AX1117SJ-ADJ

Page No. : 1/7 AX1117 Series 1.2A Low Dropout Positive Voltage Regulator AX1117 Series Pin Assignment 3-Lead Plastic SOT-89 Package Code: M Pin 1: ADJ/GND Pin 2: VOUT Pin 3: VIN 3-Lead Plastic SOT-223 Package Code: SJ Pin 1: ADJ/GND Pin 2 & Tab: VOUT Pin 3: VIN 3-Lead Plastic TO-252 Package Code: J Pin 1: ADJ/GND Pin 2 & Tab: VOUT Pin 3: VIN 3-Lead Plastic TO-220AB Package Code: E Pin 1: ADJ/GND Pin 2 & Tab: VOUT Pin 3: VIN 1 2 3 1 2 3 Features • Low Dropout Voltage 1.2V at 1.2A • Adjustable or Fixed Voltage (1.8V, 2.5V, 3.3V, 5V) • Over Current Protection • Thermal Overload Protection • Maximum Line Regulation 0.45% • Maximum Load Regulation 0.4% • Adjust Pin Current Less Than 90 uA Tab 3 12 Tab Applications • SCSI-2 Active Termination • High Efficiency Linear Regulators • 5V to 3.3V Voltage Converter • Battery Charger • Battery Management Circuits For Notebook And Palmtop PCs • Core Voltage Supply: FPGA, PLD, DSP, CPU 1 Tab 2 3 General Description The AX1117 Series are available in fixed and adjustable output voltage versions. Over current and thermal overload protection are integrated onto the chip. Output current will decrease while it reaches the preset current or temperature limit. The dropout voltage is specified at 1.2V Maximum at full rated output current. AX1117 Series provide excellent regulation over variations due to changes in line, load and temperature. AX1117 Series are three terminal regulators and available in popular packages. Device Selection Guide Device AX1117M-Adj AX1117M-Fix AX1117SJ-Adj AX1117SJ-Fix Output Voltage 1.3V to 4V 1.8V, 2.5V, 3.3V, 5V 1.3V to 4V 1.8V, 2.5V, 3.3V, 5V Package SOT-89 SOT-223 Device AX1117J-Adj AX1117J-Fix AX1117E-Adj AX1117E-Fix Output Voltage 1.3V to 4V 1.8V, 2.5V, 3.3V, 5V 1.3V to 4V 1.8V, 2.5V, 3.3V, 5V Package TO-252 TO-220AB Absolute Maximum Ratings Parameter Input Voltage Power Dissipation Operating Junction Temperature Range Storage Temperature Range Lead Temperature (Soldering) 5 Sec Electrostatic Discharge Sensitivity *: SOT-223: 0.9W(Max.), SOT-89: 0.6W(Max.), TO-252: 0.9W(Max.), TO-220: 2.1W(Max.) Symbol VIN PD TOPR TSTG TLEAD Maximum 20 Internally Limited * 0 To +125 -65 To +150 260 2 Units V W °C °C °C KV/Min AVANTICS - AX1117 Series Specification No.: 050309-FE0005 Page No. : 2/7 Electrical Characteristics (C =10uF, C i O =100uF, unless otherwise noted.) Min. 1.782 2.475 3.27 4.95 1.238 o Parameter Output Voltage AX1117-1.8 AX1117-2.5 AX1117-3.3 AX1117-5 Reference Voltage AX1117-Adj Line Regulation AX1117-1.8 AX1117-2.5 AX1117-3.3 AX1117-5 AX1117-Adj Load Regulation AX1117-1.8 AX1117-2.5 AX1117-3.3 AX1117-5 AX1117-Adj Dropout Voltage NOTE3 Test Conditions IO=0mA, VIN=3.3V IO =0mA, VIN =4V IO =0mA, VIN =4.8V IO =0mA, VIN =6.5V IO =10mA, VIN -VO=3V IO=0mA, VIN=3.3~10V IO =0mA, VIN =4~10V IO =0mA, VIN =4.8~10V IO =0mA, VIN =6.5~10V IO =10mA, VIN -VO=1.5~10V IO=0~800mA, VIN=3.3V, TJ=25oC IO=0~1200mA, VIN=3.3V, NOTE1 IO=0~800mA, VIN=4V, TJ=25 C IO=0~1200mA, VIN=4V, NOTE1 IO=0~800mA, VIN=4.8V, TJ=25 C IO=0~1200mA, VIN=4.8V, NOTE1 IO=0~800mA, VIN=6.5V, TJ=25 C IO=0~1200mA, VIN=6.5V, NOTE1 IO=0~800mA, VIN=2.75V, TJ=25 C IO=0~1200mA, VIN=2.75V, NOTE1 IO=100mA, TJ=25oC o o o Typ. 1.8 2.5 3.3 5 1.25 1 1 2 3 0.1 1.05 1.1 1.2 1.2 2600 1.7 6 50 0.5 62 0.5 2 Max. 1.818 2.525 3.33 5.05 1.262 6 7 7 10 0.4 0.4 1 0.4 1 0.4 1 0.4 1 0.4 1 1.15 1.15 1.3 1.55 3200 5 10 120 5 - Units V V V V V mV mV mV mV % % % % % % % % % % % V V V V mA mA mA uA uA dB % % 2000 - All AX1117 Series IO=500mA, TJ=25 C IO=1200mA, TJ=25oC IO=1200mA o Current Limit All AX1117 Series Minimum Load Current AX1117-ADJ NOTE1 & NOTE2 Quiescent Current AX1117-Fix NOTE1 Adjust Pin Current Ripple Rejection All AX1117 Series Temperature Drift AX1117-Fix AX1117-Adj TJ=0~25oC TJ=0~25 C o NOTE1 & NOTE2 VIN -VO=1.5V VIN -VO=13.75V NOTE1 & NOTE2 VIN -VO=5V NOTE1 IO =10mA, VIN -VO=1.5V NOTE1 & NOTE2 - Adjust Pin Current Change IO =10mA, VIN -VO=1.4V~10V f=120MHz, VIN -VO=3V+1.5Vpp, CO=22uF Note: 1. Specification applies over the full operating junction temperature range, 0~125oC 2. AX1117-Adj require a minimum load current for ±3% regulation 3. Dropout voltage is the input voltage minus output voltage that produces a 1% decrease in output voltage. AVANTICS - AX1117 Series Specification No.: 050309-FE0005 Page No. : 3/7 Characteristics Curve Ripple Rejection & Frequency 70 60 Current Range Ripple Rejection (dB)... 40 30 20 10 0 10 100 Vin-Vout(ic)=3VDC+1Vrm s Iout=100mA o Tj=25 C 1000 10000 100000 Output Voltage（V） 50 Vin -Vout=3VDC o Tj=25 C 0.0 0.5 Frequency (Hz) 1.0 1.5 2.0 Ouput Current（A ） 2.5 3.0 Output Voltage Change & Temperature 0.6 8 7 Start Time 0.4 Vinput 6 0.2 ∆ V/Vout (%) 5 4 0mA, Voutput 3 2 0 -0.2 -0.4 Iout=10m A -0.6 0 50 100 150 200 1A, Voutput 1 0 Temperature ( C) o 0 100 200 300 400 500 Time (uS) Dropout Voltage & Output Current 1.22 1.20 0.6 0.5 Load Transient Response 1.0 0.5 0 Load Current (A) Output Voltage Deviation (V)... 1.18 0.4 0.3 0.2 0.1 0.0 -0.1 -0.2 Vin-Vout=1.5V o Tj=25 C 0 5 10 15 20 25 30 35 40 45 Dropout Voltage (V) 1.16 1.14 1.12 1.10 1.08 1.06 0 200 400 600 Iout (mA) 800 1000 1200 1400 50 Time (uS) AVANTICS - AX1117 Series Specification No.: 050309-FE0005 Page No. : 4/7 Applications Description • Output Voltage Adjustment Like most regulators, AX1117 series regulate the output by comparing the output voltage to an internally generated reference voltage. On the adjustable version, the VREF is available externally as 1.25V between VOUT and ADJ. The voltage ratio formed by R1 and R2 should be set to conduct 10mA (minimum output load). The output voltage is given by the following equation: VOUT =VREF (1+R2/R1) + IADJ R2 On fixed versions of AX1117 series, the voltage divider is provided internally. • Thermal Protection AX1117 series have thermal protection which limits junction temperature to 150°C. However, device functionality is only guaranteed to a maximum junction temperature of +125°C. The power dissipation and junction temperature for AX1117 in all packages given by PD=(VIN - VOUT) IOUT, TJUNCTION=TAMBIENT+(PDxθJA), Note: TJUNCTION must not exceed 125°C • Current Limit Protection AX1117 series are protected against overload conditions. Current protection is triggered at typically 1.5A. • Stability And Load Regulation AX1117 series require a capacitor from VOUT to GND to provide compensation feedback to the internal gain stage. This is to ensure stability at the output terminal. Typically, a 10uF tantalum or 50uF aluminum electrolytic is sufficient. Note : It is important that the ESR for this capacitor does not exceed 0.5Ω. The output capacitor does not have a theoretical upper limit and increasing its value will increase stability. COUT = 100 uF or more is typical for high current regulator design. AX1117 series load regulation are limited by the resistance of the wire connecting it to the load(RP). For the adjustable version, the best load regulation is accomplished when the top of the resistor divider(R1) is connected directly to the output pin of the AX1117 series. When so connected, RP is not multiplied by the divider ratio. For fixed output versions, the top of R1 is internally connected to the output and ground pin can be connected to low side of the load as a negative side sense if, so desired. • Thermal Consideration The AX1117 series contain thermal limiting circuitry designed to protect itself for over-temperature conditions. Even for normal load conditions, maximum junction temperature ratings must not be exceeded. As mention in thermal protection section, we need to consider all sources of thermal resistance between junction and ambient. It contains junction-to-case, case-to-heat-sink interface and heat sink resistance itself. An additional heat sink is applied externally sometimes. It can increase the maximum power dissipation. For example, the equivalent junction temperature of 300mA output current is 115°C without external heat sink. Under the same junction temperature IC can operates 500mA with an adequate heat sink. Therefore, to attach an extra heat sink is recommended. Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. The bonding wires are appending paths. The former is the lowest resistance path. Proper mounting is required to ensure the best possible thermal flow this area of the package to the heat sink. Thermal compound at the case-to-heat-sink interface is strongly recommended. The case of all devices in this series is electrically connected to the output. Therefore, if the case of the device must be electrically isolated, a thermally conductive spacer can be used, as long its thermal resistance is considered. • Protection Diode (The figure is shown as Regulator with Reverse Diode Protection in advanced applications) In general operation, AX1117 series don’t need any protection diodes. From the cross-section structure of AX1117 sries, the output pin is connected to P+ substrate, and the input pin is connected to N- well. There is a parasitic reverse diode between them. It can handle microsecond surge currents of 5A to 10A. Even with large output capacitance, it is very difficult to get those values of surge currents in normal operation. Only with high value output capacitors, such as 1000uF. And with the input pin instantaneously shorted to ground. can damage occur. A crowbar circuit at the input of the AX1117 series can generate those kinds of currents, and a diode from output to input is recommended. Normal power supply cycling or even plugging and unplugging in the system will not generate currents large enough to do any damage. RP Parasitic Line Resistance In V IN Adj R1 Connect R1 to Case Out V IN In ADJ Out V REF I ADJ 10uA R2 R1 V OUT VOUT =VREF (1+R2/R1) + IADJ R2 RL R2 Connect R2 to Load AVANTICS - AX1117 Series Specification No.: 050309-FE0005 Page No. : 5/7 SOT-223 Dimension Marking: A Pb Free Mark Pb-Free: " . " (Note) A X Normal: None SJ Product Series Control Code (ADJ,1.8,2.5,3.3,5) 1117- B 1 2 3 C Date Code Note: Green label is used for pb-free packing Pin Style: 1.ADJ/GND 2.VOUT 3.VIN D E F G H a1 I a2 3-Lead SOT-223 Plastic Surface Mounted Package AVANTICS Package Code: SJ Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A B C D E F G H I a1 a2 Min. 2.90 6.70 3.30 0.60 *2.30 6.30 1.40 0.25 0.02 *13o 0o Max. 3.10 7.30 3.70 0.80 6.70 1.80 0.35 0.10 10 o *: Typical, Unit: mm SOT-89 Dimension C H Marking: Date Code AX1 1 1 7 Control Code Pb Free Mark Pb-Free: " . " (Note) Normal: None B 1 E G A 2 3 D Product Series ADJ(A),1.8(B),2.5(C) 3.3(D),5(E) I Note: Green label is used for pb-free packing Pin Style: 1.ADJ/GND 2.VOUT 3.VIN Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 F DIM A B C D E F G H I Min. 4.40 4.05 1.50 2.40 0.36 *1.50 *3.00 1.40 0.35 Max. 4.60 4.25 1.70 2.60 0.51 1.60 0.41 *: Typical, Unit: mm 3-Lead SOT-89 Plastic Surface Mounted Package AVANTICS Package Code: M AVANTICS - AX1117 Series Specification No.: 050309-FE0005 Page No. : 6/7 TO-252 Dimension A C Marking: Pb Free Mark Pb-Free: " . " (Note) AX Normal: None B L F G D J Product Series Control Code ADJ(A),1.8(B),2.5(C) 3.3(D),5(E) 1117 Date Code 3 H E K 2 I 1 J Note: Green label is used for pb-free packing Pin Style: 1.ADJ/GND 2.VOUT 3.VIN Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A B C D E F G H I J K L Min. 0.45 1.70 0.90 0.45 6.40 5.40 2.20 0.70 5.20 1.40 Max. 0.55 1.90 1.50 0.60 6.80 5.80 2.80 *2.30 0.90 0.90 5.50 1.60 *: Typical, Unit: mm 3-Lead TO-252 Plastic Surface Mount Package AVANTICS Package Code: J TO-220AB Dimension Marking: A D B E F C Pb Free Mark Pb-Free: " . " (Note) Normal: None AX E Product Series Control Code ADJ(A),1.8(B),2.5(C) 3.3(D),5(E) 1117 Date Code H I G Tab P L J M 3 2 1 O N K Note: Green label is used for pb-free packing Pin Style: 1.ADJ/GND 2(Tab).VOUT 3.VIN Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A B C D E F G H I J K L M N O P Min. 5.58 8.38 4.40 1.15 0.35 2.03 9.66 3.00 0.75 2.54 1.14 12.70 14.48 Max. 7.49 8.90 4.70 1.39 0.60 2.92 10.28 *16.25 *3.83 4.00 0.95 3.42 1.40 *2.54 14.27 15.87 *: Typical, Unit: mm 3-Lead TO-220AB Plastic Package AVANTICS Package Code: E Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of AVANTIC. • AVANTICS reserves the right to make changes to its products without notice. • AVANTICS semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • AVANTICS assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office: • AVANTICS Microelectronics Corp: No. 255, Cai Lun Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai, China Tel: 86-021-58955599 Fax: 86-021-58558038 AVANTICS - AX1117 Series Specification No.: 050309-FE0005 Page No. : 7/7 Soldering Methods for AVANTICS’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile tP TP Ramp-up TL Tsmax Temperature tL Critical Zone TL to TP Tsmin tS Preheat Ramp-down 25 t 25oC to Peak Time Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25oC to Peak Temperature 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb-Free devices. Sn-Pb Eutectic Assembly