
X1G004451021700
X1G004451021800
Page 6 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(1-5) SG7050CAN
(1) Product Name (Standard Form)
SG7050 C AN 25.000000MHz T J H A
①
②
③
④⑤⑥⑦
①Model ②Output (C:CMOS) ③Frequency ④Supply voltage
⑤Frequency tolerance ⑥Operating temperature ⑦Internal identification code ("A" is default)
④Supply voltage Refer to Figure 1
⑤Frequency tolerance / ⑥Operating temperature
T 1.8 V to 3.3 V Typ.
DB ±25 × 10-6 / -20 ºC to +70 ºC
K 2.5 V to 3.3 V Typ.
JG ±50 × 10-6 / -40 ºC to +85 ºC
*Figure 1 is on the next page
JH ±50 × 10-6 / -40 ºC to +105 ºC
(2) Product Number / Ordering Code
Frequency [MHz]
4
8
10
12
12.288
14.7456
16
20
24
24.576
25
26
27
32
33.33
33.3333
40
48
50
72
Frequency tolerance / Operating temperature
DB
JG
JH
±25 × 10-6
±50 × 10-6
±50 × 10-6
-20 ºC to +70 ºC
-40 ºC to +85 ºC
-40 ºC to +105 ºC
X1G004481005100
X1G004481025200
X1G004481001400
X1G004481025300
X1G004481000500
X1G004481025400
X1G004481025500
X1G004481000600
X1G004481025600
X1G004481025700
X1G004481000100
X1G004481025800
X1G004481002500
X1G004481025900
X1G004481000700
X1G004481026000
X1G004481012800
X1G004481000800
X1G004481026100
X1G004481002200
X1G004481000200
X1G004481026200
X1G004481001600
X1G004481026300
X1G004481011600
X1G004481000300
X1G004481026400
X1G004481003500
X1G004481026500
X1G004481000400
X1G004481026600
X1G004481000900
X1G004481026700
X1G004481017900
X1G004481026800
X1G004481003300
X1G004481026900
X1G004481001500
X1G004481027000
X1G004481022600
X1G004481001100
X1G004481027100
X1G004481011200
X1G004481001200
X1G004481016000
X1G004481027200
X1G004481018300
X1G004481027300
Page 7 / 35
Spec No : SGxxxxCAN_E_Ver2.16
[ 2 ] Absolute Maximum Ratings
Parameter
Symbol
VCC
Vin
Maximum supply voltage
Input voltage
Storage temperature range
T_stg
Specification
Min.
-0.3
-0.3
-55
-40
Typ.
-
Unit
Max.
4
VCC + 0.3
+125
+125
V
V
°C
°C
Conditions
S̅T̅ terminal
SG2016CAN, SG3225CAN
All other
[ 3 ] Operating Range
Parameter
Symbol
VCC
Supply voltage
Supply voltage
GND
Operating temperature range
(Refer to Figure 1)
T_use
CMOS load condition
L_CMOS
Specification
Unit
Min.
Typ.
Max.
1.6
-
3.63
V
1.71
-
3.63
V
2.25
-
3.63
V
0.0
-20
-40
-40
-
0.0
+25
+25
+25
-
0.0
+70
+85
+105
15
V
°C
°C
°C
pF
Conditions
fo ≤ 50 MHz,
T_use = +105 °C Max.
fo = 72 MHz,
T_use = +85 °C Max.
fo = 72 MHz,
T_use = +105 °C Max.
* Power supply startup time (0 %V CC → 90 %VCC) should be more than 150 μs
* A 0.01 μF to a 0.1 μF bypass capacitor should be connected between V CC and GND pins located close to the device
Vcc[V]
3.63
3.63
105℃
2.25
2.25
85℃
Please note that Supply voltage range (V CC)
depends on Output frequency(fo) and upper limit
of Operating temperature(T_use Max.).
1.71
1.71
1.60
1.60
1.2
4
60
50
75
72
f0[MHz]
Figure 1: The upper limit of Operating temperature and the related conditions
[ 4 ] Frequency Characteristics
Parameter
Output frequency
(Unless stated otherwise [ 3 ] Operating Range)
Symbol
fo
Specification
Min.
Typ.
Max.
4, 8, 10, 12, 12.288, 14.7456, 16, 20, 24,
24.576, 25, 26, 27, 32, 33.33, 33.3333,
40, 48, 50, 72
-25
-
+25
Unit
Conditions
MHz
×10-6
T_use = -20 °C to +70 °C
T_use = -40 °C to +105 °C
-50
+50
×10-6
T_use = -40 °C to +85 °C *2
T_use = +25 °C, First year
Frequency aging
f_age
-3
+3
×10-6
*1 Frequency tolerance includes initial frequency tolerance, frequency / temperature characteristics, frequency / voltage coefficient,
and frequency / load coefficient
*2 This temperature range is only for fo = 72 MHz
Frequency tolerance *1
f_tol
Page 8 / 35
Spec No : SGxxxxCAN_E_Ver2.16
[ 5 ] Electrical Characteristics
Parameter
Start-up time
(Unless stated otherwise [ 3 ] Operating Range)
Symbol
t_str
Current consumption (No load)
VCC = 1.8 V ± 10 %
VCC = 1.8 V ± 5 %
Current consumption (No load)
VCC = 2.5 V ± 10 %
ICC
Current consumption (No load)
VCC = 3.3 V ± 10 %
Specification
Min.
-
Typ.
-
Max.
3
1.5
1.8
2.1
2.4
1.6
2.0
2.4
2.8
1.8
2.2
2.6
3.0
Unit
ms
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
-
-
2.1
µA
Output voltage
VOH
VOL
VOH
VOL
90 % VCC
VCC - 0.4
-
-
2.5
2.7
10 % VCC
0.4
µA
µA
V
V
V
V
Symmetry
SYM
45
50
55
%
-
-
3
ns
-
-
3.5
ns
80 % Vcc
-
-
20 % Vcc
100
3
V
V
ns
ms
Stand-by current
Rise time/Fall time
Input voltage
Output disable time (ST)
Output enable time (ST)
I_std
tr / tf
VIH
VIL
tstp_st
tsta_st
Conditions
t = 0 at 90 %VCC
4 MHz ≤ fo ≤ 20 MHz
20 MHz < fo ≤ 40 MHz
40 MHz < fo ≤ 50 MHz
fo = 72 MHz
4 MHz ≤ fo ≤ 20 MHz
20 MHz < fo ≤ 40 MHz
40 MHz < fo ≤ 50 MHz
fo = 72 MHz
4 MHz ≤ fo ≤ 20 MHz
20 MHz < fo ≤ 40 MHz
40 MHz < fo ≤ 50 MHz
fo = 72 MHz
VCC = 1.8 V ± 10 % or ± 5 %,
S̅T̅ = GND
VCC = 2.5 V ± 10 %, S̅T̅ = GND
VCC = 3.3 V ± 10 %, S̅T̅ = GND
Load current condition
1.8 V ± 10 % 2.5 V ± 10 % 3.3 V ± 10 %
IOH
-1.5 mA
-3 mA
-4 mA
IOL
1.5 mA
3 mA
4 mA
Load current condition
1.8 V ± 10 % 2.5 V ± 10 % 3.3 V ± 10 %
IOH
-3 mA
-4 mA
-6 mA
IOL
3 mA
4 mA
6 mA
50 % VCC level,
L_CMOS ≤ 15 pF
VCC = 2.5 V or 3.3 V ± 10 %,
20 % VCC to 80 % VCC Level,
L_CMOS = 15 pF
VCC = 1.8 V ± 10 % or ± 5 %,
20 % VCC to 80 % VCC Level,
L_CMOS = 15 pF
S̅T̅ terminal
S̅T̅ terminal HIGH → LOW
S̅T̅ terminal LOW → HIGH
[ 6 ] Thermal resistance (For reference only)
Parameter
Junction temperature
Junction to case
Junction to ambient
Symbol
Tj
θjc
θja
Specification
Min.
-
Typ.
9.8
15.2
23.1
16.1
28.0
99.6
91.9
103.8
82.5
78.8
Page 9 / 35
Max.
+125
-
Unit
°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Conditions
SG2016CAN
SG-210STF
SG3225CAN
SG5032CAN
SG7050CAN
SG2016CAN
SG-210STF
SG3225CAN
SG5032CAN
SG7050CAN
Spec No : SGxxxxCAN_E_Ver2.16
[ 7 ] Typical Performance Characteristics (For reference only)
The following data shows typical performance characteristics
(7-1) Frequency / Temperature Characteristics
fo = 25 MHz, ±25 × 10-6 at -20 °C to +70 °C
n = 50 pcs
fo = 25 MHz, ±50 × 10-6 at -40 °C to +85 °C/+105 °C
n = 50 pcs
Page 10 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(7-2) Current Consumption
No load, T_use = +25 °C, Freq. Dependency
L_CMOS = 15 pF, T_use = +25 °C, Freq. Dependency
fo = 20 MHz
L_CMOS = 5 pF, Temperature Characteristic
T_use = +25 °C, Output load(L_CMOS) Characteristics
fo = 40 MHz
L_CMOS = 5 pF, Temperature Characteristic
T_use = +25 °C, Output load(L_CMOS) Characteristics
fo = 72 MHz
L_CMOS = 5 pF, Temperature Characteristic
T_use = +25 °C, Output load(L_CMOS) Characteristics
* Output load condition under L_CMOS > 15 pF (dotted line area) is not guaranteed, and the data is for reference.
The actual current consumption is the total of the current under the condition of no load and the current to drive the
output load (fo × L_CMOS × VCC). To reduce the current consumption, it is effective to use lower frequency, lower
supply voltage and lower output load.
Page 11 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(7-3) Rise Time / Fall Time
fo = 20 MHz, Rise Time
20 % - 80 %VCC, L_CMOS = 15 pF, Temp. Char.
20 % - 80 %VCC, T_use = +25 °C, Output load Char.
10 % - 90 %VCC, L_CMOS = 15 pF, Temp. Char.
10 % - 90 %VCC, T_use = +25 °C, Output load Char.
* Output load condition under L_CMOS > 15 pF (dotted line area) is not guaranteed, and the data is for reference.
fo = 20 MHz, Fall Time
20 % - 80 %VCC, L_CMOS = 15 pF, Temp. Char.
20 % - 80 %VCC, T_use = +25 °C, Output load Char.
10 % - 90 %VCC, L_CMOS = 15 pF, Temp. Char.
10 % - 90 %VCC, T_use = +25 °C, Output load Char.
* Output load condition under L_CMOS > 15 pF (dotted line area) is not guaranteed, and the data is for reference.
Page 12 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(7-3) Rise Time / Fall Time [cont'd]
fo = 40 MHz, Rise Time
20 % - 80 %VCC, L_CMOS = 15 pF, Temp. Char.
20 % - 80 %VCC, T_use = +25 °C, Output load Char.
10 % - 90 %VCC, L_CMOS = 15 pF, Temp. Char.
10 % - 90 %VCC, T_use = +25 °C, Output load Char.
* Output load condition under L_CMOS > 15 pF (dotted line area) is not guaranteed, and the data is for reference.
fo = 40 MHz, Fall Time
20 % - 80 %VCC, L_CMOS = 15 pF, Temp. Char.
20 % - 80 %VCC, T_use = +25 °C, Output load Char.
10 % - 90 %VCC, L_CMOS = 15 pF, Temp. Char.
10 % - 90 %VCC, T_use = +25 °C, Output load Char.
* Output load condition under L_CMOS > 15 pF (dotted line area) is not guaranteed, and the data is for reference.
Page 13 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(7-3) Rise Time / Fall Time [cont'd]
fo = 72 MHz, Rise Time
20 % - 80 %VCC, L_CMOS = 15 pF, Temp. Char.
20 % - 80 %VCC, T_use = +25 °C, Output load Char.
10 % - 90 %VCC, L_CMOS = 15 pF, Temp. Char.
10 % - 90 %VCC, T_use = +25 °C, Output load Char.
* Output load condition under L_CMOS > 15 pF (dotted line area) is not guaranteed, and the data is for reference.
There are some missing data in the graph. It is unmeasurable because of low amplitude under the condition of
L_CMOS > 15 pF.
fo = 72 MHz, Fall Time
20 % - 80 %VCC, L_CMOS = 15 pF, Temp. Char.
20 % - 80 %VCC, T_use = +25 °C, Output load Char.
10 % - 90 %VCC, L_CMOS = 15 pF, Temp. Char.
10 % - 90 %VCC, T_use = +25 °C, Output load Char.
* Output load condition under L_CMOS > 15 pF (dotted line area) is not guaranteed, and the data is for reference.
There are some missing data in the graph. It is unmeasurable because of low amplitude under the condition of
L_CMOS > 15 pF.
Page 14 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(7-4) Symmetry
fo = 20 MHz
50 %VCC, L_CMOS = 15 pF, Temp. Char.
fo = 40 MHz
50 %VCC, L_CMOS = 15 pF, Temp. Char.
fo = 72 MHz
50 %VCC, L_CMOS = 15 pF, Temp. Char.
Page 15 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(7-5) Output Voltage
fo = 20 MHz
VOH, L_CMOS = 15 pF, Temp. Char.
VOL, L_CMOS = 15 pF, Temp. Char.
fo = 40 MHz
VOH, L_CMOS = 15 pF, Temp. Char.
VOL, L_CMOS = 15 pF, Temp. Char.
fo = 72 MHz
VOH, L_CMOS = 15 pF, Temp. Char.
VOL, L_CMOS = 15 pF, Temp. Char.
Page 16 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(7-6) Phase Noise, Phase Jitter, and Jitter
fo = 20 MHz
VCC = 2.5 V, T_use = +25 °C
0
0
-20
-20
-40
-40
Phase Noise d c Hz
Phase Noise d c Hz
VCC = 3.3 V, T_use = +25 °C
-60
-80
-100
-120
-140
-160
-60
-80
-100
-120
-140
-160
-180
-180
1
10
100
1k
10k
100k
1M
10M
100M
1
10
100
Offset fre uency Hz
1k
10k
100k
1M
10M
100M
Offset fre uency Hz
VCC = 1.8 V, T_use = +25 °C
Phase Jitter (Offset frequency: 12 kHz to 5 MHz)
Phase Jitter
VCC
0.31 ps
3.3 V
0.31 ps
2.5 V
0.32 ps
1.8 V
0
Phase Noise d c Hz
-20
-40
-60
-80
-100
-120
-140
Jitter (T_use = +25 °C, VCC = 3.3 V)
Total jitter (BER = 10-12)
RMS jitter
Peak to peak jitter
-160
-180
1
10
100
1k
10k
100k
1M
10M
100M
Offset fre uency Hz
31.3 ps
1.8 ps
15 ps
fo = 40 MHz
VCC = 2.5 V, T_use = +25 °C
0
0
-20
-20
-40
-40
Phase Noise d c Hz
Phase Noise d c Hz
VCC = 3.3 V, T_use = +25 °C
-60
-80
-100
-120
-140
-160
-60
-80
-100
-120
-140
-160
-180
-180
1
10
100
1k
10k
100k
1M
10M
100M
Offset fre uency Hz
1
10
100
1k
10k
100k
1M
10M
100M
Offset fre uency Hz
VCC = 1.8 V, T_use = +25 °C
Phase Jitter (Offset frequency: 12 kHz to 20 MHz)
Phase Jitter
VCC
0.24 ps
3.3 V
0.26 ps
2.5 V
0.32 ps
1.8 V
0
Phase Noise d c Hz
-20
-40
-60
-80
-100
-120
-140
-160
-180
1
10
100
1k
10k
100k
1M
10M
100M
Offset fre uency Hz
Page 17 / 35
Jitter (T_use = +25 °C, VCC = 3.3 V)
Total jitter (BER = 10-12)
RMS jitter
Peak to peak jitter
22.3 ps
1.8 ps
16 ps
Spec No : SGxxxxCAN_E_Ver2.16
(7-6) Phase Noise and Phase Jitter [cont'd]
fo = 72 MHz
VCC = 2.5 V, T_use = +25 °C
0
0
-20
-20
-40
-40
Phase Noise d c Hz
Phase Noise d c Hz
VCC = 3.3 V, T_use = +25 °C
-60
-80
-100
-120
-140
-160
-60
-80
-100
-120
-140
-160
-180
-180
1
10
100
1k
10k
100k
1M
10M
100M
Offset fre uency Hz
1
10
100
1k
10k
100k
1M
10M
100M
Offset fre uency Hz
VCC = 1.8 V, T_use = +25 °C
Phase Jitter (Offset frequency: 12 kHz to 20 MHz)
Phase Jitter
VCC
0.16 ps
3.3 V
0.17 ps
2.5 V
0.20 ps
1.8 V
0
Phase Noise d c Hz
-20
-40
-60
-80
-100
-120
-140
-160
-180
1
10
100
1k
10k
100k
1M
10M
100M
Offset fre uency Hz
Page 18 / 35
Jitter (T_use = +25 °C, VCC = 3.3 V)
Total jitter (BER = 10-12)
RMS jitter
Peak to peak jitter
21.8 ps
1.8 ps
16 ps
Spec No : SGxxxxCAN_E_Ver2.16
(7-7) Output Waveform
fo = 20 MHz
VCC = 3.3 V, L_CMOS = 15 pF, T_use = +25 °C
VCC = 2.5 V, L_CMOS = 15 pF, T_use = +25 °C
VCC = 1.8 V, L_CMOS = 15 pF, T_use = +25 °C
fo = 40 MHz
VCC = 3.3 V, L_CMOS = 15 pF, T_use = +25 °C
VCC = 2.5 V, L_CMOS = 15 pF, T_use = +25 °C
VCC = 1.8 V, L_CMOS = 15 pF, T_use = +25 °C
Page 19 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(7-7) Output Waveform [cont'd]
fo = 72 MHz
VCC = 3.3 V, L_CMOS = 15 pF, T_use = +25 °C
VCC = 2.5 V, L_CMOS = 15 pF, T_use = +25 °C
VCC = 1.8 V, L_CMOS = 15 pF, T_use = +25 °C
Page 20 / 35
Spec No : SGxxxxCAN_E_Ver2.16
[ 8 ] Test Circuit
(8-1) Waveform Observation
Switch
ST
VCC
by-pass
capacitor
supply
Test Point
GND
OUT
L_CMOS
(8-2) Current Consumption Test
Switch
ST
VCC
A
by-pass
capacitor
supply
GND
OUT
Test
Point
*Standby current test should be S̅T̅ = GND.
(8-3) Condition
(1) Oscilloscope
The bandwidth should be minimum 5 times wider than measurement frequency
The probe ground should be placed closely to the test point and the lead length should be
as short as possible
* It is recommended to use miniature socket. (Don’t use earth lead.)
(2) L_CMOS includes probe capacitance.
(3) A 0.01 μF to a 0.1 μF bypass capacitor should be connected between V CC and GND pins located
close to the device
(4) Use a current meter with a low internal impedance
(5) Power Supply
Power supply startup time (0 %VCC → 90 %VCC) should be more than 150 μs
Power supply impedance should be as low as possible
Page 21 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(8-4) Timing Chart
(1) Output Waveform and Level
(2) Output Frequency Timing
t_str
Output Stable
90 %VCC
VCC
0V
OUT
0V
(3) S̅T̅ Function and Timing
S̅T̅ Terminal
Osc. circuit
Output status
“H” or OPEN
Oscillation
Specified frequency: Enable
“L”
Oscillation stop
High impedance: Disable
VIH
Enable
S̅T̅
VIL
*1
tstp_st
Disable
*2
tsta_st
High impedance
OUT
*1 The period from S̅T̅ = VIL to OUT = High impedance (Disable)
*2 The period from S̅T̅ = VIH to OUT = Enable
* Judge of starting output: VOH ≥ 80 %VCC, VOL ≤ 20 %Vcc, fout is within fo ± 1 000 × 10-6
* S̅T̅ terminal voltage level should not exceed supply voltage when using S̅T̅ function.
Please note that S̅T̅ rise time should not exceed supply voltage rise time at the start-up.
Page 22 / 35
Spec No : SGxxxxCAN_E_Ver2.16
[ 9 ] Outline Drawing and Recommended Footprint
(9-1) SG2016CAN
Units: mm
Terminal coating : Au plating
For stable operation, it is recommended that
0.01 µF to 0.1 µF bypass capacitors should be
connected between VCC and GND and placed
as close to the VCC pin as possible.
Reference Weight Typ.: 9.9 mg
Terminal Assignment
Pin #
Connection
#1
S̅T̅
#2
#3
#4
GND
OUT
VCC
Function
S̅T̅ terminal
S̅T̅ function
Osc. Circuit
Output
“H” or OPEN
Oscillation
Specified frequency: Enable
“L”
Oscillation stop
High impedance: Disable
GND terminal
Output terminal
VCC terminal
Marking
Frequency tolerance /
Operating temperature
Frequency [MHz]
Location of Pin #1
Production lot number
Model
Page 23 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(9-2) SG-210STF
Units: mm
Terminal coating : Au plating
For stable operation, it is recommended that
0.01 µF to 0.1 µF bypass capacitors should be
connected between VCC and GND and placed
as close to the VCC pin as possible.
Reference Weight Typ.: 14 mg
Terminal Assignment
Pin #
Connection
#1
S̅T̅
#2
#3
#4
GND
OUT
VCC
Function
S̅T̅ terminal
S̅T̅ function
Osc. Circuit
Output
“H” or OPEN
Oscillation
Specified frequency: Enable
“L”
Oscillation stop
High impedance: Disable
GND terminal
Output terminal
VCC terminal
Marking
Frequency [MHz]
Production lot number
Location of Pin #1
Model
Page 24 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(9-3) SG3225CAN
Units: mm
Terminal coating : Au plating
For stable operation, it is recommended that
0.01 µF to 0.1 µF bypass capacitors should be
connected between VCC and GND and placed
as close to the VCC pin as possible.
Reference Weight Typ.: 25 mg
Terminal Assignment
Pin #
Connection
#1
S̅T̅
#2
#3
#4
GND
OUT
VCC
Function
S̅T̅ terminal
S̅T̅ function
Osc. Circuit
Output
“H” or OPEN
Oscillation
Specified frequency: Enable
“L”
Oscillation stop
High impedance: Disable
GND terminal
Output terminal
VCC terminal
Marking
Lot code /
Operating temperature
Frequency [MHz]
Location of Pin #1
Production lot number
Model
Page 25 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(9-4) SG5032CAN
Units: mm
Terminal coating : Au plating
For stable operation, it is recommended that
0.01 µF to 0.1 µF bypass capacitors should be
connected between VCC and GND and placed
as close to the VCC pin as possible.
Reference Weight Typ.: 52 mg
Terminal Assignment
Pin #
Connection
#1
S̅T̅
#2
#3
#4
GND
OUT
VCC
Function
S̅T̅ terminal
S̅T̅ function
Osc. Circuit
Output
“H” or OPEN
Oscillation
Specified frequency: Enable
“L”
Oscillation stop
High impedance: Disable
GND terminal
Output terminal
VCC terminal
Marking
Frequency [MHz]
Symbol
Location of Pin #1
Production lot number
Model
Page 26 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(9-5) SG7050CAN
Units: mm
Terminal coating : Au plating
For stable operation, it is recommended that
0.01 µF to 0.1 µF bypass capacitors should be
connected between VCC and GND and placed
as close to the VCC pin as possible.
Reference Weight Typ.: 147 mg
Terminal Assignment
Pin #
Connection
#1
S̅T̅
#2
#3
#4
GND
OUT
VCC
Function
S̅T̅ terminal
S̅T̅ function
Osc. Circuit
Output
“H” or OPEN
Oscillation
Specified frequency: Enable
“L”
Oscillation stop
High impedance: Disable
GND terminal
Output terminal
VCC terminal
Marking
Frequency [MHz]
Symbol
Location of Pin #1
Production lot number
Model
Page 27 / 35
Spec No : SGxxxxCAN_E_Ver2.16
[ 10 ] Moisture Sensitivity Level
Parameter
MSL
Specification
LEVEL 1
Conditions
IPC/JEDEC J-STD-020D.1
[ 11 ] Reflow Profiles
IPC/JEDEC J-STD-020D.1
Page 28 / 35
Spec No : SGxxxxCAN_E_Ver2.16
[ 12 ] Packing Information
(12-1) SG2016CAN
(1) Packing Quantity
The last two digits of the Product Number (X1G004801xxxxxx) are a code that defines the packing
quantity. The standard is "00" for a 3 000 pcs/Reel.
(2) Taping Specification
Subject to EIA-481, IEC-60286 and JIS C0806
1) Tape Dimensions
Carrier Tape Material: PS (Polystyrene)
Top Tape Material: PET (Polyethylene Terephthalate) +PE (Polyethylene)
Epson
Epson
2 .25±0 .1
○
○
φ1 .0
4 .0±0 .1
1 .0±0 .1
0 .25±0 .05
8 .0±0 .2
+0 .1
0
3 .5±0 .1
φ1 .5
1 .75±0 .1
4 .0 ±0 .1
2 .0±0 .1
Units: mm
+0 .1
0
1 .85±0 .1
User direction of feed
2) Reel Dimensions
Center Material: PS (Polystyrene)
Reel Material: PS (Polystyrene)
Units: mm
11. 41. 0
Φ180.0
Φ60.0
Φ13.00.2
9.00.3
2.0 0 . 5
3) Storage Environment
We recommend to keep less than +30 °C and 85 %RH of humidity in a packed condition,
and to use it less than 6 months after delivery.
Page 29 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(12-2) SG-210STF
(1) Packing Quantity
The last two digits of the Product Number (X1G004171xxxxxx) are a code that defines the packing
quantity. The standard is "00" for a 3 000 pcs/Reel.
(2) Taping Specification
Subject to EIA-481, IEC-60286 and JIS C0806
1) Tape Dimensions
Carrier Tape Material: PS (Polystyrene)
Top Tape Material: PET (Polyethylene Terephthalate) +PE (Polyethylene)
Units: mm
Epson
○
Epson
○
User direction of feed
2) Reel Dimensions
Center Material: PS (Polystyrene)
Reel Material: PS (Polystyrene)
Units: mm
3) Storage Environment
We recommend to keep less than +30 °C and 85 %RH of humidity in a packed condition,
and to use it less than 6 months after delivery.
Page 30 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(12-3) SG3225CAN
(1) Packing Quantity
The last two digits of the Product Number (X1G005961xxxxxx) are a code that defines the packing
quantity. The standard is "15" for a 2 000 pcs/Reel.
(2) Taping Specification
Subject to EIA-481, IEC-60286 and JIS C0806
1) Tape Dimensions
Carrier Tape Material: PS (Polystyrene)
Top Tape Material: PET (Polyethylene Terephthalate) +PE (Polyethylene)
Units: mm
Epson
○
Epson
○
User direction of feed
2) Reel Dimensions
Center Material: PS (Polystyrene)
Reel Material: PS (Polystyrene)
Units: mm
3) Storage Environment
We recommend to keep less than +30 °C and 85 %RH of humidity in a packed condition,
and to use it less than 6 months after delivery.
Page 31 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(12-4) SG5032CAN
(1) Packing Quantity
The last two digits of the Product Number (X1G004451xxxxxx) are a code that defines the packing
quantity. The standard is "00" for a 1 000 pcs/Reel.
(2) Taping Specification
Subject to EIA-481, IEC-60286 and JIS C0806
1) Tape Dimensions
Carrier Tape Material: PS (Polystyrene)
Top Tape Material: PET (Polyethylene Terephthalate) +PE (Polyethylene)
Units: mm
○
Epson
Epson
○
User direction of feed
2) Reel Dimensions
Center Material: PS (Polystyrene)
Reel Material: PS (Polystyrene)
Units: mm
Φ180±2
Φ60±1
13.0±1.0
2±0.2
3) Storage Environment
We recommend to keep less than +30 °C and 85 %RH of humidity in a packed condition,
and to use it less than 6 months after delivery.
Page 32 / 35
Spec No : SGxxxxCAN_E_Ver2.16
(12-5) SG7050CAN
(1) Packing Quantity
The last two digits of the Product Number (X1G004481xxxxxx) are a code that defines the packing
quantity. The standard is "00" for a 1 000 pcs/Reel.
(2) Taping Specification
Subject to EIA-481, IEC-60286 and JIS C0806
1) Tape Dimensions
Carrier Tape Material: PS (Polystyrene)
Top Tape Material: PET (Polyethylene Terephthalate) +PE (Polyethylene)
Units: mm
〇
〇
Epson
Epson
User direction of feed
2) Reel Dimensions
Center Material: PS (Polystyrene)
Reel Material: PS (Polystyrene)
Units: mm
3) Storage Environment
We recommend to keep less than +30 °C and 85 %RH of humidity in a packed condition,
and to use it less than 6 months after delivery.
Page 33 / 35
Spec No : SGxxxxCAN_E_Ver2.16
[ 13 ] Handling Precautions
Prior to using this product, please carefully read the section entitled “Precautions” on our Web site
(https://www5.epsondevice.com/en/information/#precaution) for instructions on how to handle and use
the product properly to ensure optimal performance of the product in your equipment.
Before using the product under any conditions other than those specified therein,
please consult with us to verify and confirm that the performance of the product will not be negatively
affected by use under such conditions.
In addition to the foregoing precautions, in order to avoid the deteriorating performance of the product,
we strongly recommend that you DO NOT use the product under ANY of the following conditions:
(1)
(2)
Do not expose this product to excessive mechanical shock or vibration.
This product can be damaged by mechanical shock during the soldering process depending on the equipment used, process
conditions, and any impact forces experienced. Always follow appropriate procedures, particularly when changing the assembly
process in any way and be sure to follow applicable process qualification standards before starting production.
(3) These devices are sensitive to ESD, use appropriate precautions during handling, assembly, test, shipment, and installation.
(4) The use of ultrasonic technology for cleaning, bonding, etc. can damage the Xtal unit inside this product.
Please carefully check for this consideration before using ultrasonic equipment for volume production with this product.
(5) Noise and ripple on the power supply may have undesirable affects on operation and cause degradation of phase noise
characteristics. Evaluate the operation of this device with appropriate power supplies carefully before use.
(6) When applying power, ensure that the supply voltage increases monotonically for proper operation.
On power down, do not reapply power until the supplies, bypass capacitors, and any bulk capacitors are completely discharged
since that may cause the unit to malfunction.
(7) Aging specifications are estimated from environmental reliability tests and expected frequency variation over time.
They do not provide a guarantee of aging over the product lifecycle.
(8) The metal cap on top of the device is directly connected to the GND terminal. Take necessary precautions to prevent any
conductor not at ground potential from contacting the cap as that could cause a short circuit to GND.
(9) Do not route any signal lines, supply voltage lines, or GND lines underneath the area where the oscillators are mounted including
any internal layers and on the opposite side of the PCB. To avoid any issues due to interference of other signal lines, please take
care not to place signal lines near the product as this may have an adverse affect on the performance of the product.
(10) A bypass capacitor of the recommended value(s) must be connected between the V CC and GND terminals of the product.
Whenever possible, mount the capacitor(s) on the same side of the PCB and as close to the product as possible to keep the
routing traces short.
(11) Power supply connections to V CC and GND pins should be routed as thick as possible while keeping the high frequency
impedance low in order to get the best performance.
(12) The use of a filter or similar element in series with the power supply connections to protect from electromagnetic radiation noise
may increase the high frequency impedance of the power supply line and may cause the oscillator to not operate properly.
Please verify the design to ensure sufficient operational margin prior to use.
(13) Keep PCB routing from the output terminal(s) to the load as short as possible for best performance.
(14) The Enable (S̅T̅) input terminal is high impedance and so susceptible to noise. Connect it to a low impedance source when used
and when not used it is recommended to connect it to Vcc for active high inputs and GND for active low inputs.
(15) Do not short the output to GND as that will damage the product. Always use with an appropriate load resistor connected.
(16) This product should be reflowed no more than 3 times.
[Availability of mounting conditions]
If rework is needed after reflow, please correct it with a soldering
iron with the tip set for a temperature of +350 °C or less and only
contact each terminal once and for no more than 5 seconds.
If this product is mounted on the bottom of the board during a reflow
please check that it soldered down properly afterwards.
(17) Product failures during the warranty period only apply when the product is used according to the recommended operating
conditions described in the specifications. Products that have been opened for analysis or damaged will not be covered.
It is recommended to store and use in normal temperature and humidity environments described in the specifications to ensure
frequency accuracy and prevent moisture condensation. If the product is stored for more than one year, please confirm the pin
solderability prior to use.
(18) If the oscillation circuit is exposed to condensation, the frequency may change or oscillation may stop. Do not use in any
conditions where condensation occurs.
(19) Do not store or use the product in an environment where it can be exposed to chemical substances that are corrosive to metal or
plastics such as salt water, organic solvents, chemical gasses, etc. Do not use the product when it is exposed to sunlight, dust,
corrosive gasses, or other materials for long periods of time.
(20) When using water-soluble solder flux make sure to completely remove the flux residue after soldering.
Pay particular attention when the residues contain active halogens which will negatively affect the product and its performance.
(21) Terminals on the side of the product are internally connected to the IC, be careful not to cause short-circuits or reduce the
insulation resistance of them in any way.
(22) Should any customer use the product in any manner contrary to the precautions and/or advice herein,
such use shall be done at the customer’s own risk.
Page 34 / 35
Spec No : SGxxxxCAN_E_Ver2.16
PROMOTION OF ENVIRONMENTAL MANAGEMENT SYSTEM
CONFORMING TO INTERNATIONAL STANDARDS
At Seiko Epson, all environmental initiatives operate under the
Plan-Do-Check-Action (PDCA) cycle designed to achieve continuous
improvements. The environmental management system (EMS)
operates under the ISO 14001 environmental management standard.
All of our major manufacturing and non-manufacturing sites, in
Japan and overseas, completed the acquisition of ISO 14001 certification.
ISO 14000 is an international standard for environmental management that
was established by the International Standards Organization in 1996 against
the background of growing concern regarding global warming, destruction of
the ozone layer, and global deforestation.
WORKING FOR HIGH QUALITY
In order provide high quality and reliable products and services
than meet customer needs, Seiko Epson made early efforts towards
obtaining ISO9000 series certification and has acquired ISO9001 for
all business establishments in Japan and abroad. We have also
acquired IATF 16949 certification that is requested strongly by major
manufacturers as standard.
IATF 16949 is the international standard that added the sector-specific supplemental
requirements for automotive industry based on ISO9001.
■ Explanation of marks used in this datasheet
●Pb free.
●Complies with EU RoHS directive.
*About the products without the Pb-free mark.
Contains Pb in products exempted by EU RoHS directive
(Contains Pb in sealing glass, high melting temperature type solder or other)
NOTICE: PLEASE READ CAREFULLY BELOW BEFORE THE USE OF THIS DOCUMENT ©Seiko Epson Corporation 2020
1. The content of this document is subject to change without notice. Before purchasing or using Epson products, please contact with sales
representative of Seiko Epson Corporation (“Epson”) for the latest information and be always sure to check the latest information
published on Epson’s official web sites and resources.
2. This document may not be copied, reproduced, or used for any other purposes, in whole or in part, without Epson’s prior consent.
3. Information provided in this document including, but not limited to application circuits, programs and usage, is for reference purpose only.
Epson makes no guarantees against any infringements or damages to any third parties’ intellectual property rights or any other rights
resulting from the information. This document does not grant you any licenses, any intellectual property rights or any other rights with
respect to Epson products owned by Epson or any third parties.
4. Using Epson products, you shall be responsible for safe design in your products; that is, your hardware, software, and/or systems shall be
designed enough to prevent any critical harm or damages to life, health or property, even if any malfunction or failure might be caused by
Epson products. In designing your products with Epson products, please be sure to check and comply with the latest information
regarding Epson products (including, but not limited to this document, specifications, data sheets, manuals, and Epson’s web site).
Using technical contents such as product data, graphic and chart, and technical information, including programs, algorithms and
application circuit examples under this document, you shall evaluate your products thoroughly both in stand-alone basis and within your
overall systems. You shall be solely responsible for deciding whether to adopt/use Epson products with your products.
5. Epson has prepared this document carefully to be accurate and dependable, but Epson does not guarantee that the information is always
accurate and complete. Epson assumes no responsibility for any damages you incurred due to any misinformation in this document.
6. No dismantling, analysis, reverse engineering, modification, alteration, adaptation, reproduction, etc., of Epson products is allowed.
7. Epson products have been designed, developed and manufactured to be used in general electronic applications and specifically
requires particular quality or extremely high reliability in order to refrain from causing any malfunction or failure leading to critical harm to
life and health, serious property damage, or severe impact on society, including, but not limited to listed below (“Specific Purpose”).
Therefore, you are strongly advised to use Epson products only for the Anticipated Purpose. Should you desire to purchase and use
Epson products for Specific Purpose, Epson makes no warranty and disclaims with respect to Epson products, whether express or
implied, including without limitation any implied warranty of merchantability or fitness for any Specific Purpose. Please be sure to
contact our sales representative in advance, if you desire Epson products for Specific Purpose:
Space equipment (artificial satellites, rockets, etc.)/ Transportation vehicles and their control equipment (automobiles, aircraft, trains,
ships, etc.) / Medical equipment/ Relay equipment to be placed on sea floor/ Power station control equipment / Disaster or crime
prevention equipment/Traffic control equipment/ Financial equipment
Other applications requiring similar levels of reliability as the above
8. Epson products listed in this document and our associated technologies shall not be used in any equipment or systems that laws and
regulations in Japan or any other countries prohibit to manufacture, use or sell. Furthermore, Epson products and our associated
technologies shall not be used for the purposes of military weapons development (e.g. mass destruction weapons), military use, or any
other military applications. If exporting Epson products or our associated technologies, please be sure to comply with the Foreign
Exchange and Foreign Trade Control Act in Japan, Export Administration Regulations in the U.S.A (EAR) and other export-related laws
and regulations in Japan and any other countries and to follow their required procedures.
9. Epson assumes no responsibility for any damages (whether direct or indirect) caused by or in relation with your non-compliance with the
terms and conditions in this document or for any damages (whether direct or indirect) incurred by any third party that you give, transfer or
assign Epson products.
10. For more details or other concerns about this document, please contact our sales representative.
11. Company names and product names listed in this document are trademarks or registered trademarks of their respective companies.
Page 35 / 35
Spec No : SGxxxxCAN_E_Ver2.16
