M24L28256DA-55BEG

ESMT PSRAM Features •Advanced low-power architecture •High speed: 55 ns, 70 ns •Wide voltage range: 2.7V to 3.3V •Typical active current: 1 mA @ f = 1 MHz •Low standby power •Automatic power-down when deselected M24L28256DA 2-Mbit (256K x 8) Pseudo Static RAM Enable ( WE ) inputs LOW and Chip Enable Two ( CE 2) input HIGH. Data on the eight I/O pins (I/O0 through I/O7) is then written into the location specified on the address pins (A0 through A17). Reading from the device is accomplished by asserting the Chip Enable One ( CE 1) and Output Enable ( OE ) inputs LOW while forcing Write Enable ( WE ) HIGH. And Chip Enable Two ( CE 2) HIGH. Under these conditions, the contents of the memory location specified by the address pins will appear on the I/O pins. The eight input/output pins (I/O0 through I/O7) are placed in a high-impedance state when the device is deselected ( CE 1 HIGH or CE2 LOW), the outputs are disabled ( OE HIGH), or during write operation ( CE 1 LOW, CE2 HIGH, and WE LOW). See the Truth Table for a complete description of read and write modes. Functional Description The M24L28256DA is a high-performance CMOS pseudo static RAM (PSRAM) organized as 256K words by 8 bits. Easy memory expansion is provided by an active LOW Chip Enable( CE 1) and active HIGH Chip Enable ( CE 2),and active LOW Output Enable ( OE ).This device has an automatic power-down feature that reduces power consumption dramatically when deselected. Writing to the device is accomplished by asserting Chip Enable One ( CE 1) and Write Logic Block Diagram Elite Semiconductor Memory Technology Inc. Publication Date : Jul. 2007 Revision : 1.0 1/10 ESMT Pin Configuration[1] VFBGA Top View M24L28256DA Product Portfolio Power Dissipation VCC Range (V) Product Min. M24L28256DA 2.7 Typ. 3.0 Max. 3.3 55 70 Speed(ns) f = 1MHz Typ.[2] 1 Max. 5 f = fMAX Typ.[2] 14 8 Max. 22 15 Typ. [2] 9 Max. 40 Operating ICC(mA) Standby ISB2(µA) Notes: 1. NC “no connect”—not connected internally to the die. 2. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ) and TA = 25°C. Elite Semiconductor Memory Technology Inc. Publication Date : Jul. 2007 Revision : 1.0 2/10 ESMT Maximum Ratings (Above which the useful life may be impaired. For user guide-lines, not tested.) Storage Temperature ...................................–65°C to +150°C Ambient Temperature with Power Applied ..............................................–40°C to +85°C Supply Voltage to Ground Potential . ............... ............ ...........−0.4V to 4.6V DC Voltage Applied to Outputs in High-Z State[3, 4, 5] .................................−0.4V to 3.7V DC Input Voltage[3, 4, 5].................... .........−0.4V to 3.7V Output Current into Outputs (LOW) ...............................20 mA M24L28256DA Static Discharge Voltage ........................................ >2001V (per MIL-STD-883, Method 3015) Latch-up Current ....................................................> 200 mA Operating Range Range Extended Ambient Temperature (TA) −25°C to +85°C VCC 2.7V to 3.3V Electrical Characteristics (Over the Operating Range) -55 Parameter VCC VOH VOL VIH VIL IIX IOZ ICC Description Supply Voltage Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage Input Leakage Current Output Leakage Current VCC Operating Supply Current Automatic CE 1 Power-Down Current —CMOS Inputs Automatic CE 1 Power-Down Current —CMOS Inputs Test Conditions Min. IOH = −0.1 mA IOL = 0.1 mA 0.8* VCC -0.4 GND ≤ VIN ≤ VCC GND ≤ VOUT Disable f = fMAX = 1/tRC f = 1 MHz -1 -1 14 1 2.7 VCC0.4 Typ. [2] 3.0 Max. 3.3 Min. 2.7 VCC0.4 0.8* VCC -0.4 -1 -1 8 1 -70 Typ. [2] Unit Max. 3.3 V V 0.4 VCC +0.4 0.4 +1 +1 15 5 mA V V V µA µA 0.4 VCC+ 0.4 0.4 +1 +1 22 5 ≤ VCC , Output VCC = 3.3V IOUT = 0mA CMOS levels ISB1 CE 1 ≥ VCC−0.2V, CE2 ≤ 0.2V VIN ≥ VCC − 0.2V, VIN ≤ 0.2V, f = fMAX (Address and Data Only), f=0 CE 1 ≥ VCC−0.2V, CE2 ≤ 0.2V VIN ≥ VCC − 0.2V, VIN ≤ 0.2V, f = 0, VCC = 3.3V 40 250 40 250 µA ISB2 9 40 9 40 µA Capacitance[6] Parameter CIN COUT Description Input Capacitance Output Capacitance Test Conditions TA = 25°C, f = 1 MHz VCC = VCC(typ) Max. 8 8 Unit pF pF Thermal Resistance[6] Parameter ΘJA ΘJC Description Thermal Resistance(Junction to Ambient) Thermal Resistance (Junction to Case) Test Conditions Test conditions follow standard test methods and procedures for measuring thermal impedance, per EIA/ JESD51. BGA 55 17 Unit °C/W °C/W Notes: 3.VIH(MAX) = VCC + 0.5V for pulse durations less than 20 ns. 4.VIL(MIN) = –0.5V for pulse durations less than 20 ns. 5.Overshoot and undershoot specifications are characterized and are not 100% tested. 6.Tested initially and after design or process changes that may affect these parameters. Elite Semiconductor Memory Technology Inc. Publication Date : Jul. 2007 Revision : 1.0 3/10 ESMT AC Test Loads and Waveforms M24L28256DA Parameters R1 R2 RTH VTH 3.0V (VCC) 22000 22000 11000 1.50 Unit Ω Ω Ω V Switching Characteristics (Over the Operating Range) [7] Parameter Read Cycle tRC tAA tOHA tACE tDOE tLZOE tHZOE tLZCE tHZCE tSK[11] Write Cycle [10] tWC tSCE tAW tHA tSA tPWE tSD tHD tHZWE tLZWE Description Read Cycle Time Address to Data Valid Data Hold from Address Change CE 1 LOW and CE2 HIGH to Data Valid OE LOW to Data Valid OE LOW to Low Z[8, 9] OE HIGH to High Z[8, 9] CE 1 LOW and CE2 HIGH to LOW Z[8, 9] CE 1 HIGH and CE2 LOW to HIGH Z[ 8, 9] Address Skew Write Cycle Time CE 1 LOW and CE2 HIGH to Write End Address Set-Up to Write End Address Hold from Write End Address Set-Up to Write Start WE Pulse Width -55 Min. 55[11] 55 5 55 25 5 25 5 25 0 55 45 45 0 0 40 25 0 25 5 5 70 55 55 0 0 55 25 0 5 5 10 Max. Min. 70 -70 Max. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 70 70 35 25 25 10 Data Set-Up to Write End Data Hold from Write End WE LOW to High-Z[8, 9] WE HIGH to Low-Z[8, 9] 25 ns ns Notes: 7. Test conditions assume signal transition time of 1V/ns or higher, timing reference levels of VCC(typ)/2, input pulse levels of 0V to VCC(typ), and output loading of the specified IOL/IOH and 30-pF load capacitance 8. tHZOE, tHZCE, and tHZWE transitions are measured when the outputs enter a high-impedance state. 9. High-Z and Low-Z parameters are characterized and are not 100% tested. 10. The internal write time of the memory is defined by the overlap of WE , CE 1= VIL, and CE2=VIH . All signals must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input set-up and hold timing should be referenced to the edge of the signal that terminates write. 11. To achieve 55-ns performance, the read access should be CE controlled. In this case tACE is the critical parameter and tSK is satisfied when the addresses are stable prior to chip enable going active. For the 70-ns cycle, the addresses must be stable within 10 ns after the start of the read cycle. Elite Semiconductor Memory Technology Inc. Publication Date : Jul. 2007 Revision : 1.0 4/10 ESMT Switching Waveforms Read Cycle 1 (Address Transition Controlled)[11, 12, 13] M24L28256DA Read Cycle 2 ( OE Controlled)[11, 13] Notes: 12. Device is continuously selected. OE , CE 1=VIL and CE2 = VIH. 13. WE is HIGH for Read Cycle. Elite Semiconductor Memory Technology Inc. Publication Date : Jul. 2007 Revision : 1.0 5/10 ESMT Switching Waveforms (continued) Write Cycle No.1 ( WE Controlled)[9,10, 14, 15, 16] M24L28256DA Write Cycle 2 ( CE 1 or CE2 Controlled) [9, 10, 14, 15, 16] Notes: 14.Data I/O is high impedance if OE ≥ VIH. 15. If Chip Enables go INACTIVE simultaneously with WE =HIGH, the output remains in a high-impedance state. 16.During the DON’T CARE period in the DATA I/O waveform, the I/Os are in output state and input signals should not be applied. Elite Semiconductor Memory Technology Inc. Publication Date : Jul. 2007 Revision : 1.0 6/10 ESMT Switching Waveforms (continued) Write Cycle 3 ( WE Controlled, OE LOW)[15, 16] M24L28256DA Truth Table[17] CE 1 H X L L L CE2 X L H H H OE X X L X H WE X X I/O0-I/O7 High Z High Z Data Out Data In High Z Power-Down Power-Down Read Write Mode Power Standby (ISB) Standby (ISB) Active (ICC) Active (ICC) Active (ICC) H L H Selected, Outputs Disabled Ordering Information Speed (ns) 55 70 Ordering Code M24L28256DA-55BEG M24L28256DA-70BEG Package Type 36-Lead VFBGA (6 x 8 x 1 mm) (Pb-free) 36-Lead VFBGA (6 x 8 x 1 mm) (Pb-free) Operating Range Extended Extended Note: 17.H = Logic HIGH, L = Logic LOW, X = Don’t Care. Elite Semiconductor Memory Technology Inc. Publication Date : Jul. 2007 Revision : 1.0 7/10 ESMT Package Diagrams 36-Lead VFBGA (6 x 8 x 1 mm) M24L28256DA Elite Semiconductor Memory Technology Inc. Publication Date : Jul. 2007 Revision : 1.0 8/10 ESMT Revision History Revision 1.0 Date 2007.07.19 Original Description M24L28256DA Elite Semiconductor Memory Technology Inc. Publication Date : Jul. 2007 Revision : 1.0 9/10 ESMT Important Notice All rights reserved. M24L28256DA No part of this document may be reproduced or duplicated in any form or by any means without the prior permission of ESMT. The contents contained in this document are believed to be accurate at the time of publication. ESMT assumes no responsibility for any error in this document, and reserves the right to change the products or specification in this document without notice. The information contained herein is presented only as a guide or examples for the application of our products. No responsibility is assumed by ESMT for any infringement of patents, copyrights, or other intellectual property rights of third parties which may result from its use. No license, either express , implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of ESMT or others. Any semiconductor devices may have inherently a certain rate of failure. To minimize risks associated with customer's application, adequate design and operating safeguards against injury, damage, or loss from such failure, should be provided by the customer when making application designs. ESMT's products are not authorized for use in critical applications such as, but not limited to, life support devices or system, where failure or abnormal operation may directly affect human lives or cause physical injury or property damage. If products described here are to be used for such kinds of application, purchaser must do its own quality assurance testing appropriate to such applications. Elite Semiconductor Memory Technology Inc. Publication Date : Jul. 2007 Revision : 1.0 10/10