X1G005951000916

Crystal Oscillator (SPXO) · Package size (2.5 mm × 2.0 mm × 0.8 mm) · Fundamental mode SPXO · Output: CMOS · Conforms to AEC-Q200 · Reference weight Typ.14 mg X1G0048010073xx X1G0059510009xx [ 1 ] Product Number / Product Name / Marking (1-1) Product Number / Ordering Code X1G0059510009xx TJHA T J H A Last 2 digits code(xx) defines Quantity. The standard is "16", 3 000 pcs/Reel. (1-2) Product Name / Model Name SG2520CAA 25.000000 MHz TJHA 25 [ 2 ] Operating Range Parameter Supply voltage Operating temperature range CMOS load condition Symbol VCC GND T_use L_CMOS Specifications Min. 1.60 0 -40 - Typ. - [ 3 ] Frequency Characteristics Parameter Output frequency Frequency tolerance *1 Frequency aging Symbol fo f_tol f_age Unit Max. 3.63 0 +105 15 V V °C pF Conditions - (Unless stated otherwise [ 2 ] Operating Range) Specifications Min. -50 -3 Typ. 25.000000 - Unit Max. +50 +3 Conditions MHz - ×10-6 ×10-6 T_use +25 ºC, First year *1 Frequency tolerance includes Initial frequency tolerance, Frequency / temperature characteristics, Frequency / voltage coefficient and Frequency / load coefficient. [ 4 ] Electrical Characteristics Parameter (Unless stated otherwise [ 2 ] Operating Range) Symbol Specifications Unit I_std VOH VOL Min. 90 % Vcc - Typ. - Max. 5 2.7 3.3 10 % Vcc Rise time tr - - 3.5 ns Fall time tf - - 3.5 ns SYM VIH VIL 45 80 % Vcc - - 55 20 % Vcc 100 5 % V V ns ms Start-up time Current consumption Stand-by current Output voltage Symmetry Input voltage Output disable time (ST) Output enable time (ST) t_str ICC tstp_st tsta_st ms mA μA V V Conditions t = 0 at 90 % Vcc No load condition, Vcc = 3.3 V S̅T̅ = GND, Vcc = 3.3 V Ioʜ = -4 mA @Vcc = 3.3 V Ioʟ = 4 mA @Vcc = 3.3 V 20 % Vcc to 80 % Vcc Level, L_CMOS = 15 pF, Vcc = 1.8 V ± 10 % 80 % Vcc to 20 % Vcc Level, L_CMOS = 15 pF, Vcc = 1.8 V ± 10 % 50 % Vcc Level, L_CMOS ≤ 15 pF S̅T̅ terminal S̅T̅ terminal S̅T̅ terminal HIGH → LOW S̅T̅ terminal LOW → HIGH [ For other general specifications, please refer to the attached Full Data Sheet below ] 2023/6/15 1 / 18 Page Crystal oscillator for Automotive: SG2520CAA Features ● Crystal oscillator (SPXO) ● Frequency range: 19 standard frequencies (8 MHz to 54 MHz) ● Output: CMOS ● Supply voltage: 1.6 V to 3.63 V ● Operating temperature: -40 °C to +105 °C (2.5 × 2.0 × 0.8 mm) -40 °C to +125 °C Applications ● ADAS (Advanced Driver Assistance Systems): Camera, LiDAR (Light Detection and Ranging), radar, networking ● Automotive Infotainment System, audio, clock, meter, cluster, body control(BCM) Description Epson’s SG2520CAA is Simple Packaged Crystal Oscillator (SPXO) with CMOS output. This SPXO’s is ideal for automotive and high reliability applications, and conforms to AEC-Q200. This SPXO has low current consumption, wide operating voltage from 1.6 V to 3.63 V and wide operating temperature range from -40 °C to 125 °C. Outline Drawing and Terminal Assignment Pin # Connection #1 S̅T̅ #2 #3 #4 GND OUT VCC Function S̅T̅ terminal S̅T̅ function Osc. Circuit Output “H” or OPEN Oscillation Specified frequency: Enable “L” Oscillation stop High impedance: Disable GND terminal Output terminal VCC terminal Page 2 / 18 Spec No : SG2520CAA_E_Ver1.22 [ 1 ] Product Number / Product Name (1-1) Product Number (Please contact Epson for details) X1G005951xxxx16 (1-2) Product Name (Standard Form) SG2520 C AA 25.000000MHz T J H A ① ② ③ ④⑤⑥⑦ ①Model　②Output(C: CMOS)　③Frequency　④Supply voltage ⑤Frequency tolerance　⑥Operating temperature　⑦Internal identification code("A" is default) ④Supply voltage ⑤Frequency tolerance / ⑥Operating temperature T 1.8 V to 3.3 V Typ. JH ±50 × 10-6 / -40 °C to +105 °C K 2.5 V to 3.3 V Typ. LJ ±100 × 10-6 / -40 °C to +125 °C [ 2 ] Absolute Maximum Ratings Parameter Maximum supply voltage Input voltage Storage temperature range Symbol VCC Vin T_stg Specification Min. -0.3 -0.3 -55 Typ. - Max. 4 VCC + 0.3 +125 Unit V V °C Conditions S̅T̅ terminal [ 3 ] Operating Range Parameter Symbol Supply voltage Supply voltage VCC GND Operating temperature range T_use CMOS load condition L_CMOS Specification Min. 1.6 0.0 -40 -40 - Typ. 0.0 +25 +25 - Max. 3.63 0.0 +105 +125 15 Unit Conditions V V °C °C pF * Power supply startup time (0 %V CC → 90 %VCC) should be more than 150 μs * A 0.01 μF or over bypass capacitor should be connected between V CC and GND pins located close to the device [ 4 ] Frequency Characteristics Parameter Output frequency (Unless stated otherwise [ 3 ] Operating Range) Symbol fo Frequency tolerance *1 f_tol Frequency aging f_age Specification Min. Typ. Max. 8, 10, 11.2896, 12, 12.288, 14.7456, 16.6666, 20, 22.5792, 24, 24.576, 25, 27, 33, 33.3333, 40, 48, 50, 54 -50 -100 -3 - +50 +100 +3 Unit Conditions MHz ×10-6 ×10-6 ×10-6 T_use = -40 °C to +105 °C T_use = -40 °C to +125 °C T_use = +25 °C, First year *1 Frequency tolerance includes initial frequency tolerance, frequency / temperature characteristics, frequency / voltage coefficient, and frequency / load coefficient Page 3 / 18 Spec No : SG2520CAA_E_Ver1.22 [ 5 ] Electrical Characteristics Parameter (Unless stated otherwise [ 3 ] Operating Range) Symbol Specification Stand-by current I_std Output voltage VOH VOL VOH VOL Symmetry SYM 45 50 55 % - - 3 ns - - 3.5 ns 80 % Vcc - - 20 % Vcc 100 5 V V ns ms Start-up time t_str Current consumption (No load) VCC = 1.8 V ± 10 % Current consumption (No load) VCC = 2.5 V ± 10 % ICC Current consumption (No load) VCC = 3.3 V ± 10 % Rise time/Fall time Input voltage Output disable time (ST) Output enable time (ST) Typ. - Max. 5 2.0 2.3 2.6 2.1 2.5 2.9 2.3 2.7 3.1 2.7 3.1 3.3 10 %VCC 0.4 Unit Min. 90 %VCC VCC - 0.4 - ms mA mA mA mA mA mA mA mA mA µA µA µA V V V V tr / tf VIH VIL tstp_st tsta_st Conditions t = 0 at 90 %VCC 8 MHz ≤ fo ≤ 20 MHz 20 MHz < fo ≤ 40 MHz 40 MHz < fo ≤ 54 MHz 8 MHz ≤ fo ≤ 20 MHz 20 MHz < fo ≤ 40 MHz 40 MHz < fo ≤ 54 MHz 8 MHz ≤ fo ≤ 20 MHz 20 MHz < fo ≤ 40 MHz 40 MHz < fo ≤ 54 MHz VCC = 1.8 V ± 10 %, S̅T̅ = GND VCC = 2.5 V ± 10 %, S̅T̅ = GND VCC = 3.3 V ± 10 %, S̅T̅ = GND Load current condition 1.8 V ± 10 % 2.5 V ± 10 % 3.3 V ± 10 % IOH -1.5 mA -3 mA -4 mA IOL 1.5 mA 3 mA 4 mA Load current condition 1.8 V ± 10 % 2.5 V ± 10 % 3.3 V ± 10 % IOH -3 mA -4 mA -6 mA IOL 3 mA 4 mA 6 mA 50 % VCC level, L_CMOS ≤ 15 pF VCC = 2.5 V or 3.3 V ± 10 %, 20 % VCC - 80 % VCC level, L_CMOS = 15 pF VCC = 1.8 V ± 10 %, 20 % VCC - 80 % VCC level, L_CMOS = 15 pF S̅T̅ terminal S̅T̅ terminal HIGH → LOW S̅T̅ terminal LOW → HIGH [ 6 ] Thermal resistance (For reference only) Parameter Junction temperature Junction to case Junction to ambient Symbol Tj θjc θja Specification Min. - Typ. 15.2 91.9 Page 4 / 18 Max. +135 - Unit Conditions °C °C/W °C/W Spec No : SG2520CAA_E_Ver1.22 [ 7 ] Typical Performance Characteristics (For reference only) The following data shows typical performance characteristics (7-1) Frequency / Temperature Characteristics fo = 25 MHz, ±50 × 10-6 at -40 to +105 °C n = 50 pcs fo = 25 MHz, ±100 × 10-6 at -40 to +125 °C n = 50 pcs Page 5 / 18 Spec No : SG2520CAA_E_Ver1.22 (7-2) Current Consumption No load, T_use = +25 °C, Freq. Dependency L_CMOS = 15 pF, T_use = +25 °C, Freq. Dependency fo = 20 MHz L_CMOS = 5 pF, Temperature Characteristic T_use = +25 °C, Output load(L_CMOS) Characteristics fo = 40 MHz L_CMOS = 5 pF, Temperature Characteristic T_use = +25 °C, Output load(L_CMOS) Characteristics * Output load condition under L_CMOS > 15 pF (dotted line area) is not guaranteed, and the data is for reference. The actual current consumption is the total of the current under the condition of no load and the current to drive the output load (fo × L_CMOS × VCC). To reduce the current consumption, it is effective to use lower frequency, lower supply voltage and lower output load. Page 6 / 18 Spec No : SG2520CAA_E_Ver1.22 (7-3) Rise Time / Fall Time fo = 20 MHz, Rise Time 20 % - 80 %VCC, L_CMOS = 15 pF, Temp. Char. 20 % - 80 %VCC, T_use = +25 °C, Output load Char. 10 % - 90 %VCC, L_CMOS = 15 pF, Temp. Char. 10 % - 90 %VCC, T_use = +25 °C, Output load Char. * Output load condition under L_CMOS > 15 pF (dotted line area) is not guaranteed, and the data is for reference. fo = 20 MHz, Fall Time 20 % - 80 %VCC, L_CMOS = 15 pF, Temp. Char. 20 % - 80 %VCC, T_use = +25 °C, Output load Char. 10 % - 90 %VCC, L_CMOS = 15 pF, Temp. Char. 10 % - 90 %VCC, T_use = +25 °C, Output load Char. * Output load condition under L_CMOS > 15 pF (dotted line area) is not guaranteed, and the data is for reference. Page 7 / 18 Spec No : SG2520CAA_E_Ver1.22 (7-3) Rise Time / Fall Time [cont'd] fo = 40 MHz, Rise Time 20 % - 80 %VCC, L_CMOS = 15 pF, Temp. Char. 20 % - 80 %VCC, T_use = +25 °C, Output load Char. 10 % - 90 %VCC, L_CMOS = 15 pF, Temp. Char. 10 % - 90 %VCC, T_use = +25 °C, Output load Char. * Output load condition under L_CMOS > 15 pF (dotted line area) is not guaranteed, and the data is for reference. fo = 40 MHz, Fall Time 20 % - 80 %VCC, L_CMOS = 15 pF, Temp. Char. 20 % - 80 %VCC, T_use = +25 °C, Output load Char. 10 % - 90 %VCC, L_CMOS = 15 pF, Temp. Char. 10 % - 90 %VCC, T_use = +25 °C, Output load Char. * Output load condition under L_CMOS > 15 pF (dotted line area) is not guaranteed, and the data is for reference. Page 8 / 18 Spec No : SG2520CAA_E_Ver1.22 (7-4) Symmetry 50 %VCC, L_CMOS = 15 pF, Temp. Char. fo = 20 MHz fo = 40 MHz (7-5) Output Voltage fo = 20 MHz VOH, L_CMOS = 15 pF, Temp. Char. VOL, L_CMOS = 15 pF, Temp. Char. fo = 40 MHz VOH, L_CMOS = 15 pF, Temp. Char. VOL, L_CMOS = 15 pF, Temp. Char. Page 9 / 18 Spec No : SG2520CAA_E_Ver1.22 (7-6) Phase Noise and Phase Jitter fo = 20 MHz VCC = 3.3 V, T_use = +25 °C VCC = 2.5 V, T_use = +25 °C VCC = 1.8 V, T_use = +25 °C VCC 3.3 V Phase Jitter* 2.5 V 0.32 ps 0.30 ps 1.8 V 0.32 ps * Offset frequency: 12 kHz to 5 MHz Jitter (T_use = +25 °C, VCC = 3.3 V) Total jitter (BER = 10-12) RMS jitter Peak to peak jitter 31.3 ps 1.8 ps 15 ps fo = 40 MHz VCC = 3.3 V, T_use = +25 °C VCC = 2.5 V, T_use = +25 °C VCC = 1.8 V, T_use = +25 °C VCC 3.3 V Phase Jitter* 2.5 V 0.26 ps 1.8 V 0.24 ps 0.32 ps * Offset frequency: 12 kHz to 20 MHz Jitter (T_use = +25 °C, VCC = 3.3 V) Total jitter (BER = 10-12) RMS jitter Peak to peak jitter Page 10 / 18 22.3 ps 1.8 ps 16 ps Spec No : SG2520CAA_E_Ver1.22 (7-7) Output Waveform fo = 20 MHz VCC = 3.3 V, L_CMOS = 15 pF, T_use = +25 °C VCC = 2.5 V, L_CMOS = 15 pF, T_use = +25 °C VCC = 1.8 V, L_CMOS = 15 pF, T_use = +25 °C fo = 40 MHz VCC = 3.3 V, L_CMOS = 15 pF, T_use = +25 °C VCC = 2.5 V, L_CMOS = 15 pF, T_use = +25 °C VCC = 1.8 V, L_CMOS = 15 pF, T_use = +25 °C Page 11 / 18 Spec No : SG2520CAA_E_Ver1.22 [ 8 ] Test Circuit (8-1) Waveform Observation Switch ST VCC by-pass capacitor supply Test Point GND OUT L_CMOS (8-2) Current Consumption Test Switch ST VCC A by-pass capacitor supply GND OUT Test Point *Standby current test should be S̅T̅ = GND. (8-3) Condition (1) Oscilloscope The bandwidth should be minimum 5 times the measurement frequency The probe ground should be placed closely to the test point and the lead length should be as short as possible * It is recommended to use miniature socket. (Don’t use earth lead.) (2) L_CMOS includes probe capacitance. (3) A 0.01 μF to a 0.1 μF bypass capacitor should be connected between V CC and GND pins located close to the device (4) Use a current meter with a low internal impedance (5) Power Supply Power supply startup time (0 %VCC → 90 %VCC) should be more than 150 μs Power supply impedance should be as low as possible Page 12 / 18 Spec No : SG2520CAA_E_Ver1.22 (8-4) Timing Chart (1) Output Waveform and Level (2) Output Frequency Timing t_str Output Stable 90 %VCC VCC 0V OUT 0V (3) S̅T̅ Function and Timing S̅T̅ Terminal Osc. circuit Output status “H” or OPEN Oscillation Specified frequency: Enable “L” Oscillation stop High impedance: Disable VIH Enable S̅T̅ VIL *1 tstp_st Disable *2 tsta_st High impedance OUT *1 The period from S̅T̅ = VIL to OUT = High impedance (Disable) *2 The period from S̅T̅ = VIH to OUT = Enable * Judge of starting output: VOH ≥ 80 %VCC, VOL ≤ 20 %Vcc, fout is within fo ± 1 000 × 10-6 * S̅T̅ terminal voltage level should not exceed supply voltage when using S̅T̅ function. Please note that S̅T̅ rise time should not exceed supply voltage rise time at the start-up. Page 13 / 18 Spec No : SG2520CAA_E_Ver1.22 [ 9 ] Outline Drawing and Recommended Footprint Units: mm Terminal coating : Au plating For stable operation, it is recommended that 0.01 µF to 0.1 µF bypass capacitors should be connected between VCC and GND and placed as close to the VCC pin as possible. Reference Weight Typ.: 14 mg Terminal Assignment Pin # Connection #1 S̅T̅ #2 #3 #4 GND OUT VCC Function S̅T̅ terminal S̅T̅ function Osc. Circuit Output “H” or OPEN Oscillation Specified frequency: Enable “L” Oscillation stop High impedance: Disable GND terminal Output terminal VCC terminal Marking Lot code / Operating temperature Frequency [MHz] Production lot number Location of Pin #1 Model Page 14 / 18 Spec No : SG2520CAA_E_Ver1.22 [ 10 ] Moisture Sensitivity Level Parameter MSL Specification LEVEL 1 Conditions IPC/JEDEC J-STD-020D.1 [ 11 ] Reflow Profiles IPC/JEDEC J-STD-020D.1 Page 15 / 18 Spec No : SG2520CAA_E_Ver1.22 [ 12 ] Packing Information (12-1) Packing Quantity The last two digits of the Product Number ( X1G005951xxxxxx) are a code that defines the packing quantity. The standard is "16" for a 3 000 pcs/Reel. (12-2) Taping Specification Subject to EIA-481, IEC-60286 and JIS C0806 (1) Tape Dimensions Carrier Tape Material: PS (Polystyrene) Top Tape Material: PET (Polyethylene Terephthalate) +PE (Polyethylene) Units: mm 4.00.1 Epson Epson Φ1.0+0.1/-0 1.150.1 0.250.005 2.80.1 4.00.1 8.00.2 2.00.1 3.50.1 +0.1 Φ1.5 -0 1.750.1 10 P: 400.1 2.30.1 (2) Reel Dimensions Center Material: PS (Polystyrene) Reel Material: PS (Polystyrene) User direction of feed Units: mm 11.41.0 +0 Φ180.0 -3.0 Φ60.0 Φ13.00.2 9.00.3 +0.3 2.0-0 (3) Storage Environment We recommend to keep less than +30 °C and 85 %RH of humidity in a packed condition, and to use it less than 6 months after delivery. Page 16 / 18 Spec No : SG2520CAA_E_Ver1.22 [ 13 ] Handling Precautions Prior to using this product, please carefully read the section entitled “Precautions” on our Web site (https://www5.epsondevice.com/en/information/#precaution) for instructions on how to handle and use the product properly to ensure optimal performance of the product in your equipment. Before using the product under any conditions other than those specified therein, please consult with us to verify and confirm that the performance of the product will not be negatively affected by use under such conditions. In addition to the foregoing precautions, in order to avoid the deteriorating performance of the product, we strongly recommend that you DO NOT use the product under ANY of the following conditions: (1) (2) Do not expose this product to excessive mechanical shock or vibration. This product can be damaged by mechanical shock during the soldering process depending on the equipment used, process conditions, and any impact forces experienced. Always follow appropriate procedures, particularly when changing the assembly process in any way and be sure to follow applicable process qualification standards before starting production. (3) These devices are sensitive to ESD, please use appropriate precautions during handling, assembly, test, shipment, and installation. (4) The use of ultrasonic technology for cleaning, bonding, etc. can damage the Xtal unit inside this product. Please carefully check for this consideration before using ultrasonic equipment for volume production with this product. (5) Noise and ripple on the power supply may have undesirable affects on operation and cause degradation of phase noise characteristics. Evaluate the operation of this device with appropriate power supplies carefully before use. (6) When applying power, ensure that the supply voltage increases monotonically for proper operation. On power down, do not reapply power until the supplies, bypass capacitors, and any bulk capacitors are completely discharged since that may cause the unit to malfunction. (7) Aging specifications are estimated from environmental reliability tests and expected frequency variation over time. They do not provide a guarantee of aging over the product lifecycle. (8) The metal cap on top of the device is directly connected to the GND terminal (pin #2). Take necessary precautions to prevent any conductor not at ground potential from contacting the cap as that could cause a short circuit to GND. (9) Do not route any signal lines, supply voltage lines, or GND lines underneath the area where the oscillators are mounted including any internal layers and on the opposite side of the PCB. To avoid any issues due to interference of other signal lines, please take care not to place signal lines near the product as this may have an adverse affect on the performance of the product. (10) A bypass capacitor of the recommended value(s) must be connected between the V CC and GND terminals of the product. Whenever possible, mount the capacitor(s) on the same side of the PCB and as close to the product as possible to keep the routing traces short. (11) Power supply connections to V CC and GND pins should be routed as thick as possible while keeping the high frequency impedance low in order to get the best performance. (12) The use of a filter or similar element in series with the power supply connections to protect from electromagnetic radiation noise may increase the high frequency impedance of the power supply line and may cause the oscillator to not operate properly. Please verify the design to ensure sufficient operational margin prior to use. (13) Keep PCB routing from the output terminal(s) to the load as short as possible for best performance. (14) The Enable (S̅T̅) input terminal is high impedance and so susceptible to noise. Connect it to a low impedance source when used and when not used it is recommended to connect it to Vcc for active high inputs and GND for active low inputs. (15) Do not short the output to GND as that will damage the product. Always use with an appropriate load resistor connected. (16) This product should be reflowed no more than 3 times. [Availability of mounting conditions] Reflow on the board Avallable If rework is needed after reflow, please correct it with a The parts may fall. soldering iron with the tip set for a temperature of +350 °C Reflow under the board Please judge whether it possible to implement. or less and only contact each terminal once and for no more Soldering pot/bath (Dip than 5 seconds. If this product is mounted on the bottom of soldering system, Flow Not Avallable the board during a reflow please check that it soldered down soldering system) Soldering iron Avallable properly afterwards. (17) Product failures during the warranty period only apply when the product is used according to the recommended operating conditions described in the specifications. Products that have been opened for analysis or damaged will not be covered. It is recommended to store and use in normal temperature and humidity environments described in the specifications to ensure frequency accuracy and prevent moisture condensation. If the product is stored for more than one year, please confirm the pin solderability prior to use. (18) If the oscillation circuit is exposed to condensation, the frequency may change or oscillation may stop. Do not use in any conditions where condensation occurs. (19) Do not store or use the product in an environment where it can be exposed to chemical substances that are corrosive to metal or plastics such as salt water, organic solvents, chemical gasses, etc. Do not use the product when it is exposed to sunlight, dust, corrosive gasses, or other materials for long periods of time. (20) When using water-soluble solder flux make sure to completely remove the flux residue after soldering. Pay particular attention when the residues contain active halogens which will negatively affect the product and its performance. (21) Terminals on the side of the product are internally connected to the IC, be careful not to cause short-circuits or reduce the insulation resistance of them in any way. (22) Should any customer use the product in any manner contrary to the precautions and/or advice herein, such use shall be done at the customer’s own risk. Page 17 / 18 is Spec No : SG2520CAA_E_Ver1.22 PROMOTION OF ENVIRONMENTAL MANAGEMENT SYSTEM CONFORMING TO INTERNATIONAL STANDARDS At Seiko Epson, all environmental initiatives operate under the Plan-Do-Check-Action (PDCA) cycle designed to achieve continuous improvements. The environmental management system (EMS) operates under the ISO 14001 environmental management standard. All of our major manufacturing and non-manufacturing sites, in Japan and overseas, completed the acquisition of ISO 14001 certification. ISO 14000 is an international standard for environmental management that was established by the International Standards Organization in 1996 against the background of growing concern regarding global warming, destruction of the ozone layer, and global deforestation. WORKING FOR HIGH QUALITY In order provide high quality and reliable products and services than meet customer needs, Seiko Epson made early efforts towards obtaining ISO9000 series certification and has acquired ISO9001 for all business establishments in Japan and abroad. We have also acquired IATF 16949 certification that is requested strongly by major manufacturers as standard. IATF 16949 is the international standard that added the sector-specific supplemental requirements for automotive industry based on ISO9001. ■ Explanation of marks used in this datasheet ●Pb free. ●Complies with EU RoHS directive. *About the products without the Pb-free mark. Contains Pb in products exempted by EU RoHS directive (Contains Pb in sealing glass, high melting temperature type solder or other) ●Designed for automotive applications such as Car Multimedia, Body Electronics, Remote Keyless Entry etc. NOTICE: PLEASE READ CAREFULLY BELOW BEFORE THE USE OF THIS DOCUMENT ©Seiko Epson Corporation 2020 1. 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