Temperature Compensated Crystal Oscillator (TCXO)
· Package size (2.5 mm × 2.0 mm × 0.8 mm)
· High stability TCXO
· Output waveform : Clipped sine wave
[ 1 ] Product Number / Product Name
(1-1) Product Number / Ordering Code
X1G0054210304xx
last 2 digits code(xx) define Quantity.
The standard is "27", 10 000 pcs/Reel.
(1-2) Product Name / Model Name
TG2520SMN 26.000000 MHz MCGNNM
[ 2 ] Operating Conditions
Specifications
Unit
Conditions
Min.
Typ.
Max.
Vcc
2.66
3.465
V
Supply voltage
GND
0
0
V
Operating temperature range
T_use
-40
+85
°C
Load_R
9
10
11
kΩ
Output load
Load_C
9
10
11
pF
DC-cut capacitor *
Cc
0.01
μF
* DC-cut capacitor is not included in this TCXO. Please attach an external DC-cut capacitor to the out pin.
Parameter
Symbol
(Vcc = 2.66 to 3.465 V, GND = 0.0 V, Load = 10 kΩ // 10 pF, T_use = +25 °C)
[ 3 ] Frequency Characteristics
fo
Min.
-
Specifications
Typ.
26
Max.
-
MHz
Frequency tolerance
f_tol
-0.5
-
+0.5
x10⁻⁶
Frequency tolerance *1
f_tol
-1.5
-
+1.5
x10⁻⁶
fo-Tc
-0.5
-
+0.5
x10⁻⁶
Parameter
Symbol
Output Frequency
Frequency / temperature
characteristics
Frequency / load coefficient
Frequency / voltage coefficient
Unit
fo-Load
fo-Vcc
Conditions
T_use = +25 °C ± 2 °C
Before reflow
T_use = +25 °C ± 2 °C
After 2 reflows *2
T_use = -40 °C to +85 °C
(Reference to +25 °C)
Load ± 10 %
Vcc ± 5 % *3
T_use = +25 °C first year
T_use = +25 °C 10 years
-0.1
+0.1
x10⁻⁶
-0.1
+0.1
x10⁻⁶
-0.5
+0.5
x10⁻⁶
Frequency aging *4
f_age
-3.5
+3.5
x10⁻⁶
*1 Include initial frequency tolerance and frequency deviation after reflow cycles.
*2 Measured in the elapse of 24 hours after reflow soldering.
*3 Vcc ± 5 % must be in operating supply voltage range (2.66 V to 3.465 V)
*4 Aging stability is estimated from environmental reliability tests; expected amount of the frequency variation.
(Vcc = 2.66 to 3.465 V, GND = 0.0 V, Load = 10 kΩ // 10 pF, T_use = +25 °C)
[ 4 ] Electrical Characteristics
Parameter
Current consumption
Output level
Symmetry
Start up time
Harmonics
Symbol
Icc
Vp-p
SYM
Min.
0.8
45
Specifications
Typ.
50
Max.
1.5
55
-
-
-
Unit
Conditions
mA
V
%
Peak to peak voltage
GND level (DC-cut)
2.0
ms
Until frequency has been reached
within ±0.5 x 10⁻⁶ of final freq.
-
1.0
ms
Until output signal has been
reached min 90 % of final amp.
-
-5.0
dBc
3rd harmonics
t_sta
-
[ For other general specifications, please refer to the attached Full Data Sheet below ]
High stability and Low phase noise temperature compensated crystal oscillator (TCXO)
Product name : TG2016SMN / TG2520SMN
Features
• High stability
• Frequency range
: 10 MHz to 55 MHz
• Output
: Clipped Sine
• Supply voltage
: 1.7 V to 3.63 V
• Frequency / temperature characteristic
-6
• Operating temperature
• Phase Noise
: ±0.5 x10 Max.
: -40 °C to +85 °C
: -161 dBc/Hz
TG2016SMN
(2.0 × 1.6 × 0.73 mm)
TG2520SMN
(2.5 × 2.0 × 0.8 mm)
(fo = 26 MHz, 100 kHz offset) Description
Applications
• GNSS
• RF
• Wireless communication devices
• LTE, WiMAX, Wi-Fi, W-LAN
• IoT etc..
Outline dimensions
TG2016SMN
2.0±0.15
#4
#3
#1
#2
TG2016SMN / TG2520SMN are high stability and low phase
noise TCXOs using an Epson-developed and fabricated IC
and MHz fundamental crystal .
The phase noise is the lowest of Epson’s compact TCXO
products lineup, making it an ideal reference clock for GNSS
and other wireless communication devices.
TG2520SMN
Characteristics
Frequency / temperature characteristics
1.58±0.1
#2
0.40±0.1
#1
1.18±0.1
C0.15
0.73±0.07
(0.27)
(0.25)
1.6±0.15
fo = 26 MHz, n = 40 pcs
#4
Frequency slope
#3
1.2±0.1
fo = 26 MHz, n = 40 pcs
Pin information
Pin #
1
2
3
4
Connection
N.C. (TCXO)
Vc (VC-TCXO)
GND
OUT
VCC
Page 2 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
[ 1 ] Product Number / Product Name
(1) Product Name (Standard Form)
①Model (TG2016, TG2520) ②Output (S: Clipped sine) ③Frequency ④Supply voltage (Refer to symbol table)
⑤Frequency / temperature characteristics (C: ±0.5 × 10-6 Max., F: ±2.0 × 10-6 Max.) ⑥Operating temperature (G: -40 °C to +85 °C)
⑦Standby function (N: Non) ⑧VC function(Refer to symbol table, N: Non for TCXO) ⑨Internal identification code ("M" is default)
(2) Product Number / Ordering Code
Frequency
[MHz]
Please refer to the web site for the latest information
Part number
TG2520SMN (Size: 2.5 x 2.0 mm)
TG2016SMN (Size: 2.0 x 1.6 mm)
±0.5 x10-6 (-40 °C to +85 °C), without Vc function
±0.5 x10-6 (-40 °C to +85 °C), without Vc function
VCC = 1.8 V
VCC = 2.8 V to 3.63 V
VCC = 1.8 V
VCC = 2.8 V to 3.63 V
Suffix: ECGNNM
Suffix: MCGNNM
Suffix: ECGNNM
Suffix: MCGNNM
16
X1G005421020827
X1G005421030827
X1G005441020825
X1G005441030825
16.368
X1G005421020127
X1G005421030127
X1G005441020125
X1G005441030125
16.369
X1G005421020227
X1G005421030227
X1G005441020225
X1G005441030225
19.2
X1G005421020327
X1G005421030327
X1G005441020325
X1G005441030325
20
X1G005421021127
X1G005421031127
X1G005441021125
X1G005441031125
24
X1G005421021227
X1G005421031227
X1G005441021225
X1G005441031225
25
X1G005421021327
X1G005421031327
X1G005441021325
X1G005441031325
26
X1G005421020427
X1G005421030427
X1G005441020425
X1G005441030425
27
X1G005421021427
X1G005421031427
X1G005441021425
X1G005441031425
27.6
X1G005421022127
X1G005421032127
X1G005441022125
X1G005441032125
30
X1G005421021527
X1G005421031527
X1G005441021525
X1G005441031525
32
X1G005421020527
X1G005421030527
X1G005441020525
X1G005441030525
38.4
X1G005421020627
X1G005421030627
X1G005441020625
X1G005441030625
40
X1G005421020727
X1G005421030727
X1G005441020725
X1G005441030725
48
X1G005421021627
X1G005421031627
X1G005441021625
X1G005441031625
52
X1G005421022027
X1G005421032027
X1G005441022025
X1G005441032025
Page 3 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
[ 2 ] Absolute maximum ratings
Parameter
Symbol
Supply voltage
Frequency control voltage
Vcc-GND
Vc-GND
Min.
-0.5
-0.5
Storage temperature range
T_stg
-40
Specifications
Typ.
Max.
+4.0
Vcc + 0.5
-
+90
Unit
V
V
°C
Conditions
Vc Terminal
Storage as single
product
[ 3 ] Recommended operating conditions
Specifications
Unit
Conditions
Min.
Typ.
Max.
1.7
1.8
1.9
V
Vcc = 1.8 V ± 0.1 V
-5 %
2.8
+5 %
V
Vcc = 2.8 V ± 5 %
Supply voltage
Vcc
-5 %
3.0
+5 %
V
Vcc = 3.0 V ± 5 %
-5 %
3.3
+5 %
V
Vcc = 3.3 V ± 5 %
Supply voltage
GND
0
0
V
GND
N.C
－
V
Vc Terminal / TCXO
0.3
0.9
1.5
V
Vc = 0.9 V ± 0.6 V
Frequency control voltage
Vc
0.4
1.4
2.4
V
Vc = 1.4 V ± 1.0 V
0.5
1.5
2.5
V
Vc = 1.5 V ± 1.0 V
0.65
1.65
2.65
V
Vc = 1.65 V ± 1.0 V
Operating temperature range
T_use
-40
+25
+85
°C
Load_R
9
10
11
kΩ
Output load
Load_C
9
10
11
pF
Cc
0.01
μF
DC-cut capacitor *
* DC-cut capacitor is not included in this TCXO. Please attach an external DC-cut capacitor to the out pin.
Parameter
Symbol
[ 4 ] Frequency characteristics
(VCC = Typ., Vc = Typ., Load = 10 kΩ // 10 pF, T_use = +25 °C)
(4-1) Frequency characteristics
Parameter
Output Frequency
Frequency tolerance(before
reflow)
Frequency tolerance(after
reflow) *
Frequency / temperature
characteristics
Frequency / load coefficient
Frequency / voltage coefficient
Frequency aging_1year ***
Frequency aging_3year
Frequency aging_5year
Frequency aging_10year
Frequency aging_1year ***
Frequency aging_3year
Frequency aging_5year
Frequency aging_10year
Symbol
fo
Min.
10
Specifications
Typ.
-
Unit
Max.
55
16, 16.368, 16.369, 19.2, 20, 24, 25, 26,
27, 27.6, 30, 32, 38.4, 40, 48, 50, 52
MHz
f_tol
-0.5
-
+0.5
x10⁻⁶
f_tol
-1.5
-
+1.5
x10⁻⁶
fo-Tc
-0.5
-
+0.5
x10⁻⁶
fo-Load
fo-Vcc
f_age_1y
f_age_3y
f_age_5y
f_age_10y
f_age_1y
f_age_3y
f_age_5y
f_age_10y
-0.1
-0.1
-0.5
-1.5
-2.0
-3.5
-1.5
-2.5
-3
-5
-
+0.1
+0.1
+0.5
+1.5
+2.0
+3.5
+1.5
+2.5
+3
+5
x10⁻⁶
x10⁻⁶
x10⁻⁶
x10⁻⁶
x10⁻⁶
x10⁻⁶
x10⁻⁶
x10⁻⁶
x10⁻⁶
x10⁻⁶
Conditions
Standard Frequency
T_use = +25 °C ± 2 °C
Before reflow
T_use = +25 °C ± 2 °C
After 3 reflows *
T_use = -40 °C to +85 °C
(Reference to +25 °C)
Load ± 10 %
Vcc ± 5 % **
10 MHz,
12 MHz < fo < 20 MHz,
24 MHz < fo < 40 MHz,
10 MHz < fo < 12 MHz,
20 MHz < fo < 24 MHz,
40 MHz < fo < 55 MHz
* Measured in the elapse of 2 hours after reflow soldering.
** Vcc ±5 % must be in operating supply voltage range (1.7 V to 3.63 V)
*** Aging stability is estimated from environmental reliability tests; expected amount of the frequency variation.
This does not intend to guarantee the product-life cycle
Page 4 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
(VCC = Typ., Vc = Typ., Load = 10 kΩ // 10 pF, T_use = +25 °C)
(4-2) Frequency control characteristics *VC-TCXO only
Parameter
Symbol
Min.
-
Frequency control range
Input impedance
Frequency change polarity
Specifications
Typ.
-
-5.0
Zin
-
x10⁻⁶
500
Positive polarity
-
kΩ
-
Vc-GND(DC)
(VCC = Typ., Vc = Typ., Load = 10 kΩ // 10 pF, T_use = +25 °C)
Symbol
Specifications
Typ.
-
Max.
1.5
1.8
2.0
2.1
1.0
Start up time
t_str
-
-
2.0
40
-
50
-66
-94
-120
-142
-157
-161
-163
0.050
0.014
0.005
60
-10.0
-
Phase noise fo = 26 MHz *
Vc = 0.9 V + 0.6 V at Vcc = 1.8 V
Vc = 1.4 V + 1.0 V at Vcc = 2.8 V
Vc = 1.5 V + 1.0 V at Vcc = 3.0 V
Vc = 1.65 V +1.0 V at Vcc = 3.3 V
-
Vpp
t_str
Symmetry
Harmonics
x10⁻⁶
-
Output voltage
Start up time
Frequency drift rate
Conditions
Vc = 0.9 V - 0.6 V at Vcc = 1.8 V
Vc = 1.4 V - 1.0 V at Vcc = 2.8 V
Vc = 1.5 V - 1.0 V at Vcc = 3.0 V
Vc = 1.65 V - 1.0 V at Vcc = 3.3 V
+5.0
Min.
0.8
-
Current consumption
Unit
f_cont
[ 5 ] Electrical characteristics
Parameter
Max.
Icc
fo-dfift
SYM
-
L(f)
Unit
mA
mA
mA
mA
Vpp
ms
ms
x10⁻⁶
%
dBc
dBc/Hz
Conditions
10 MHz < fo < 26 MHz
26 MHz < fo < 40 MHz
40 MHz < fo < 50 MHz
50 MHz < fo < 55 MHz
Peak to peak voltage
Until output signal has been
reached min 90% of final amp.
Until frequency has been reached
within ±0.5 x 10⁻⁶ of final
frequency.
from 0.1 s to 0.6 s
from 0.6 s to 1.6 s
from 1.6 s and up to 40 s
GND level (DC-cut)
1 Hz offset
10 Hz offset
100 Hz offset
1 kHz offset
10 kHz offset
100 kHz offset
1 MHz offset
* For other frequencies, refer to Charts (6-8), Phase noise
Page 5 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
[ 6 ] Characteristic data
(6-1) "Frequency / temperature characteristics" & "Frequency slope"
16.368 MHz (n = 40 pcs)
19.2 MHz (n = 40 pcs)
24 MHz (n = 40 pcs)
26 MHz (n = 40 pcs)
Page 6 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
32 MHz (n = 40 pcs)
38.4 MHz (n = 40 pcs)
48 MHz (n = 40 pcs)
52 MHz (n = 40 pcs)
Page 7 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
(6-2) "Frequency / load coefficient" & "Frequency / voltage coefficient"
26 MHz
55 MHz
(6-3) Frequency aging
*Aging stability is estimated from environmental reliability tests; expected amount of the frequency variation.
This does not intend to guarantee the product-life cycle.
(6-4) G-sensitivity (26 MHz)
Page 8 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
(6-5) Frequency control range (26 MHz, T_use = 25 °C, VC-TCXO only)
(6-6) "Current consumption" & "Output voltage peak to peak" (T_use = 25 °C)
(6-7) Start up time (T_use = 25 °C, X axis Scale = 0.2 msec/div)
26 MHz
40 MHz
Page 9 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
(6-8) Phase noise
(1) fo = 16 MHz, T_use = +25 °C, n = 5 pcs
(2) fo = 16.368 MHz, T_use = +25 °C, n = 5 pcs
(3) fo = 16.369 MHz, T_use = +25 °C, n = 5 pcs
(4) fo = 19.2 MHz, T_use = +25 °C, n = 5 pcs
(5) fo = 20 MHz, T_use = +25 °C, n = 5 pcs
(6) fo = 24 MHz, T_use = +25 °C, n = 5 pcs
(7) fo = 25 MHz, T_use = +25 °C, n = 5 pcs
(8) fo = 26 MHz, T_use = +25 °C, n = 5 pcs
Page 10 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
(6-8) Phase noise
(9) fo = 27 MHz, T_use = +25 °C, n = 5 pcs
(10) fo = 27.6 MHz, T_use = +25 °C, n = 5 pcs
(11) fo = 30 MHz, T_use = +25 °C, n = 5 pcs
(12) fo = 32 MHz, T_use = +25 °C, n = 5 pcs
(13) fo = 38.4 MHz, T_use = +25 °C, n = 5 pcs
(14) fo = 40 MHz, T_use = +25 °C, n = 5 pcs
(15) fo = 48 MHz, T_use = +25 °C, n = 5 pcs
(16) fo = 52 MHz, T_use = +25 °C, n = 5 pcs
Page 11 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
(6-9) Short term stability [ADEV] (26 MHz, n = 18 pcs)
Page 12 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
[ 7 ] Test circuit
(7-1) Output Load : Load = 10 kΩ // 10 pF
DC-cut
Capacitor
(1)TCXO connection example
Supply
Voltage
Vcc
OUT
N.C.
GND
By-pass
Capacitor
Load_C
Load_R
0.01μF
to
0.01
F
to0.1
0.1μF
DC-cut
Capacitor
(2)VC-TCXO connection example
Supply
Voltage
Test Point
By-pass
Capacitor
Vcc
OUT
Vc
GND
Load_C
0.01μF
to
0.01
0.1
to
0.1F
μF
Test Point
Load_R
Control
Voltage
(7-2) Current consumption
DC-cut
Capacitor
(1)TCXO connection example
A
Supply
Voltage
Vcc
OUT
N.C.
GND
By-pass
Capacitor
0.01μF
to
0.01
to
0.1μF
0.1
F
Load_C
DC-cut
Capacitor
(2)VC-TCXO connection example
A
Supply
Voltage
By-pass
Capacitor
0.01μF
to
0.01
F
to0.1
0.1μF
Load_R
Vcc
OUT
Vc.
GND
Load_C
Load_R
Control
Voltage
(7-3) Conditions
(1) Oscilloscope: Impedance Min. 1 MΩ
Input capacitance Max. 10 pF
Band width Min. 300 MHz
Impossible to measure both frequency and wave form at the same time.
(In case of using oscilloscope's amplifier output, possible to measure both at the same time.)
(2) Load_C includes probe capacitance.
(3) A capacitor (By-pass: 0.01 µF to 0.1 µF) is placed between VCC and GND,and closely to TCXO.
(4) Use the current meter whose internal impedance value is small.
(5) Power Supply
Impedance of power supply should be as low as possible.
Page 13 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
[ 8 ] Outline drawing / Recommended foot print
(1)TG2016SMN
2.0±0.15
#3
#1
#2
unit : mm
1.13
1.6±0.15
0.73±0.07
(0.27)
(0.25)
1.58±0.1
#4
1.65
Pin #
Connection
N.C. (TCXO)
1
Vc (VC-TCXO)
2
GND
3
OUT
VCC
4
Please keep “N.C.” pin OPEN condition
or GND connection.
"N.C." pin doesn’t work as a ground pin.
#2
#3
1.2±0.1
#2
#1
0.40±0.1
#1
1.18±0.1
C0.15
#3
0.75
#4
0.6
#4
For stable operation, please add a bypass
capacitor(0.01 μF to 0.1 μF) between Vcc and GND.
Please place it as close to TCXO as possible.
Terminal coating : Au plating
Please do not place any pattern between
footprint pads.
(2)TG2520SMN
#4
#3
0.8
#3
unit : mm
#1
#2
#1
#4
(0.55)
1.5±0.1
0.6±0.1
(0.75)
#2
C0.2
#2
Connection
N.C (TCXO)
1
Vc (VC-TCXO)
2
GND
3
OUT
VCC
4
Please keep “N.C.” pin OPEN condition
or GND connection.
"N.C." pin doesn’t work as a ground pin.
0.5±0.1
#1
2.1
Pin #
0.8±0.1
(0.38)
2.5±0.2
1.4
2.0±0.2
1.0
#4
For stable operation, please add a bypass
capacitor(0.01 μF to 0.1 μF) between Vcc and GND.
Please place it as close to TCXO as possible.
#3
Terminal coating : Au plating
Please do not place any pattern between
footprint pads.
Page 14 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
[ 9 ] Marking
TG2016SMN / TG2520SMN common
【Model ID Example】
(1) 1Pin Mark
(2) Arbitrary marking area (2digits)
(3) Lot No. (3digits)
(4) model ID
→
(5) Image recognition mark
6xx
product Freq.[MHz]
(4)model ID
TG2016SMN
16.368
6A0
TG2016SMN
16.369
6A1
TG2016SMN
19.2
6A2
TG2016SMN
26
6A3
TG2016SMN
32
6A4
TG2016SMN
38.4
6A5
TG2016SMN
40
6A6
[ 10 ] Moisture Sensitivity Level , Electro-Static Discharge
(10-1) Moisture Sensitivity Level(MSL)
Specifications
LEVEL1
Parameter
MSL
Conditions
JEDEC J-STD-020D
(10-2) Electro-Static Discharge(ESD)
Specifications
2 000 V Min.
200 V Min.
Parameter
Human Body Model(HBM)
Machine Model(MM)
Conditions
EIAJ ED-4701-1 C111A, 100 pF, 1.5 kΩ, 3 times
EIAJ ED-4701-1 C111, 200 pF, 0 Ω, 1 time
[ 11 ] Reflow profile (follow to IPC / JEDEC J-STD-020D.1)
Temperature [ C ]
300
TP
; +260 C
+255 C
250
200
150
TL
; +217 C
Ts max ; +200 C
Ts min ; +150 C
Avg. Ramp-up
3 C / s Max.
tp ; 20 s
tL
60 s to 150 s
( +217 C over )
to 40 s
Ramp-down
6 C / s Max.
ts
60 s to 180 s
( +150 C to +200 C )
100
50
Time +25 C to Peak
0
60
120 180 240 300 360 420 480 540 600 660 720 780
Time [ s ]
Page 15 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
[ 12 ] Packing information
TG2016SMN
(12-1) Product number last 2 digits code(xx) define Quantity. The standard is "25", 12 000 pcs/Reel.
X1G005441xxxxxx
(12-2) Taping specification
Subject to EIA-481 & IEC-60286
(1) Tape dimensions TE0804L
Material of the Carrier Tape : PS
Material of the Top Tape
2 .25±0 .1
Epson
Epson
φ1 .0
4 .0±0 .1
0 .25±0 .05
8 .0±0 .2
2 .0±0 .1
3 .5±0 .1
+0 .1
φ1 .5 0
unit : mm
1 .0±0 .1
1 .75±0 .1
4 .0 ±0 .1
: PET+PE
+0 .1
0
1 .85±0 .1
User direction of feed
TG2520SMN
(12-1) Product number last 2 digits code(xx) define Quantity. The standard is "27", 10 000 pcs/Reel.
X1G005421xxxxxx
(12-2) Taping specification
Subject to EIA-481 & IEC-60286
(1) Tape dimensions TE0804L
Material of the Carrier Tape : PS
Material of the Top Tape : PET+PE
unit : mm
4.00.1
4.00.1
Epson
Epson
φ1.0+0.1/-0
1.150.1
0.250.005
2.80.1
2.00.1
8.00.2
+0.1
-0
3.50.1
φ1.5
1.750.1
10 P: 400.1
2.30.1
User direction of feed
TG2016SMN / TG2520SMN Common
(2) Reel dimensions
Center material
: PS
Material of the Reel : PS
13.41. 0
φ100.0
φ13.00. 2
φ330.0 2 . 0
unit : mm
9.41.0
2.0 0 . 5
Page 16 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
[ 13 ] Handling precautions
Prior to using this product, please carefully read the section entitled “Precautions” on our Web site
( https://www5.epsondevice.com/en/information/#precaution ) for instructions on how to handle and use
the product properly to ensure optimal performance of the product in your equipment.
Before using the product under any conditions other than those specified therein,
please consult with us to verify and confirm that the performance of the product will not be negatively
affected by use under such conditions.
In addition to the foregoing precautions, in order to avoid the deteriorating performance of the product,
we strongly recommend that you DO NOT use the product under ANY of the following conditions:
(1) Do not expose this product to excessive mechanical shock or vibration.
(2) This product can be damaged by mechanical shock during the soldering process depending on the equipment
used, process conditions, and any impact forces experienced. Always follow appropriate procedures,
particularly when changing the assembly process in anyway and be sure to follow applicable process
qualification standards before starting production.
(3) These devices are sensitive to ESD, please use appropriate precautions during handling, assembly,
test, shipment, and installation.
(4) This product contains semiconductor content that should not be exposed to electromagnetic waves.
(5) The use of ultrasonic technology for cleaning, bonding, etc. can damage the Xtal unit inside this product.
Please carefully check for this consideration before using ultrasonic equipment for volume production with this product.
(6) Noise and ripple on the power supply may have undesirable affects on operation and cause degradation
of phase noise characteristics. Evaluate the operation of this device with appropriate power supplies carefully before use.
(7) When applying power, ensure that the supply voltage increases monotonically for proper operation.
On power down, do not reapply power until the supplies, bypass capacitors, and any bulk capacitors
are completely discharged since that may cause the unit to malfunction.
(8) Aging specifications are estimated from environmental reliability tests and expected frequency variation
over time. They do not provide a guarantee of aging over the product lifecycle.
(9) The metal cap on top of the device is directly connected to the GND terminal (pin #2). Take necessary
precautions to prevent any conductor not at ground potential from contacting the cap as that could cause a short circuit to GN
(10)Do not route any signal lines, supply voltage lines, or GND lines underneath the area where the oscillators
are mounted including any internal layers and on the opposite side of the PCB.
To avoid any issues due to interference of other signal lines, please take care not to place signal lines
near the product as this may have an adverse affect on the performance of the product.
(11)A bypass capacitor of the recommended value(s) must be connected between the VCC and GND terminals
of the product. Whenever possible, mount the capacitor(s) on the same side of the PCB and as close to the
product as possible to keep the routing traces short.
(12)Power supply connections to Vcc and GND pins should be routed as thick as possible while keeping the
high frequency impedance low in order to get the best performance.
(13) The use of a filter or similar element in series with the power supply connections to protect from
electromagnetic radiation noise may increase the high frequency impedance of the power supply line
and may cause the oscillator to not operate properly. Please verify the design to ensure sufficient
operational margin prior to use.
(14) Keep PCB routing from the output terminal(s) to the load as short as possible for best performance.
(15) Do not short the output to GND as that will damage the product. Always use with an appropriate
load resistor connected.
(16) Product failures during the warranty period only apply when the product is used according to the
recommended operating conditions described in the specifications. Products that have been opened
for analysis or damaged will not be covered. It is recommended to store and use in normal temperature
and humidity environments described in the specifications to ensure frequency accuracy and prevent
moisture condensation. If the product is stored for more than one year, please confirm the pin solderability prior to use.
(17) If the oscillation circuit is exposed to condensation, the frequency may change or oscillation may stop.
Do not use in any conditions where condensation occurs.
(18) Do not store or use the product in an environment where it can be exposed to chemical substances
that are corrosive to metal or plastics such as salt water, organic solvents, chemical gasses, etc.
Do not use the product when it is exposed to sunlight, dust, corrosive gasses, or other materials for long periods of time.
(19) When using water-soluble solder flux make sure to completely remove the flux residue after soldering.
Pay particular attention when the residues contain active halogens which will negatively affect the
product and its performance.
(20) Do not touch the surface of the IC with tweezers or other hard tools.
(21) Do not use adhesives with this product as this will cause the oscillation to stop if the IC is damaged by
adhesive. This product uses an underfill material on the bottom side of package where adhesive near
the bottom side may cause the TCXO to be damaged by thermal expansion.
Page 17 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
PROMOTION OF ENVIRONMENTAL MANAGEMENT SYSTEM
CONFORMING TO INTERNATIONAL STANDARDS
At Seiko Epson, all environmental initiatives operate under the
Plan-Do-Check-Action (PDCA) cycle designed to achieve continuous
improvements. The environmental management system (EMS)
operates under the ISO 14001 environmental management standard.
All of our major manufacturing and non-manufacturing sites, in
Japan and overseas, completed the acquisition of ISO 14001 certification.
ISO 14000 is an international standard for environmental
management that was established by the International Standards
Organization in 1996 against the background of growing concern
regarding global warming, destruction of the ozone layer, and
global deforestation.
WORKING FOR HIGH QUALITY
In order provide high quality and reliable products and services
than meet customer needs, Seiko Epson made early efforts towards
obtaining ISO9000 series certification and has acquired ISO9001 for
all business establishments in Japan and abroad. We have also
acquired IATF 16949 certification that is requested strongly by major
manufacturers as standard.
IATF 16949 is the international standard that added the sector-specific
supplemental requirements for automotive industry based on ISO9001.
■ Explanation of marks used in this datasheet
●Pb free.
●Complies with EU RoHS directive.
*About the products without the Pb-free mark.
Contains Pb in products exempted by EU RoHS directive
(Contains Pb in sealing glass, high melting temperature type solder or other)
NOTICE: PLEASE READ CAREFULLY BELOW BEFORE THE USE OF THIS DOCUMENT ©Seiko Epson Corporation 2020
1. The content of this document is subject to change without notice. Before purchasing or using Epson products, please contact with sales
representative of Seiko Epson Corporation (“Epson”) for the latest information and be always sure to check the latest information
published on Epson’s official web sites and resources.
2. This document may not be copied, reproduced, or used for any other purposes, in whole or in part, without Epson’s prior consent.
3. Information provided in this document including, but not limited to application circuits, programs and usage, is for reference purpose only.
Epson makes no guarantees against any infringements or damages to any third parties’ intellectual property rights or any other rights
resulting from the information. This document does not grant you any licenses, any intellectual property rights or any other rights with
respect to Epson products owned by Epson or any third parties.
4. Using Epson products, you shall be responsible for safe design in your products; that is, your hardware, software, and/or systems shall be
designed enough to prevent any critical harm or damages to life, health or property, even if any malfunction or failure might be caused by
Epson products. In designing your products with Epson products, please be sure to check and comply with the latest information
regarding Epson products (including, but not limited to this document, specifications, data sheets, manuals, and Epson’s web site).
Using technical contents such as product data, graphic and chart, and technical information, including programs, algorithms and
application circuit examples under this document, you shall evaluate your products thoroughly both in stand-alone basis and within your
overall systems. You shall be solely responsible for deciding whether to adopt/use Epson products with your products.
5. Epson has prepared this document carefully to be accurate and dependable, but Epson does not guarantee that the information is always
accurate and complete. Epson assumes no responsibility for any damages you incurred due to any misinformation in this document.
6. No dismantling, analysis, reverse engineering, modification, alteration, adaptation, reproduction, etc., of Epson products is allowed.
7. Epson products have been designed, developed and manufactured to be used in general electronic applications and specifically
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life and health, serious property damage, or severe impact on society, including, but not limited to listed below (“Specific Purpose”).
Therefore, you are strongly advised to use Epson products only for the Anticipated Purpose. Should you desire to purchase and use
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contact our sales representative in advance, if you desire Epson products for Specific Purpose:
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prevention equipment/Traffic control equipment/ Financial equipment
Other applications requiring similar levels of reliability as the above
8. Epson products listed in this document and our associated technologies shall not be used in any equipment or systems that laws and
regulations in Japan or any other countries prohibit to manufacture, use or sell. Furthermore, Epson products and our associated
technologies shall not be used for the purposes of military weapons development (e.g. mass destruction weapons), military use, or any
other military applications. If exporting Epson products or our associated technologies, please be sure to comply with the Foreign
Exchange and Foreign Trade Control Act in Japan, Export Administration Regulations in the U.S.A (EAR) and other export-related laws
and regulations in Japan and any other countries and to follow their required procedures.
9. Epson assumes no responsibility for any damages (whether direct or indirect) caused by or in relation with your non-compliance with the
terms and conditions in this document or for any damages (whether direct or indirect) incurred by any third party that you give, transfer or
assign Epson products.
10. For more details or other concerns about this document, please contact our sales representative.
11. Company names and product names listed in this document are trademarks or registered trademarks of their respective companies.
Page 18 / 18
Spec No : TG2016/2520SMN_EN_ver.1.2
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