EE-SX1107

EE-SX1107/1108/1109/1131 Ultra-Compact Photomicrosensors with Surface-Mount Design Surface mount design, and tape and reel packaging facilitate automated PCB assembly s Compact size makes these sensors ideal for use in applications with restricted space s High-resolution sensing with phototransistor output s s Dual channel model that is ideal for encoder applications (EE-SX1131) Ordering Information Appearance Sensing method Transmissive Slot width 1 mm Slot depth 2 mm Sensing object Opaque 0.15 x 0.6 mm min. Weight 0.05 g Part number EE-SX1107 2 mm 2.8 mm Opaque 0.3 x 1.0 mm min. 0.1 g EE-SX1108 3 mm 3.5 mm Opaque 0.5 x 1.0 mm min. 0.1 g EE-SX1109 Dual channel transmissive 2 mm 2.8 mm Opaque 0.3 x 1.0 mm min. 0.1 g EE-SX1131 EE-SX1107/1108/1109/1131 EE-SX1107/1108/1109/1131 Specifications s ABSOLUTE MAXIMUM RATING (TA=25°C) Item Emitter Forward current Pulse forward current Reverse voltage Detector Collector-emitter voltage Emitter-collector voltage Collector current Collector dissipation Ambient temperature Operating Storage Soldering (manual) Soldering (reflow) Symbol IF IFP VR VCEO VECO IC PC Topr Tstg Tsol Tsol Rated value 25 mA (see note) 100 mA (duty: 1/100, pulse width: 0.1 ms) 5V 20 V 5V 20 mA 75 mW (see note) -30° to 85°C -40° to 90°C 300°C (3 second max.) 240°C (10 second max) Note: Refer to Engineering Data if the ambient temperature is not within the normal room temperature range. s CHARACTERISTICS (TA=25°C) Item Emitter Forward voltage Reverse current Peak emission wavelength Detector Dark current Peak spectral sensitivity wavelength Combination Light current (collector-current) Collector-emitter saturation voltage Rising time Falling time Symbol VF IR λP(L) ID λP(P) IL VCE (sat) tr tf Value 1.1 V typ., 1.3 V max. 10 µA max. 940 nm typ. 100 nA max. 900 nm typ. 50 µA min., 150 µA typ., 500 µA max. 0.1 V typ., 0.4 V max. 10 µs typ. (see note) 10 µs typ. (see note) Condition IF = 5 mA VR = 5 V IF = 20 mA VCE = 10 V, 0 lx — IF = 5 mA, VCE = 5 V IF = 20 mA, IL = 50 µA VCC = 5 V, RL = 1KΩ IL = 100 µA Note: The following figures show the rising time (tr) and falling time (tf). Input t 90% Input IL VCC Output Output 10% tr tf t RL 2 EE-SX1107/1108/1109/1131 EE-SX1107/1108/1109/1131 Engineering Data Note: The operating conditions of the photomicrosensor must be within the absolute maximum rating ranges. s TEMPERATURE CHARACTERISTICS 140 50 s INPUT CHARACTERISTICS (TYPICAL) 50 Collector dissipation PC (mW) Forward current IF (mA) Forward current IF (mA) 120 100 80 60 40 20 0 -40 -20 0 20 40 60 80 100 40 30 20 10 0 -40 40 Ta=25°C 30 20 10 0 1.0 -20 0 20 40 60 80 100 1.1 1.2 1.3 1.4 1.5 1.6 Ambient temperature Ta (°C) Ambient temperature Ta (°C) Forward voltage VF (V) s INPUT/OUTPUT CHARACTERISTICS (TYPICAL) EE-SX1107 910 EE-SX1108/1131 910 EE-SX1109 910 Light current IL (µA) Light current IL (µA) 710 610 510 410 310 210 110 10 0 10 20 30 Ta=25°C VCE=5 V 40 50 Light current IL (µA) 810 810 710 610 510 410 310 210 110 10 0 10 20 30 Ta=25°C VCE=5 V 40 50 810 710 610 510 410 310 210 110 10 0 10 20 30 Ta=25°C VCE=5 V 40 50 Forward current I F (mA) Forward current I F (mA) Forward current IF (mA) s OUTPUT CHARACTERISTICS (TYPICAL) EE-SX1107 700 600 Ta=25°C EE-SX1108/1131 700 600 Ta=25°C EE-SX1109 700 600 Ta=25°C Light current IL (µA) Light current IL (µA) 500 400 300 200 100 0 0 2 4 6 8 10 12 14 5 mA 10 mA 500 400 300 Light current IL (µA) 10 mA 500 400 10 mA 300 200 100 5 mA 5 mA 200 100 0 0 2 4 6 8 10 12 14 0 0 2 4 6 8 10 12 14 Collector-emitter voltage VCE (V) Collector-emitter voltage VCE (V) Collector-emitter voltage VCE (V) s LIGHT CURRENT TEMPERATURE DEPENDENCY (TYPICAL) 160 140 s DARK CURRENT TEMPERATURE DEPENDENCY(TYPICAL) 1000 VCE=10 V s RESPONSE TIME CHARACTERISTICS (TYPICAL) 1000 Llight current IL (%) 120 100 80 60 40 20 0 -40 -20 0 20 40 IF=5 mA VCE=5 V 60 80 100 100 Response time tr, tf (µs) Dark current ID (nA) 100 Input 0 Output 0 tr Input 90% 10% IL RL tf VCC Output t t 10 10 1 V CE=2 V 0.1 -40 -20 0 20 40 60 80 100 1 1 10 Load resistance RL (KΩ) 100 Ambient temperature Ta (°C) Ambient temperature Ta (°C) 3 EE-SX1107/1108/1109/1131 s SENSING POSITION CHARACTERISTICS (TYPICAL) EE-SX1107 120 120 EE-SX1107/1108/1109/1131 EE-SX1108/1109/1131 120 Relative light current IL (%) Relative light current IL (%) 100 80 60 40 20 0 -1.2 VCE=5 V IF=5 mA -0.6 0 Distance: d (mm) 0.6 1.2 d 100 80 60 40 20 0 -0.6 VCE=5 V IF=5 mA -0.4 -0.2 0 0.2 Relative light current IL (%) d 100 80 60 40 20 0 -1.2 VCE=5 V IF=5 mA d 0.4 0.6 -0.6 0 Distance: d (mm) 0.6 1.2 Distance: d (mm) s SENSING POSITION CHARACTERISTICS (TYPICAL) EE-SX1108 120 EE-SX1109 120 EE-SX1131 120 Relative light current IL (%) Relative light current IL (%) 100 80 60 40 20 0 -0.6 VCE=5 V IF=5 mA d 100 80 60 40 20 0 -0.6 IF=5 mA V CE=5 V -0.4 -0.2 0 0.2 Relative light current IL (%) d 100 80 60 40 20 0 -0.6 IF=5 mA V CE=5 V -0.4 -0.2 0 0.2 0.4 0.6 d -0.4 -0.2 0 0.2 0.4 0.6 0.4 0.6 Distance: d (mm) Distance: d (mm) Distance: d (mm) Dimensions Unit: mm (inch) s EE-SX1107 A C 3.0 (0.12) White stripe K E 3.4 (0.13) A 0.15±0.05 (0.01) [0.5 (0.02)] 1.0 (0.04) Optical axis R 0.3 (0.01) 1.0+0.2 (0.04) 0 1.2 (0.05) 3.0 (0.12) 2.0 (0.08) 0.6 (0.02) 1.0 (0.04) [0.5 (0.02)] A (Cross section AA view) [0.5 (0.02)] 1.6 (0.06) 1.2 (0.05) Note: 1. Unless otherwise specified, tolerances are ±0.15 mm. 2. The values in brackets are relative dimensions. 4 EE-SX1107/1108/1109/1131 Recommended soldering pattern Pin assignment A C EE-SX1107/1108/1109/1131 1.2 (0.05) K E 0.4 (0.02) 1.2 (0.05) A K C E Anode Cathode Collector Emitter 1.8 (0.07) 1.8 (0.07) 1.8 (0.07) s EE-SX1108 A C 4.0 (0.16) K E White stripe 5.0 (0.20) 0.3±0.05 (0.01) A 1.0 (0.04) 1.0 (0.04) Optical axis 2.0+0.2 0 (0.08) [1.0 (0.04)] 1.5 (0.06) 4.0 (0.16) 2.8 (0.11) E C R 0.3 (0.01) 1.0 (0.04) [0.5 (0.02)] (Cross section AA view) A [0.5 (0.02)] 2.2 (0.09) 1.6 (0.06) Recommended soldering pattern 1.6 (0.06) Pin assignment A C K E 0.6 (0.02) A Anode Cathode Collector Emitter 1.6 (0.06) K C E 2.0 (0.08) 3.0 (0.12) 2.0 (0.08) Note: 1. Unless otherwise specified, tolerances are ±0.15 mm. 2. The values in brackets are relative dimensions. 5 EE-SX1107/1108/1109/1131 Unit: mm (inch) EE-SX1107/1108/1109/1131 s EE-SX1109 A C White stripe K E 4.0 (0.16) 6.0 (0.24) 0.5±0.05 (0.02) 3.0+0.2 (0.12) 0 [1.5 (0.06)] 1.5 (0.06) A 1.0 (0.04) 1.0 (0.04) Optical axis 5.0 (0.20) R 0.3 (0.01) 3.5 (0.14) 1.0 (0.04) [0.5 (0.02)] (Cross section AA view) A [0.5 (0.02)] 1.6 (0.06) 2.2 (0.09) Recommended soldering pattern 1.6 (0.06) Pin assignment A C 0.6 (0.02) 1.6 (0.06) K E A K C E Anode Cathode Collector Emitter 2.0 (0.08) 4.0 (0.16) 2.0 (0.08) Note: 1. Unless otherwise specified, tolerances are ±0.15 mm. 2. The values in brackets are relative dimensions. 6 EE-SX1107/1108/1109/1131 s EE-SX1131 EE-SX1107/1108/1109/1131 A C 4.0 (0.16) NC E1 White stripe K E2 6.0 (0.24) 0.8±0.05 (0.03) 0.3± 0.05 (0.01) [1.0 (0.04)] A 1.0 (0.04) 2.0+0.2 0 (0.08) 1.5 (0.06) 1.0 (0.04) Optical axis 4.0 (0.16) 2.8 (0.11) R 0.3 (0.01) 1.0 (0.04) A (Cross section AA view) [0.5 (0.02)] [0.5 (0.02)] 1.4 (0.06) 1.0 (0.04) 1.4 (0.06) Recommended soldering pattern 0.4 (0.02) Pin assignment C A 1.0 (0.04) NC E1 1.0 (0.04) K E2 A Anode No connection Cathode Collector Emitter 1 Emitter 2 1.0 (0.04) 0.4 (0.02) 2.0 (0.08) 3.0 (0.12) 2.0 (0.08) NC K C E1 E2 Note: 1. Unless otherwise specified, tolerances are ±0.15 mm. 2. The values in brackets are relative dimensions. 7 EE-SX1107/1108/1109/1131 Unit: mm (inch) EE-SX1107/1108/1109/1131 s TAPE AND REEL Reel dia. 21.0±0.8 (0.83) 2.0±0.5 (0.08) dia. 13.0±0.5 (0.51) dia. 80.0±1.0 (3.50) dia. 330.0± 2.0 (13.00) Label 12.4+0.2 (0.49) 0 18.4 max. (0.73) Tape Figure 1 m 4.0 (0.16) dia. 1.5 (0.06) 1.75 (0.07) Part number 5.5 (0.22) n C A 12.0 (0.47) EE-SX1107 EE-SX1108 EE-SX1131 h 3.2 (0.13) 4.2 (0.17) 4.2 (0.17) l 3.6 (0.14) 5.2 (0.20) 5.2 (0.20) m 0.9 (0.04) 0.25 (0.01) 0.25 (0.01) n 3.2 (0.13) 4.2 (0.17) 4.2 (0.17) E K 0.3 (0.01) l h 8.0 (0.32) Figure 2 4.0 (0.16) m dia. 1.5 (0.06) 1.75 (0.07) Part number EE-SX1109 12.0 (0.47) h 5.2 (0.20) l 6.2 (0.24) m 0.25 (0.01) n 4.2 (0.17) C E K n A 5.5 (0.22) 0.3 (0.01) l h 12.0 (0.47) Tape configuration more than 40 mm (1.58) Empty Parts mounted more than 400 mm (15.76) Leading part Empty more than 40 mm (1.58) Quantity per reel Part number EE-SX1107 EE-SX1108/EE-SX1131 EE-SX1109 Pieces per reel 2500 2000 1000 8 EE-SX1107/1108/1109/1131 EE-SX1107/1108/1109/1131 Precautions s SOLDERING INFORMATION Reflow soldering • Reflow soldering must be done within 48 hours after opening the aluminum envelope. The component must be stored under 30°C at 80% RH. • The following soldering paste is recommended: Melting temperature: 178~192°C Composition: Sn 63%, Pb 37% • Recommended thickness of metal mask is between 0.2 mm and 0.25 mm for screen printing. • The following chart illustrates the maximum temperature limits for soldering: 250 10 sec. max. 230°C max. Temperature (°C) 200 4°C/sec. max. 150 140~160°C 4°C/sec. max. 60~120 sec. 100 40 sec. max. Time Manual soldering • "Sn 60" (60% tin and 40% lead) or solder with silver content is recommended. • Use a soldering iron of less than 25W. The temperature of the iron tip must be kept above 300°C (572°F). • Solder each land for a maximum of 3 seconds. OMRON ELECTRONICS LLC One East Commerce Drive Schaumburg, IL 60173 OMRON CANADA, INC. 885 Milner Avenue Scarborough, Ontario M1B 5V8 1-800-55-OMRON Cat. No. E02DAD2 3/01 Specifications subject to change without notice. 416-286-6465 Printed in the U.S.A. 9