Crystal oscillator
CRYSTAL OSCILLATOR (Programmable)
OUTPUT: CMOS
Product Number (please contact us)
SG-8018CA: X1G00557xxxxx00
SG-8018CB: X1G00558xxxxx00
SG-8018CE: X1G00559xxxxx00
SG-8018CG: X1G00560xxxxx00
SG - 8018series
Frequency range : 0.67 MHz ~ 170 MHz (1 ppm Step)
Supply voltage : 1.62 V ~ 3.63 V
Function
: Output enable (OE) or Standby (ST
¯¯)
Frequency tolerance : ±50 ppm (-40 ºC ~ +105 ºC)
Include frequency aging(+25 ºC, 10 years)
Package
:2.5 x 2.0, 3.2 x 2.5, 5.0 x 3.2, 7.0 x 5.0 (mm)
PLL technology to enable short lead time
Available field oscillator programmer “SG-Writer II”
CG
2.5 x 2.0mm
CE
3.2 x 2.5mm
CB
5.0 x 3.2mm
CA
7.0 x 5.0mm
2.5x2.0mm
Specifications (characteristics)
Item
Symbol
Supply voltage
VCC
Output frequency range
Storage temperature
Operating temperature
Frequency tolerance*1
Specifications
1.80 V Typ.
2.50 V Typ.
fO
0.67 MHz ~ 170 MHz
-40 ºC ~ +125 ºC
T_use
-40 ºC ~ +105 ºC
f_tol
J: ±50 × 10
3.3 mA Max.
2.7 mA Typ.
5.5 mA Max.
5.8 mA Max.
4.7 mA Typ.
Output disable current
I_dis
Storage as single product.
-
-6
3.2 mA Max.
ICC
T_use = -40 ºC ~ +105 ºC
3.4 mA Max.
3.5 mA Max.
T_use = +105 ºC
2.9 mA Typ.
3.0 mA Typ.
T_use = +25 ºC
6.7 mA Max.
8.1 mA Max.
T_use = +105 ºC
5.7 mA Typ.
6.8 mA Typ.
T_use = +25 ºC
3.2 mA Max.
3.3 mA Max.
3.5 mA Max.
OE = GND, fO = 170 MHz
1.0 μA Max.
1.5 μA Max.
2.5 μA Max.
T_use = +105 ºC
0.3 μA Typ.
0.4 μA Typ.
0.5 μA Typ.
1.1 μA Typ.
T_use = +25 ºC
Symmetry
SYM
45 % ~ 55 %
VOH
90 % VCC Min.
VOL
10 % VCC Max.
Output voltage
(DC characteristics)
15 pF Max.
L_CMOS
VIH
70 % VCC Min.
VIL
30 % VCC Max.
Default
Rise and Fall
time
tr/tf
Fast
fO > 40 MHz
fO ≤ 40 MHz
1 μs Max.
Disable Time
t_stp
Enable Time
Resume Time
t_sta
1 μs Max.
t_res
3 ms Max.
t_str
Frequency aging
f_aging
OE or ST
¯¯
6.0 ns Max.
10.0 ns Max.
3 ms Max.
This is included in frequency tolerance specification.
ST
¯¯ = GND
50 % VCC Level
IOH/IOL Conditions
[mA]
Rise/Fall time
VCC
*A
*B
*C
*D
-2.5 -3.5 -4.0 -5.0
Default (fO > 40 MHz), IOH
Fast
IOL
2.5 3.5 4.0 5.0
IOH
-1.5 -2.0 -2.5 -3.0
Default (fO ≤ 40 MHz)
IOL
1.5 2.0 2.5 3.0
IOH
-1.0 -1.5 -2.0 -2.5
Slow
IOL
1.0 1.5 2.0 2.5
*A: 1.62 V ~ 1.98 V, *B: 1.98 V ~ 2.20 V,
*C: 2.20 V ~ 2.80 V, *D: 2.70 V ~ 3.63 V
-
3.0 ns Max.
3.0 ns Max.
Slow
Start-up time
No load, fO = 170 MHz
0.9 μA Max.
I_std
Input voltage
No load, fO = 20 MHz
3.2 mA Max.
Standby current
Output load condition
-
1.62 V ~ 1.98 V 1.98 V ~ 2.20 V 2.20 V ~ 2.80 V 2.70 V ~ 3.63 V
T_stg
Current consumption
Conditions/Remarks
3.30 V Typ.
20 % - 80 % VCC,
fO = 0.67 MHz ~ 170 MHz L_CMOS = 15 pF
fO = 0.67 MHz ~ 20 MHz
Measured from the time OE or ST
¯¯ pin crosses 30 %
VCC
Measured from the time OE pin crosses 70 % VCC
Measured from the time ST
¯¯ pin crosses 70 % VCC
Measured from the time VCC reaches its rated
minimum value, 1.62 V
+25 °C, 10 years
*1 Frequency tolerance includes initial frequency tolerance, temperature variation, supply voltage variation, reflow drift, load drift and aging (+25 ºC, 10 years).
Pin description
Pin
Name
I/O type
OE
Input
Output enable
ST
¯¯
Input
Standby
GND
OUT
VCC
Power
Output
Power
1
2
3
4
Ground
Clock output
Power supply
High:
Low:
High:
Low:
Function
Specified frequency output from OUT pin
Out pin is low (weak pull down), only output driver is disabled.
Specified frequency output from OUT pin
Out pin is low (weak pull down),
Device goes to standby mode. Supply current reduces to the least as I_std.
Crystal oscillator
Product Name
SG-8018CG 170.000000MHz T J H P A
①
②
③
④⑤⑥⑦⑧
②Package type
④Supply voltage
⑥Operating temperature
⑧ Rise/Fall time
CA: 7.0 mm x 5.0 mm
T: 1.8 V ~ 3.3 V Typ.
H: -40 °C ~ +105 °C
A: Default
⑤Frequency tolerance
⑦Function
CB: 5.0 mm x 3.2 mm
①Model, ②Package type,
CE: 3.2 mm x 2.5 mm
③Frequency, ④Supply voltage,
CG: 2.5 mm x 2.0 mm
⑤Frequency tolerance, ⑥Operating temperature,
⑦Function, ⑧Rise/Fall time
External dimensions
B: Fast
J: 50 x
10-6
C: Slow
P: Output Enable
S: Standby
(Unit: mm)
Footprint (Recommended)
SG-8018CG
SG-8018CG
SG-8018CE
SG-8018CE
SG-8018CB
SG-8018CB
SG-8018CA
SG-8018CA
(Unit: mm)
■Notes:
In order to achieve optimum jitter performance, the 0.1 μF capacitor between V CC and GND should be placed. It is also
recommended that the capacitors are placed on the device side of the PCB, as close to the device as possible and connected
together with short wiring pattern.
Crystal oscillator
Specification Graph(Typical supplemental specification. Unless otherwise specified T_use = 25 ℃, L_CMOS = 15pF)
Current Consumption
fo = 20MHz, L_CMOS = No load
4.0
Icc (mA)
3.6
3.2
2.8
Vcc = 3.3 V
2.4
Vcc = 2.5 V
Vcc = 1.8 V
2.0
-40
-20
0
20
40
60
Temperature (℃)
Output disable current
■Notes:
Standby current
80
100
120
Crystal oscillator
Specification Graph(Typical supplemental specification. Unless otherwise specified T_use = 25 ℃, L_CMOS = 15pF)
Phase Jitter RMS
Phase Jitter RMS
(Integration bandwidth 12 k-20 MHz)
(Integration bandwidth 1.8 M-20 MHz)
80
50
Vcc = 3.3 V
Vcc = 2.5 V
Vcc = 1.8 V
40
Phase Jitter-RMS (ps)
Phase Jitter-RMS (ps)
70
Vcc = 3.3 V
Vcc = 2.5 V
Vcc = 1.8 V
60
50
40
30
30
20
10
0
0
20
40
60
80 100
fo (MHz)
120
140
160
180
0
20
40
60
80 100
fo (MHz)
120
140
160
180
Period Jitter RMS
40
Vcc = 1.8 V
Period Jitter RMS (ps)
Period Jitter RMS (ps)
Rise/Fall time = Slow
20
10
Rise/Fall time = Default
Rise/Fall time = Fast
30
Rise/Fall time = Slow
20
10
0
20
40
60
80 100
fo (MHz)
120
140
160
180
Rise/Fall time = Fast
30
Rise/Fall time = Slow
20
10
0
0
0
Vcc = 3.3 V
Rise/Fall time = Default
Rise/Fall time = Fast
30
40
Vcc = 2.5 V
Rise/Fall time = Default
Period Jitter RMS (ps)
40
0
20
40
60
80 100
fo (MHz)
120
140
160
0
180
20
40
60
80 100
fo (MHz)
120
140
160
180
Vcc = 1.8
3.3 V
Rise/Fall time = Default
Rise/Fall time = Fast
Rise/Fall time = Slow
0
20
40
60
80 100
fo (MHz)
120
140
160
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Vcc = 2.5
3.3 V
Rise/Fall time = Default
Rise/Fall time = Fast
Rise/Fall time = Slow
0
180
Period Jitter Peak - Peak (ps)
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Period Jitter Peak - Peak (ps)
Period Jitter Peak - Peak (ps)
Period Jitter Peak-Peak
20
40
60
80 100
fo (MHz)
120
140
160
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
180
Vcc = 3.3 V
Rise/Fall time = Default
Rise/Fall time = Fast
Rise/Fall time = Slow
0
20
40
60
80 100
fo (MHz)
120
140
160
180
Cycle-to-Cycle Jitter Peak-Peak
200
Rise/Fall time = Default
160
Rise/Fall time = Fast
140
Rise/Fall time = Slow
120
100
80
60
40
20
200
Vcc = 2.5 V
180
Rise/Fall time = Default
160
Rise/Fall time = Fast
140
Rise/Fall time = Slow
Cycle to Cycle Jitter Peak - Peak (ps)
Vcc = 1.8 V
180
Cycle to Cycle Jitter Peak - Peak (ps)
Cycle to Cycle Jitter Peak - Peak (ps)
200
120
100
80
60
40
20
0
0
0
■Notes:
20
40
60
80 100
fo (MHz)
120
140
160
180
Vcc = 3.3 V
180
Rise/Fall time = Default
160
Rise/Fall time = Fast
140
Rise/Fall time = Slow
120
100
80
60
40
20
0
0
20
40
60
80 100
fo (MHz)
120
140
160
180
0
20
40
60
80 100
fo (MHz)
120
140
160
180
Crystal oscillator
Specification Graph(Typical supplemental specification. Unless otherwise specified T_use = 25 ℃, L_CMOS = 15pF)
Rise/Fall Time (fo = 20 MHz)
Rise time L_CMOS = 5 pF
5
4.5
4
Tr/Tf mode = Slow
Tr/Tf mode = Default
Tr/Tf mode = Fast
4.5
4
3.5
Fall Time(ns)
3.5
Rise Time(ns)
Fall time L_CMOS = 5 pF
5
Tr/Tf mode = Slow
Tr/Tf mode = Default
Tr/Tf mode = Fast
3
3
2.5
2.5
2
2
1.5
1.5
1
1
0.5
0.5
0
0
1.5
2.0
2.5
3.0
1.5
3.5
2.0
Rise time L_CMOS = 15 pF
5
4
3.5
Tr/Tf mode = Slow
Tr/Tf mode = Default
Tr/Tf mode = Fast
4.5
4
3.5
3.5
Fall Time(ns)
Rise Time(ns)
3.0
Fall time L_CMOS = 15 pF
5
Tr/Tf mode = Slow
Tr/Tf mode = Default
Tr/Tf mode = Fast
4.5
2.5
Vcc (V)
Vcc (V)
3
2.5
3
2.5
2
1.5
2
1.5
1
1
0.5
0.5
0
0
1.5
2.0
2.5
Vcc (V)
3.0
3.5
1.5
2.0
2.5
3.0
3.5
Vcc (V)
■Notes:
frequency
0.67 M – 20 M
20 M – 40 M
40 M – 170 M
slow
See Slow
-
default
See Default
See Default
See Fast
fast
See Fast
See Fast
See Fast
Harmonics spectrum ( fo = 20 MHz )
20
①
10
③
⑤
0
⑦
⑨
⑪
Power (dBm)
-10
-20
-30
-40
-50
-60
-70
-80
0
40
80
120
160
200
240
280
320
360
400
frequency (MHz)
Harmonics comparison
Normalize to Vcc = 3.3V.
■Notes:
Normalize to Vcc = 3.3V.
Normalize to Rise/Fall time = “Fast”.
Crystal oscillator
ESD Rating
Test items
Breakdown voltage
Human Body Model (HBM)
Machine Model (MM)
Charged Device Model (CDM)
2000V
250V
750V
Device Marking (Standard specification)
Model
Factory Programmed Part Marking
170. A2
Field Programmable Part Marking
(Blank Samples)
A2
SG-8018CG
SG-8018CE
SG-8018CB
SG-8018CA
Simulation Model
・
IBIS Model is available upon request. Please contact us.
Information Required: Oscillator operating condition (i.e. Power Supply, Rise/Fall Time, Temperature)
Crystal oscillator
Device Material & Environmental Information
Model
Package
Dimensions
# of
Pins
SG-8018CG
SG-8018CE
SG-8018CB
SG-8018CA
2.5 x 2.0 x 0.7 mm
3.2 x 2.5 x 1.0 mm
5.0 x 3.2 x 1.1 mm
7.0 x 5.0 x 1.3 mm
4
4
4
4
Reference
Weight
(Typ.)
13 mg
25 mg
51 mg
143 mg
Terminal
Material
Terminal
Plating
W
W
W
W
Au
Au
Au
Au
Complies
With EU
RoHS
Yes
Yes
Yes
Yes
Pb
Free
MSL
Rating
Yes
Yes
Yes
Yes
1
1
1
1
Peak
Temp.
(Max)
260°C
260°C
260°C
260°C
SMD products Reflow profile(example)
The availability of the heat resistance for reflow conditions of JEDEC-STD-020D.01 is judged individually. Please inquire.
Temperature[C]
300
TP
;+260C OVER
+255C
250
TL
200
150
tp;at least 30s
Ramp-up rate
+3 °C/s Max.
;+217C
tL
Ramp-down rate
-6 °C/s Max.
Tsmax ;+200C
60sto150
Tsmin ;+150C
ts
60sto120s
100
50
Time +25CtoPeak
0
60
120
180
240 300
360 420
480
540
600
660 720 780
Time[s]
Pb free.
Complies with EU RoHS directive.
About the products without the Pb-free mark.
Contains Pb in products exempted by EU RoHS directive.
(Contains Pb in sealing glass, high melting temperature type solder or other.)
Standard Packing Specification
SMD products are packed in the shipping carton as below table in accordance with taping standards EIA-481 and IEC-60286
SG-8018CG
SG-8018CE
SG-8018CB
SG-8018CA
3000
2000
1000
1000
Φ180
Φ180
Φ180
Φ254
Φ60
Φ60
Φ60
Φ100
Marking
Marking
Standard Packing Quantity & Dimension(Unit mm)
Reel Dimension
Quantity
Model
(pcs/Reel)
a
b
Career Tape Dimension
W
A
B
C
D
9
9
13
17.5
4
4
8
8
5.25
5.25
7.25
9.25
8
8
12
16
1.15
1.4
1.4
2.3
Direction of
Feed (L= Left
Direction)
L
L
L
L
PROMOTION OF ENVIRONMENTAL MANAGEMENT SYSTEM
CONFORMING TO INTERNATIONAL STANDARDS
At Seiko Epson, all environmental initiatives operate under the
Plan-Do-Check-Action (PDCA) cycle designed to achieve continuous
improvements. The environmental management system (EMS)
operates under the ISO 14001 environmental management standard.
All of our major manufacturing and non-manufacturing sites, in
Japan and overseas, completed the acquisition of ISO 14001
certification.
ISO 14000 is an international standard for environmental
management that was established by the International
Standards Organization in 1996 against the background of
growing concern regarding global warming, destruction of
the ozone layer, and global deforestation.
WORKING FOR HIGH QUALITY
In order provide high quality and reliable products and services
than meet customer needs,
Seiko Epson made early efforts towards obtaining ISO9000 series
certification and has acquired ISO9001 for all business
establishments in Japan and abroad. We have also acquired ISO/TS
16949 certification that is requested strongly by major automotive
manufacturers as standard.
ISO/TS16949 is the international standard that added the
sector-specific supplemental requirements for automotive
industry based on ISO9001.
►Explanation of the mark that are using it for the catalog
►Pb free.
►Complies with EU RoHS directive.
*About the products without the Pb-free mark.
Contains Pb in products exempted by EU RoHS directive.
(Contains Pb in sealing glass, high melting temperature type solder or other.)
►Designed for automotive applications such as Car Multimedia, Body Electronics, Remote Keyless Entry etc.
►Designed for automotive applications related to driving safety (Engine Control Unit, Air Bag, ESC etc ).
Notice
•
•
•
•
•
•
This material is subject to change without notice.
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does not assume any liability for the occurrence of customer damage or infringing on any patent or copyright of a third party. This
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regulations and follow the procedures required by such laws and regulations.
You are requested not to use the products (and any technical information furnished, if any) for the development and/or manufacture of
weapon of mass destruction or for other military purposes. You are also requested that you would not make the products available to
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These products are intended for general use in electronic equipment. When using them in specific applications that require extremely
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