FS6118

     X  T &ORFN *HQHUDWRU ,& $GYDQFH ,QIRUPDWLRQ Figure 2: Pin Configuration VSS XOUT XIN VDD 1 8 )6 February 1999 1.0 • • • • • • Features On-board crystal oscillator Phase-locked loop (PLL) synthesizes desired CLK frequency Internal loop filter Internal crystal oscillator load capacitance (16pF nominal) Only external components required are decoupling capacitors Minimal board footprint (8-pin 0.150" SOIC package) VDD CLK VSS n/c FS6118 2 3 4 7 6 5 8-pin 0.150" SOIC Table 1: Pin Descriptions Key: AI = Analog Input; AO = Analog Output; DI = Digital Input; DIU = Input with Internal Pull-Up; DID = Input with Internal Pull-Down; DIO = Digital Input/Output; DI-3 = Three-Level Digital Input, DO = Digital Output; P = Power/Ground; # = Active Low pin PIN TYPE P AO AI P -P DO P NAME VSS XOUT XIN VDD N/C VSS CLK VDD Ground DESCRIPTION 2.0 Description 1 2 3 4 5 6 7 8 The FS6118 is a monolithic CMOS frequency synthesizer IC designed for cost sensitive or space limited applications. An on-board crystal oscillator accepts a quartz crystal and provides a different, synthesized frequency on the CLK output. The device is packaged in an 8-pin SOIC package for a minimal board footprint. Custom factory-programmed clock frequencies are available. Please contact your local AMI sales representative for more information. Crystal oscillator feedback Crystal oscillator drive Power supply (+5V) No Connection Ground Clock Output Power Supply (+5V) Table 2: Font Description Figure 1: Block Diagram XIN Crystal Oscillator PhaseLocked Loop DEVICE FS6118-01 CRYSTAL FREQUENCY (MHz) 14.31818 CLK FREQUENCY (MHz) 40.0000 Custom frequencies available – contact AMI for more information CLK XOUT FS6118 This document contains information on a product under development. American Microsystems, Inc. reserves the right to change or discontinue this product without notice. ,62 2.4.99 )6 &ORFN *HQHUDWRU ,& $GYDQFH ,QIRUPDWLRQ      X  T February 1999 3.0 Electrical Specifications Table 3: Absolute Maximum Ratings Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the device at these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect device performance, functionality, and reliability. PARAMETER Supply Voltage (VSS = ground) Input Voltage, dc Output Voltage, dc Input Clamp Current, dc (VI < 0 or VI > VDD) Output Clamp Current, dc (VI < 0 or VI > VDD) Storage Temperature Range (non-condensing) Ambient Temperature Range, Under Bias Junction Temperature Lead Temperature (soldering, 10s) Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7) SYMBOL VDD VI VO IIK IOK TS TA TJ MIN. VSS-0.5 VSS-0.5 VSS-0.5 -50 -50 -65 -55 MAX. 7 VDD+0.5 VDD+0.5 50 50 150 125 125 260 2 UNITS V V V mA mA °C °C °C °C kV CAUTION: ELECTROSTATIC SENSITIVE DEVICE Permanent damage resulting in a loss of functionality or performance may occur if this device is subjected to a high-energy electrostatic discharge. Table 4: Operating Conditions PARAMETER Supply Voltage Ambient Operating Temperature Range SYMBOL VDD TA CONDITIONS/DESCRIPTION 5V ± 10% MIN. 4.5 0 TYP. 5.0 MAX. 5.5 70 UNITS V °C 2.4.99 ,62 2      X  T &ORFN *HQHUDWRU ,& $GYDQFH ,QIRUPDWLRQ )6 February 1999 4.0 Package Information Table 5: 8-pin SOIC (0.150") Package Dimensions DIMENSIONS INCHES MIN. A A1 A2 B C D E e H h L Θ 0.061 0.004 0.055 0.013 0.0075 0.189 0.150 0.230 0.010 0.016 0° MAX. 0.068 0.0098 0.061 0.019 0.0098 0.196 0.157 0.244 0.016 0.035 8° MILLIMETERS MIN. 1.55 0.102 1.40 0.33 0.191 4.80 3.81 5.84 0.25 0.41 0° MAX. 1.73 0.249 1.55 0.49 0.249 4.98 3.99 6.20 0.41 0.89 8° BASE PLANE 1 ALL RADII: 0.005" TO 0.01" R 8 E H ÅÉ"ÇÅÃÇ"#)#$É#ˆÃDŽ h x 45° B e A2 A D A1 SEATING PLANE 7° typ. 0.050 BSC 1.27 BSC C L θ Table 6: 8-pin SOIC (0.150") Package Characteristics PARAMETER Thermal Impedance, Junction to Free-Air Lead Inductance, Self Lead Inductance, Mutual Lead Capacitance, Bulk SYMBOL ΘJA L11 L12 C11 CONDITIONS/DESCRIPTION Air flow = 0 m/s Corner lead Center lead Any lead to any adjacent lead Any lead to VSS TYP. 173 2.0 1.6 0.4 0.27 UNITS °C/W nH nH pF 2.4.99 ,62 3 )6 &ORFN *HQHUDWRU ,& $GYDQFH ,QIRUPDWLRQ      X  T February 1999 5.0 Ordering Information DEVICE NUMBER PACKAGE TYPE 8-pin (0.150”) SOIC (Small Outline Package) 8-pin (0.150”) SOIC (Small Outline Package) OPERATING TEMPERATURE RANGE 0°C to 70°C (Commercial) 0°C to 70°C (Commercial) SHIPPING CONFIGURATION Tape-and-Reel Tubes ORDERING CODE 11640-802 11640-812 FS6118-01 FS6118-01 Copyright © 1998 American Microsystems, Inc. Devices sold by AMI are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMI makes no warranty, express, statutory implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMI makes no warranty of merchantability or fitness for any purposes. AMI reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI’s products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMI for such applications. American Microsystems, Inc., 2300 Buckskin Rd., Pocatello, ID 83201, (208) 233-4690, FAX (208) 234-6796, WWW Address: http://www.amis.com E-mail: tgp@amis.com 2.4.99 ,62 4