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GLT5640AL16P-7TC

GLT5640AL16P-7TC

  • 厂商:

    ETC

  • 封装:

  • 描述:

    GLT5640AL16P-7TC - 4M X 16 CMOS Synchronous Dynamic RAM - List of Unclassifed Manufacturers

  • 数据手册
  • 价格&库存
GLT5640AL16P-7TC 数据手册
G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Description The GLT5640AL16 are high-speed 67,108,864-bit synchronous dynamic random-access memories, organized as 1,048,576 x 16 x 4 (word x bit x bank), respectively. The synchronous DRAMs achieved high-speed data transfer using the pipeline architecture and clock frequency up to 183MHz. All input and outputs are synchronized with the positive edge of the clock. The synchronous DRAMs are compatible with Low Voltage TTL (LVTTL).These products are packaged in 54-pin TSOPII. Features • Single 3.3V ((±0.3V) power supply • High speed clock cycle time -5.5:183MHz,-6:166MHz, -7:143MHz, -8: 125MHz -10 : 100MHz • Fully synchronous operation referenced to clock rising edge • Possible to assert random column access in every cycle • Quad internal banks controlled by BA0 & BA1 (Bank Select) • Byte control by LDQM and UDQM • Programmable Wrap sequence (Sequential / Interleave) • Programmable burst length (1, 2, 4, 8 and full page) • Programmable /CAS latency (2 and 3) • Automatic precharge and controlled precharge • CBR (Auto) refresh and self refresh • X16 organization • LVTTL compatible inputs and outputs • 4,096 refresh cycles / 64ms • Burst termination by Burst stop and Precharge command G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 -1- G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Pin Configurations GLT5640AL16 VDD DQ 0 VDDQ DQ 1 DQ 2 VSSQ DQ 3 DQ 4 VDDQ DQ 5 DQ 6 VSSQ DQ 7 VDD LDQM WE CAS RAS CS BA0 BA1 A10 A0 A1 A2 A3 VDD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 VSS DQ 15 VSSQ DQ 14 DQ 13 VDDQ DQ 12 DQ 11 VSSQ DQ 10 DQ9 VDDQ DQ8 VSS NC UDQM CLK CKE NC A11 A9 A8 A7 A6 A5 A4 VSS Pin Descriptions Pin Name CLK CKE CS RAS CAS WE DQ0 ~ DQ15 Master Clock Clock Enable Chip Select Row Address Strobe Column Address Strobe Write Enable Data I/O Function Pin Name DQM A0-11 BA0,1 VDD VDDQ VSS VSSQ Function DQ Mask Enable Address Input Bank Address Power Supply Power Supply for DQ Ground Ground for DQ G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 -2- G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Block Diagram CLK CKE Clock Generator Address Mode Register Row Address Buffer & Burst counter Bank D Bank C Bank B Row Decoder Bank A CS RAS CAS WE Column Address Buffer & Burst counter Sense amplifier Column Decoder & Latch Circuoit Command Decoder DQM Input & Output Buffer Latch Circuit Control Logic Data Control Circuit DQ G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 -3- G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Pin Function Symbol CLK CKE Input Input Input Function Master Clock: Other inputs signals are referenced to the CLK rising edge Clock Enable: CKE HIGH activates, and CKE LOW deactivates internal clock signals, device input buffers and output drivers. Deactivating the clock provides PRECHARGE POWER-DOWN and SELF REFRESH operation (all banks idle), or ACTIVE POWER-DOWN (row ACTIVE in any bank). Chip Select: CS enables (registered LOW) and disables (registered HIGH) the command decoder. All commands are masked when CS is registered HIGH. CS provides for external bank selection on systems with multiple banks. CS is considered part of the command code. RAS , CAS , WE A0 - A13 Input Command Inputs: RAS , CAS and WE (along with CS ) define the command being entered. Address Inputs: Provide the row address for ACTIVE commands, and the column address and AUTO PRECHARGE bit for READ/WRITE commands, to select one location out of the memory array in the respective bank. The row address is specified by A0-A11. The column address is specified by A0-A7 Bank Address Inputs: BA0 and BA1 define to which bank an ACTIVE, READ, WRITE or PRECHARGE command is being applied. Din Mask / Output Disable : When DQM is high in burst write, Din for the current cycle is masked. When DQM is high in burst read, Dout is disable (two - clock latency). Data Input / Output: Data bus Power Supply for the memory array and peripheral circuitry Power Supply are supplied to the output buffers only CS Input Input BA0,BA1 DQM, UDQM , LDQM DQ0 - DQ15 VDD, VSS VDDQ, VSSQ Input Input I/O Supply Supply G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 -4- G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Absolute Maximum Ratings Parameter Supply Voltage Supply Voltage for Output Input Voltage Output Voltage Short circuit output current Power dissipation Operating temperature Storage temperature Symbol VDD VDDQ VI VO IO PD TOPT TSTG Conditions with respect to VSS with respect to VSSQ with respect to VSS with respect to VSSQ Ta = 25 °C Value -0.5 to 4.6 -0.5 to 4.6 -0.5 to VDD+0.5 -0.5 to VDDQ+0.5 50 1 0 to 70 -65 to 150 Unit V V V V mA W °C °C Caution Exposing the device to stress above those listed in Absolute Maximum Ratings could cause permanent damage. The device is not meant to be operated under conditions outside the limits described in the operational section of this specification. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Recommended Operating Conditions (Ta = 0 ~ 70 °C, unless otherwise noted) Parameter Supply Voltage Supply Voltage for DQ Ground Ground for DQ High Level Input Voltage (all inputs) Low Level Input Voltage (all inputs) Symbol VDD VDDQ VSS VSSQ VIH VIL Min. 3.0 3.0 0 0 2.0 -0.3 Limits Typ. 3.3 3.3 0 0 Unit Max. 3.6 3.6 0 0 VDD + 0.3 0.8 V V V V V V Note : 1.All voltages are referenced to Vss = 0V. 2.VIH (max) is acceptable 5.6V AC pulse width with ≤ 3ns of duration. 3.VIL (min) is acceptable -2.0V AC pulse width with ≤ 3ns of duration. Pin Capacitance (Ta = 0 ~ 70°C, VDD = VDDQ = 3.3± 0.3V , VSS = VSSQ = 0V, unless otherwise noted) Parameter Input Capacitance, address & control pin Input Capacitance, CLK pin Data input / output capacitance Symbol CIN CCLK CI/O Min 2.5 2.5 4.0 Max 3.8 3.5 6.5 Unit pF pF pF G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 -5- G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) DC Characteristics 1 (Ta = 0 ~ 70°C, VDD = VDDQ = 3.3± 0.3V, VSS = VSSQ = 0V, Output Open, unless otherwise noted) Parameter Operating current Symbol ICC1 Test Conditions One bank active tRC = tRC(MIN), tCLK = tCLK(MIN), BL = 1, CL=3 CKE≤VIL(MAX), tCK = 15ns CKE≤VIL(MAX), CLK≤VIL(MAX) CS ≥VDD - 0.2V tCK = 15ns, CKE≥VIH(MIN) CS ≥VDD - 0.2V CLK≤VIL(MAX), CKE≥VIH(MIN) All input signals are stable. Limits(max.) -5.5 -6 -7 105 2 1 20 100 2 1 20 95 2 1 20 Unit Notes 1 mA mA mA 2 Precharge standby current in power down mode Precharge standby current in non power down mode ICC2P ICC2PS ICC2N ICC2NS 20 7 5 35 35 20 7 5 35 35 20 7 5 35 35 mA mA mA 2 Active standby current in power down mode Active standby current in Nonpower down mode ICC3P ICC3PS ICC3N ICC3NS CKE≤VIL(MAX), tCK = 10ns CKE≤VIL(MAX), CLK≤VIL(MAX) CS ≥VDD - 0.2V tCK = 15ns, CKE≥VIH(MIN) CS ≥VDD - 0.2V CLK≤VIL(MAX), CKE≥VIH(MIN) All input signals are stable. mA Operating current (Burst mode) Refresh current Self refresh current NOTES ICC4 ICC5 ICC6 All banks active tCK = tCK(MIN), BL=4, CL=3 All banks active tRC = tRC(MIN), tCLK = tCLK(MIN) CKE≤0.2V 140 180 1 130 170 1 120 160 1 mA mA mA 1. ICC(max) is specified at the output open condition. 2. Input signals are changed one time during 30ns. DC Characteristics 2 (Ta = 0 ~ 70°C, VDD = VDDQ = 3.3± 0.3V , VSS = VSSQ = 0V, unless otherwise noted) Parameter Input leakage current (Inputs) Output leakage current (I/O pins) High level output voltage Low level output voltage Symbol II (L) IO (L) VOH VOL Test Condition 0≤VIN≤VDD(MAX) Pins not under test = 0V 0≤VOUT≤VDD(MAX) DQ# in H - Z., DOUT is disabled IOH = -2mA IOL = 2mA Min 5 5 2.4 0.4 Max 5 5 Unit uA uA V V G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 -6- G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) AC Characteristics (Ta = 0 ~ 70°C, VDD = VDDQ = 3.3±0.3V , VSS = VSSQ = 0V, unless otherwise noted) Test Conditions AC input Levels (VIH/VIL) Input rise and fall time 2.0 / 0.8V 1ns Input timing reference level / Output timing reference level Output load condition 1.4V 50pF Note): 1.if clock rising time is longer than 1ns, (tr/2-0.5ns) should be added to the parameter. Output Load Conditions VDDQ V OUT Z = 50 Device Under Test VDDQ Ω 50PF G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 -7- G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Switching Characteristics (Ta = 0 ~ 70°C, VDD = VDDQ = 3.3±0.3V , VSS = VSSQ = 0V, unless otherwise noted) Parameter CLK cycle time CL=3 CL=2 Symbol tCK3 tCK2 tCH tCL tT tIS tIH tRC tRFC tRCD tRAS tRP tWR tRRD tRSC tDAL tREF 5.5 Min Max 5.5 2.3 2.3 1 10 1.5 1 55 55 16.5 38.5 100k 16.5 11 11 2 5 64 Limits -6 Min Max 6 8 2.5 2.5 1 10 1.5 1 60 60 18 42 100k 18 12 12 2 5 64 -7 Min 7 9 2.5 2.5 1 1.5 1 63 70 21 45 21 14 14 2 5 Max ns ns ns ns ns ns ns ns ns ns ns ns ns ns tCK tCK ms Unit Note CLK high pulse width CLK low pulse width Transition time of CLK Input Setup time Input Hold time Row Cycle Time Refresh Cycle Time Row to Column Delay Row active time Row Precharge time Write Recovery time Act to Delay time Mode Register Set Cycle time Data-in to ACTIVE command Refresh Interval time 10 1 2 100k 3 64 Note : 1. tIS = tCKS (CKE setup time) , tCMS (Command setup time) , tAS (Address setup time) , tDS (Input data setup time). 2. tIH = tCKH (CKE hold time) , tCMH (Command hold time) , tAH (Address hold time) , tDH (Input data hold time). 3. tWR is so called tDPL. Switching Characteristics (Ta = 0 ~ 70°C, VDD = VDDQ = 3.3±0.3V , VSS = VSSQ = 0V, unless otherwise noted) Parameter Access time from CLK CL = 3 CL = 2 Output Hold time from CLK CL = 3 CL = 2 Delay time , output low-impedance from CLK Delay time , output high-impedance from LCK Symbol tAC3 tAC2 tCH3 tCH2 tOLZ tOHZ -5.5 Min Max 5 6 2 2 0 2 5 Limits -6 Min Max 5 6 2.5 2.5 0 2.5 5 -7 Min Max 5.5 6 Unit ns ns ns ns ns ns Note *1 *1 *1 *1 2.5 2.5 0 2.5 5.5 Note : 1. If clock rising time is longer than 1ns, (tr/2-0.5ns) should be added to the parameter. G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 -8- G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Basic Features and Function Description 1. Simplified State Diagram Self Refresh en t ry F ex it L SE F Mode Register Set MRS IDLE L SE REF AUTO Refresh CK E C KE ROW ACTIVE BS T AT C Power Down CKE CKE T BS Active Power Down W (W rite rite re covery) W W to rit e w p re i dh th a rg e e ri t R th wi arge ad ch Re Pre o Aut PE R ea d Au e rit W y er ov c re Read WRITE SUSPEND CKE CKE WRITE Read (write recovery) Write R Au t ead w o Pr i e c h th a rge READ CKE CKE READ SUSPEND W rite w ith Auto Precharge (w ri t e re i wth a rg e r te Wi Prech to Au co v e ry ) Read with Auto Precharge n) PR E (P r WRITE A SUSPEND WRITE A na t io CKE CKE CKE READ A CKE READA SUSPEND POW ER ON Precharge Precharge Automatic sequence Manual input Note: After the AUTO refresh operation, precharge operation is performed automatically and enter the IDLE state G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 PR E (P r e ch -9- ar ge ) te r i on na t mi mi te r ar e ch ge G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) 2.Truth Table 2.1 Command Truth Table FUNCTION Device deselect No operation Mode register set Bank activate Read Read with auto precharge Write Write with auto precharge Precharge select bank Precharge all banks Burst stop CBR (Auto) refresh Self refresh Symbol DESL NOP MRS ACT READ READA WRIT WRITA PRE PALL BST REF SELF CKE n-1 H H H H H H H H H H H H H n X X X X X X X X X X X H L CS H L L L L L L L L L L L L RAS X H L L H H H H L L H L L CAS X H L H L L L L H H H L L WE X H L H H H L L L L L H H BA X X L V V V V V V X X X X A10 X X L V L H L H L H X X X A11 A9 – A0 X X V V V V V V X X X X X 2.2 DQM Truth Table FUNCTION Data write/output enable Data mask/output disable Symbol ENB MASK CKE n-1 H H n X X DQM L H 2.3 CKE Truth Table Current State Activating Any Clock suspend Idle Idle Self refresh Idle Power down Function Clock suspend mode entry Clock suspend Clock suspend mode exit CBR refresh command Self refresh entry Self refresh exit Power down entry Power down exit Symbol CKE n-1 H L L H H L L H L n L L H H L H H L H CS X X X L L L H X X RAS X X X L L H X X X CAS X X X L L H X X X WE X X X H H H X X X Address X X X X X X X X X REF SELF H : High level, L : Low level X : High or Low level (Don’t care), V : Valid Data input G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 10 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) 2.4 Operative Command Table (note 1) Current state Idle CS H L L L L L L L H L L L L L L L H L L L L L L L L H L L L L L L L L RAS X H H H L L L L X H H H L L L L X H H H H L L L L X H H H H L L L L CAS X H L L H H L L X H L L H H L L X H H L L H H L L X H H L L H H L L WE X X H L H L H L X X H L H L H L X H L H L H L H L X H L H L H L H L Address X X BA, CA, A10 BA, CA, A10 BR, RA BA, A10 X Op-Code X X BA, CA, A10 BA, CA, A10 BA, RA BA, A10 X Op-Code X X X BA, CA, A10 BA, CA, A10 BA, RA BA, A10 X Op-Code X X X BA, CA, A10 BA, CA, A10 BA, RA BA, A10 X Op-Code Command DESL NOP or BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MPS DESL NOP or BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS Action Nop or Power down Nop or Power down ILLEGAL ILLEGAL Row active Nop Refresh or Self refresh Mode register access Nop Nop Begin read : Determine AP Begin write : Determine AP ILLEGAL Precharge ILLEGAL ILLEGAL Continue burst to end→Row active Continue burst to end→Row active Burst stop→Row active Term burst, new read : Determine AP Term burst, start write : Determine AP ILLEGAL Term burst, precharging ILLEGAL ILLEGAL Continue burst to end→write recovering Continue burst to end→write recovering Burst stop→Row active Term burst, start read : Determine AP Term burst, new write : Determine AP ILLEGAL Term burst, precharging ILLEGAL ILLEGAL Notes 2 2 3 3 4 Row active 5 5 3 6 Read 7 7,8 3 write 7,8 7 3 9 G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 11 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Current state Read with auto precharge Write with auto precharge CS H L L L L L L L L H L L L L L L L L H L L L L L L L L H L L L L L L L L RAS X H H H H L L L L X H H H H L L L L X H H H H L L L L X H H H H L L L L CAS X H H L L H H L L X H H L L H H L L X H H L L H H L L X H H L L H H L L WE X H L H L H L H L X H L H L H L H L X H L H L H L H L X H L H L H L H L Address X X X BA, CA, A10 BA, CA, A10 BA, RA BA, A10 X Op - Code X X X BA, CA, A10 BA, CA, A10 BA, RA BA, A10 X Op - code X X X BA, CA, A10 BA, CA, A10 BA, RA BA, A10 X Op - Code X X X BA, CA, A10 BA, CA, A10 BA, RA BA, A10 X Op - Code Command DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL PEF/SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS Action Continue burst to end→Precharging Continue burst to end→Precharging ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL Continue burst to end→write recovering with auto precharge Continue burst to end→write recovering with auto precharge ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL Nop→Enter idle after tRP Nop→Enter idle after tRP Nop→Enter idle after tRP ILLEGAL ILLEGAL ILLEGAL Nop Enter idle after tRP ILLEGAL ILLEGAL Nop→Enter row active after tRCD Nop→Enter row active after tRCD Nop→Enter row active after tRCD ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL Notes 11 11 3,11 3,11 11 11 3,11 3,11 Precharging 3 3 3 Row activating 3 3 3, 9 3 G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 12 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Current state Write recovering Write recovering with auto precharge Auto Refreshing Mode register setting CS H L L L L L L L L H L L L L L L L L H L L L L H L L L L RAS X H H H H L L L L X H H H H L L L L X H H L L X H H H L CAS X H H L L H H L L X H H L L H H L L X H L H L X H H L X WE X H L H L H L H L X H L H L H L H L X X X X X X H L X X Address X X X BA, CA, A10 BA, CA, A10 BA, RA BA, A10 X Op - Code X X X BA, CA, A10 BA, CA, A10 BA, RA BA, A10 X Op - Code X X X X X X X X X X Command DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL PEF/SELF MRS DESL NOP BST READ/READA WRIT/WRITA ACT PRE/PALL REF/SELF MRS DESL NOP/BST READ/WRIT ACT/PRE/PALL REF/SELF/MRS DESL NOP BST READ/WRITE ACT/PRE/PALL/ REF/SELF/MRS Action Nop→Enter row active after tDPL Nop→Enter row active after tDPL Nop→Enter row active after tDPL Start read, Determine AP New write, Determine AP ILLEGAL ILLEGAL ILLEGAL ILLEGAL Nop→Enter precharge after tDPL Nop→Enter precharge after tDPL Nop→Enter precharge after tDPL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL ILLEGAL Nop→Enter idle after tRC Nop→Enter idle after tRC ILLEGAL ILLEGAL ILLEGAL Nop→Enter idle after 2 Clocks Nop→Enter idle after 2 Clocks ILLEGAL ILLEGAL ILLEGAL Notes 8 3 3 3,8,11 3,11 3,11 3 Note 1. All entries assume that CKE was active (High level) during the preceding clock cycle. 2. If both banks are idle, and CKE is inactive (Low level), the device will enter Power downmode. All input buffers except CKE will be disabled. 3. Illegal to bank in specified states; Function may be legal in the bank indicated by Bank Address(BA), depending on the state of that bank. 4. If both banks are idle, and CKE is inactive (Low level), the device will enter Self refresh mode. All input buffers except CKE will be disabled. 5. Illegal if tRCD is not satisfied. 6. Illegal if tRAS is not satisfied. 7. Must satisfy burst interrupt condition. 8. Must satisfy bus contention, bus turn around, and/or write recovery requirements. 9. Must mask preceding data which don’t satisfy tDPL. 10. Illegal if tRRD is not satisfied. 11. Illegal for single bank, bur legal for other banks in multi-bank devices. G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 13 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) 2.5 Command Truth Table for CKE (Note 1) Current state Self refresh (S.R.) CKE n-1 H L L L L L H H H H H H H H L L H L L H H H H H H H H H H L H H L L CKE n X H H H H L H H H H L L L L H L X H L H H H H H L L L L L X H L H L CS X H L L L X H L L L H L L L X X X X X H L L L L H L L L L X X X X X RAS X X H H L X X H H L X H H L X X X X X X H L L L X H L L L X X X X X CAS X X H L X X X H L X X H L X X X X X X X X H L L X X H L L X X X X X WE X X X X X X X X X X X X X X X X X X X X X X H L X X X H L X X X X X X Op - Code X X X X X X Op - Code Address X X X X X X X X X X X X X X X X X X Action INVALID, CLK (n - 1)would exit S.R. S.R. Recovery S.R. Recovery ILLEGAL ILLEGAL Maintain S.R. Idle after tRC Idle after tRC ILLEGAL ILLEGAL Begin clock suspend next cycle Begin clock suspend next cycle ILLEGAL ILLEGAL Exit clock suspend next cycle Maintain clock suspend INVALID, CLK (n - 1) would exit P.D. EXIT P.D. Idle Maintain power down mode Refer to operations in Operative Command Table Refer to operations in Operative Command Table Refer to operation in Operative Command Table Auto Refresh Refer to operations in Operative Command Table Refer to operations in Operative Command Table Refer to operations in Operative Command Table Refer to operations in Operative Command Table Self refresh Refer to operations in Operative Command Table Power down Refer to operations in Operative Command Table Begin clock suspend next cycle Exit clock suspend next cycle Maintain clock suspend Notes 2 2 Self refresh recovery 5 5 2 Power down (P.D.) Both banks idle 2 3 3 Any state other than listed above 4 1. 2. 3. 4. 5. H : High level, L : low level, X : High or low level (Don't care). CKE Low to High transition will re-enable CLK and other inputs asynchronously. A minimum setup time must be satisfied before any command other than EXIT. Power down and Self refresh can be entered only from the both banks idle state. Must be legal command as defined in Operative Command Table. Illegal if tSREX is not satisfied. G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 14 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) 3.Initiallization Before starting normal operation, the following power on sequence is necessary to prevent SDRAM from damaged or malfunctioning. 1. Apply power and start clock. Attempt to maintain CKE high , DQN high and NOP condition at the inputs. 2. Maintain stable power, table clock , and NOP input conditions for a minimum of 200us. 3. Issue precharge commands for all bank. (PRE or PREA) 4. After all banks become idle state (after tRP), issue 8 or more auto-refresh commands. 5. Issue a mode register set command to initialize the mode register. After these sequence, the SDRAM is in idle state and ready for normal operation. 4.Programming the Mode Register The mode register is programmed by the mode register set command using address bits BA0,BA1,A11 through A0 as data inputs. The register retains data until it is reprogrammed or the device loses power. The mode register has four fields; Options CAS latency Wrap type Burst length : BA0,BA1,A11 through A7 : A6 through A4 : A3 : A2 through A0 Following mode register programming, no command can be asserted before at least two clock cycles have elapsed. CAS Latency CAS latency is the most critical parameter being set. It tells the device how many clocks must elapse before the data will be available. The value is determined by the frequency of the clock and the speed grade of the device. The value can be programmed as 2 or 3. Burst Length Burst Length is the number of words that will be output or input in read or write cycle. After a read burst is completed, the output bus will become high impedance. The burst length is programmable as 1, 2, 4, 8 or full page. Wrap Type (Burst Sequence) The wrap type specifies the order in which the burst data will be addressed. The order is programmable as either “Sequential” or “Interleave”. The method chosen will depend on the type of CPU in the system. G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 15 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) 5.Mode Register BA0 0 BA1 0 11 0 10 0 9 0 8 0 7 0 6 5 4 LTMODE 3 WT 21 0 BL Bits2 - 0 000 001 010 011 100 101 110 111 0 1 WT = 0 1 2 4 8 R R R Fullpage WT = 1 1 2 4 8 R R R R Burst length Wrap type Sequential Interleave Bits 6-4 000 001 010 011 100 101 110 111 Latency mode CAS latency R R 2 3 R R R R Remark R : Reserved G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 16 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) 5.1 Burst Length and Sequence (Burst of Two) Starting Address (column address A0, binary) (decimal) 0 1 (Burst of Four) Starting Address (column address A1 - A0, binary) 00 01 10 11 (Burst of Eight) Starting Address (column address A2 - A0, binary) (decimal) 000 001 010 011 100 101 110 111 Sequential Addressing Sequence (decimal) 0, 1 1, 0 Interleave Addressing Sequence 0, 1 1, 0 Sequential Addressing Sequence (decimal) 0, 1, 2, 3 1, 2, 3, 0 2, 3, 0, 1 3, 0, 1, 2 Interleave Addressing Sequence (decimal) 0, 1, 2, 3 1, 0, 3, 2 2, 3, 0, 1 3, 2, 1, 0 Sequential Addressing Sequence (decimal) 0, 1, 2, 3, 4, 5, 6, 7 1, 2, 3, 4, 5, 6, 7, 0 2, 3, 4, 5, 6, 7, 0, 1 3, 4, 5, 6, 7, 0, 1 ,2 4, 5, 6, 7, 0, 1, 2, 3 5, 6 ,7, 0, 1, 2, 3, 4 6, 7 ,0 ,1 ,2 ,3 ,4 ,5 7, 0, 1, 2, 3, 4, 5, 6 Interleave Addressing Sequence 0, 1, 2, 3, 4, 5, 6, 7 1, 0, 3, 2, 5, 4, 7, 6 2, 3, 0, 1, 6, 7, 4, 5 3, 2, 1, 0, 7, 6, 5, 4 4, 5, 6, 7, 0, 1, 2, 3 5, 4, 7, 6, 1, 0, 3, 2 6, 7, 4, 5, 2, 3, 0, 1 7, 6, 5, 4, 3, 2, 1, 0 Full page burst is an extension of the above tables of sequential addressing, with the length being 256 for 4Mx16. G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 17 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) 6.Address Bits of Bank-Select and Precharge Row A0 A1 A2 (Activate command) A3 A4 A5 A6 A7 A8 A9 A10 A11 BA1 BA0 BA1 0 0 1 1 BA0 0 1 0 1 Result Select Bank A “Activate “ command Select Bank B “Activate” command Select Bank C “Activate” command Select Bank D “Activate” command Row A0 A1 A2 (Precharge command) A3 A4 A5 A6 A7 A8 A9 A10 A11 BA1 BA0 A10 0 0 0 0 1 BA1 0 0 1 1 X BA0 0 1 0 1 X Result Precharge Bank A Precharge Bank B Precharge Bank C Precharge Bank D Precharge All Banks X : Don’t care 0 1 Disables Auto-Precharge (End of Burst) Enables Auto - Precharge (End of Burst) Row A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 BA1 BA0 BA1 0 0 1 1 BA0 0 1 0 1 Result Enables Read/Write commands for Bank A Enables Read/Write commands for Bank B Enables Read/Write commands for Bank C Enables Read/Write commands for Bank D G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 18 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) 7.Precharge The precharge command can be asserted anytime after tRAS(min.) is satisfied. Soon after the precharge command is asserted, the precharge operation is performed and the synchronous DRAM enters the idle state after tRP(min.) is satisfied. The parameter tRP is the time required to perform the precharge. The earliest timing in a read cycle that a precharge command can be asserted without losing any data in the burst is as follows. T0 CLK Command Read T1 T2 T3 T4 T5 T6 Burst lengh=4 T7 PRE CAS latency = 2 DQ Q0 Q1 Q2 Q3 Hi - Z Command CAS l atency = 3 DQ Read PRE Hi - Z Q0 Q1 Q2 Q3 (t R AS is satisfied) In order to write all data to the memory cell correctly, the asynchronous parameter ”tDPL” must be satisfied. The tDPL(min.) specification defines the earliest time that a precharge command can be asserted. The minimum number of clocks can be calculated by dividing tDPL(min.) with the clock cycle time. In summary, the precharge command can be asserted relative to the reference clock that indicates the last data word is valid. In the following table, minus means clocks before the reference; plus means time after the reference. CAS latency 2 3 Read -1 -2 Write + tDPL(min.) + tDPL(min.) G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 19 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) 8.Auto Precharge During a read or write command cycle, A10 controls whether auto precharge is selected. If A10 is high in the read or write command (Read with Auto precharge command or Write with Auto precharge command), auto precharge is selected and begins automatically. In the write cycle, tDAL(min.) must be satisfied before asserting the next activate command to the bank being precharged. When using auto precharge in the read cycle, knowing when the precharge starts is important because the next activate command to the bank being precharged cannot be executed until the precharge cycle ends. Once auto precharge has started, an activate command to the bank can be asserted after tRP has been satisfied. A Read or Write command without auto - precharge can be terminated in the midst of a burst operation. However, a Read or Write command with auto - precharge can not be interrupted by the same bank commands before the entire burst operation is completed. Therefore use of the same bank Read, Write, Precharge or Burst Stop command is prohibited during a read or write cycle with auto - precharge. It should be noted that the device will not respond to the Auto - Precharge command if the device is programmed for full page burst read or write cycles. The timing when the auto precharge cycle begins depends both on both the CAS Iatency programmed into the mode register and whether the cycle is read or write. 8.1 Read with Auto Precharge During a READA cycle, the auto precharge begins one clock earlier (CL = 2) or two clocks earlier (CL = 3) than the last word output. READ with AUTO PRECHARGE Burst lengh = 4 T0 T1 T2 T3 T4 T5 T6 T7 T8 CLK No New Command to Bank B Command READA B Auto precharge starts CAS l atency = 2 D Q QB0 QB1 QB2 QB3 Hi - Z No New Command to Bank B Auto precharge starts Command CAS l atency = 3 D Q QB0 QB1 QB2 QB3 H-Z i READA B Remark READA means READ with AUTO PRECHARGE G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 20 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) 8.2 Write with Auto Precharge During a write cycle, the auto precharge starts at the timing that is equal to the value of tDPL(min.) after the last data word input to the device. WRITE with AUTO PRECHRGE Burst lengh = 4 T0 CLK Command WRITA B T1 T2 T3 T4 T5 T6 T7 T8 AUTO PRECHARGE starts CAS latency = 2 DQ DB0 DB1 DB2 t DPL DB3 Hi - Z_ Command CAS latency = 3 DQ AUTO PRECHARGE starts WRITA B tDPL Hi - Z DB0 DB1 DB2 DB3 Remark WRITA means WRITE with AUTO Precharge In summary, the auto precharge cycle begins relative to a reference clock that indicates the last data word is valid. In the table below, minus means clocks before the reference; plus means clocks after the reference. CAS latency 2 3 Read -1 -2 Write + tDPL(min.) + tDPL(min.) G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 21 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) 9. Read / Write Command Interval 9.1 Read to Read Command Interval During a read cycle when a new read command is asserted, it will be effective after the CAS latency, even if the previous read operation has not completed. READ will be interrupted by another READ. Each read command can be asserted in every clock without any restriction. READ to READ Command Interval Burst lengh=4, CAS l atency=2 T0 T1 T2 T3 T4 T5 T6 T7 T8 CLK Command Read A Read B DQ Q A0 QB0 QB1 QB2 Q B3 Hi-Z_ 1 cycle 9.2 Write to Write Command Interval During a write cycle, when a new Write command is asserted, the previous burst will terminated and the new burst will begin with a new write command. WRITE will be interrupted by another WRITE. Each write command can be asserted in every clock without any restriction. WRITE to WRITE Command Interval Burst lengh=4, CAS l atency=2 T0 T1 T2 T3 T4 T5 T6 T7 T8 CLK Command Write A Write B DQ QA0 Q B0 QB1 QB2 Q B3 Hi-Z_ 1 cycle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 22 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) 9.3 Write to Read Command Interval The write command to read command interval is also a minimum of 1 cycle. Only the write data before the read command will be written. The data bus must be Hi-Z at least one cycle prior to the first DOUT. WRITE to READ Command Interval Burst lengh=4 T0 T1 T2 T3 T4 T5 T6 T7 T8 CLK 1 cycle Command CAS l atency=2 DA0 Hi-Z WRITE A Read B DQ QB0 QB1 Q B2 Q B3 Command Write A Read B CAS l atency=3 DQ DA0 Hi-Z QB0 Q B1 Q B2 QB3 9.4 Read to Write Command Interval During a read cycle, READ can be interrupted by WRITE. DQM must be in High at least 3 clocks prior to the write command. There is a restriction to avoid a data conflict. The data bus must be Hi-Z using DQM before Write. G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 23 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) READ to WRITE Command Interval C S lae c = A tny 2 T0 T 1 T 2 T 3 T 4 T 5 T 6 T 7 T 8 CK L Cm ad o mn Ra ed W rite DM Q D Q H i-Z D 0 D 1 D 2 D 3 1 cycle T 0 T 1 T 2 T 3 T 4 T 5 T 6 T7 B r tle gh 8 C Slaten y 2 us n t = , A c= T8 T 9 CK L Cm a d o mn Ra ed W ie rt DM Q D Q Q 0 Q 1 Q 2 H- i i Zs n c s ay ees r D 0 D 1 D 2 e a p : Burst length=4, C Slae c = x m le A tny 3 T 0 T 1 T 2 T 3 T 4 T 5 T 6 T 7 T8 CK L C omm and Ra ed W rite DM Q D Q Q 2 H is i-Z necessary D 0 D 1 D 2 G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 24 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) 10.BURST Termination There are two methods to terminate a burst operation other than using a read or a write command. One is the burst stop command and the other is the precharge command. 10.1 BURST Stop Command During a read burst, when the burst stop command is issued, the burst read data are terminated and the data bus goes to highimpedance after the CAS latency from the burst stop command. During a write burst, when the burst stop command is issued, the burst write data are terminated and data bus goes to Hi-Z at the same clock with the burst stop command. Burst Termination Burst lengh=X, C SIntency=2,3 A T0 T1 T2 T 3 T4 T 5 T 6 T 7 CK L Cm ad o mn Read BT S CAS latency=2 D Q Q0 Q1 Q2 H i-Z CAS latency=3 D Q Q 0 Q 1 Q 2 Hi-Z Remark BST: Burst stop command Burst lengh=X, C S laten A cy=2 ,3 T 0 T 1 T 2 T 3 T 4 T 5 T 6 T 7 CK L C m and om Write BT S CASlatency=2,3 Q 0 D Q Q0 Q 1 Q 2 Hi-Z_ G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 25 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) 10.2 PRECHARGE TERMINATION 10.2.1 PRECHARGE TERMINATION in READ Cycle During READ cycle, the burst read operation is terminated by a precharge command. When the precharge command is issued, the burst read operation is terminated and precharge starts. The same bank can be activated again after tRP from the precharge command. When CAS latency is 2, the read data will remain valid until one clock after the precharge command. When CAS latency is 3, the read data will remain valid until two clocks after the precharge command. Precharge Termination in READ Cycle T0 T1 T2 T3 T4 T5 T6 T7 Burst lengh= X T8 CLK Command Read PRE tR P ACT CAS l atency=2 DQ Q0 Q1 Q2 Q3 Hi-Z command Read PRE tR P ACT C A S l atency=3 DQ Q0 Q1 Q2 Q3 Hi-Z G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 26 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) 10.2.2 Precharge Termination in WRITE Cycle During WRITE cycle, the burst write operation is terminated by a precharge command. When the precharge command is issued, the burst write operation is terminated and precharge starts. The same bank can be activated again after tRP from the precharge command. The DQM must be high to mask invalid data in. During WRITE cycle, the write data written prior to the precharge command will be correctly stored. However, invalid data may be written at the same clock as the precharge command. To prevent this from happening, DQM must be high at the same clock as the precharge command. This will mask the invalid data. PRECHARGE TERMINATION in WRITE Cycle T0 CLK C ommand CAS latency = 2 DQM DQ D 0 Write T1 T2 T3 T4 T5 T6 T7 Burst lengh = X T8 PRE ACT D1 D2 D3 D 4 tRP Hi - Z command CASlatency = 3 DQM Write PRE ACT DQ D0 D1 D2 D 3 D4 Hi - Z tRP G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 27 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Timing Diagram G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 28 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Mode Register Set T0 CLK T1 T2 T3 T4 T5 T6 T7 T8 T9 T1 0 CKE tRSC CS RAS CAS WE BA0,1 A10 Address Key ADD DQM tRP DQ Hi-Z Precharge Command All B anks Mode Regis ter Set Com mand Command G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 29 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) AC Parameters for Write Timing (1 of 2) Burst Length=4, CAS Latency=2 T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CLK t CL tCH t t tCKS CMS t CMH CK2 Begin Auto Precharge Bank A Begin Auto Precharge Bank B CKE t CKH CS RAS CAS WE *BA0 A10 tAS t AH ADD DQM t RCD t RRD t RC t DAL t DS t t DH DPL t RP DQ QAa0 QAa1 QAa2 QAa3 QBa0 QBa1 QBa2 QBa3 QAb0 QAb1 QAb2 QAb3 Activate Write with Command Auto Precharge Bank A Command Bank A Write with Activate Activate Command Auto Precharge Command Command Bank B Bank A Bank B Write without Auto Precharge Command Bank A Precharge Command Bank A Activate Command Bank A Activate Command Bank B *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 30 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) AC Parameters for Write Timing (2 of 2) Burst Length=4, CAS Latency=3 T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 T23 CLK t CL t CH tCK3 t CMS t Begin Auto Precharge Bank A Begin Auto Precharge Bank B t CKH CKE t CKS CMH CS RAS CAS WE *BA0 A10 t AS t AH ADD DQM t RCD DQ t RRD RC t DAL t DS t t DH DPL t RP QAa0 QAa1 QAa2 QAa3 QBa0 QBa1 QBa2 QBa3 QAb0 QAb1 QAb2 QAb3 Activate Command Bank A Write with Activate Auto Precharge Command Command Bank B Bank A Write with Auto Precharge Command Bank B Activate Command Bank A Write without Auto Precharge Command Bank A Precharge Command Bank A Activate Command Bank A G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 31 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 32 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) AC Parameters for Read Timing (1 of 2) Burst Length=2, CAS Latency=2 T0 CLK tCH tCL T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 tCK2 t CMS Begin Auto Precharge Bank B t CKH CKE tCKS t CMH CS RAS CAS WE *BA0 A10 t AS tAH ADD tRRD tRAS t RC DQM tAC2 tLZ tAC2 tOH QAa0 t RCD t HZ tOH QAa1 QBa0 t RP tHZ QBa1 DQ Hi-Z Activate Command Bank A Read Command Bank A Activate Command Bank B Read with Auto Precharge Command Bank B Precharge Command Bank A Activate Command Bank A *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 33 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) AC Parameters for Read Timing (2 of 2) Burst Length=2, CAS Latency=3 T0 CLK t CH tCL T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 t CK3 tCMS t CMH Begin Auto Precharge Bank B CKE t CKS t CKH CS RAS CAS WE *BA0 A10 t AH t AS ADD t RRD t RAS t RC t RP DQM t RCD tAC3 tLZ t AC3 tOH QAa0 tHZ tOH QAa1 QBa0 t HZ DQ Hi-Z QBa1 Activate Command Bank A Read Command Bank A Activate Command Bank B Read with Auto Precharge Command Bank B Precharge Command Bank A Activate Command Bank A *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 34 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Power on Sequence and Auto Refresh (CBR) T0 T1 CLK CKE T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 High level is required t RSC Minimum of 8 Refresh Cycles are required CS RAS CAS WE BA0, 1 A10 Address Key ADD DQM High Level is Necessary t t RP DQ Hi-Z RC Precharge Inputs Command All Banks must be stable for 200us 1st Auto Refresh Command 2nd Auto Refresh Command Mode Register Set Command Command G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 35 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Clock Suspension During Burst Read (Using CKE)(1 of 2) Burst Length=4, CAS Latency=2 T0 T1 CLK t CK2 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE CS RAS CAS WE *BA0 A10 RAa ADD RAa CAa DQM t HZ DQ Hi-Z QAa0 QAa1 QAa2 QAa3 Activate Command Bank A Read Command Bank A Clock Clock Suspended Suspended 2 Cycles 1 Cycle Clock Suspended 3 Cycles *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 36 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Clock Suspension During Burst Read (Using CKE)(2 of 2) Burst Length=4, CAS Latency=3 T0 T1 T2 CLK t CK3 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE CS RAS CAS WE *BA0 A10 RAa ADD RAa CAa DQM t HZ DQ Hi-Z QAa0 QAa1 QAa2 QAa3 Activate Command Bank A Read Command Bank A Clock Suspended 1 Cycles Clock Suspended 2 Cycles Clock Suspended 3 Cycles *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 37 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Clock Suspension During Burst Write (Using CKE)(1 of 2) Burst Length=4, CAS Latency=2 T0 T1 CLK t CK2 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE CS RAS CAS WE *BA0 A10 RAa ADD RAa CAa DQM DQ Hi-Z DAa0 DAa1 DAa2 DAa3 Activate Command Bank A Clock Suspended 1 Cycle Write Command Bank A Clock Suspended 2 Cycles Clock Suspended 3 Cycles *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 38 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Clock Suspension During Burst Write (Using CKE)(2 of 2) Burst Length=4, CAS Latency=3 T0 T1 CLK t CK3 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE CS RAS CAS WE *BA0 A10 RAa ADD RAa CAa DQM DQ Hi-Z DAa0 DAa1 DAa2 DAa3 Activate Command Bank A Clock Suspended 1 Cycle Write Command Bank A Clock Suspended 2 Cycles Clock Suspended 3 Cycles *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 39 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Power Down Mode and Clock Mask Burst Length=4, CAS Latency=2 T0 T1 CLK t CK2 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 t t CKS CKH t CKS CKE VALID CS RAS CAS WE *BA0 A10 RAa ADD RAa CAa DQM DQ Hi-Z QAa0 QAa1 QAa2 QAa3 Activate Command Bank A ACTIVE STANDBY Read Command Bank A Clock Mask Start Clock Mask End Precharge Command Power Down Mode Entry Precharge Standby Power Down Mode Entry Power Down Mode Exit Power Down Mode Exit Command *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 40 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Auto Refresh (CBR) Burst Length=4, CAS Latency=2 T0 T1 CLK t CK2 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE CS RAS CAS WE *BA0, 1 A10 RAa ADD RAa CAa DQM t RP t RC t RC Q0 Q1 Q2 Q3 DQ Hi-Z Precharge Command All Banks CBR Refresh Command CBR Refresh Command Activate Read Command Command *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 41 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Self Refresh (Entry and Exit) CLK can be Stopped T0 T1 T2 CLK T3 T4 ** T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 t t SRX t SRX t CKS CKE CKS CS RAS CAS WE *BA0 A10 ADD t t RC DQM RC DQ Hi-Z All Banks must be idle Self refresh Entry Self Refresh Exit Self Refresh Entry Self Refresh Exit Activate Command *BA1=”L” , Bank C , D = Idle *Clock can be stopped at CKE=Low. If clock is stopped, it must be restarted/stable for 4 clock cycles before CKE=High G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 42 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Random Column Read (Page With Same Bank)(1 of 2) Burst Length=4, CAS Latency=2 T0 T1 CLK t CK2 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE CS RAS CAS WE *BA0 A10 RAa RAd RAa ADD RAa CAa CAb CAc RAd CAd DQM DQ Hi-Z QAa0 QAa1 QAa2 QAa3 QAb0 QAb1 QAc0 QAc1 QAc2 QAc3 QAd0 QAd1 QAd2 QAd3 Precharge Read Command Command Bank A Bank A Read Read Command Command Bank A Bank A Precharge Activate Read Command Command Command Bank A Bank A Bank A *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 43 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Random Column Read (Page With Same Bank)(2 of 2) Burst Length=4, CAS Latency=3 T0 T1 CLK t CK3 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE CS RAS CAS WE *BA0 A10 RAa RAd ADD RAa CAa CAb CAc RAd CAd DQM DQ Hi-Z QAa0 QAa1 QAa2 QAa3 QAb0 QAb1 QAc0 QAc1 QAc2 QAc3 Activate Command Bank A Read Command Bank A Read Read Command Command Bank A Bank A Precharge Command Bank A Activate Command Bank A Read Command Bank A *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 44 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Random Column Write (Page With Same Bank)(1 of 2) Burst Length=4, CAS Latency=2 T0 CLK T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 t CK2 CKE CS RAS CAS WE *BA0 A10 Ra Rd ADD Ra Ca Cb Cc Rd Cd DQM DQ Hi-Z Da0 Da1 Da2 Da3 Db0 Db1 Dc0 Dc1 Dc2 Dc3 Dd0 Dd1 Dd2 Dd3 Activate Command Bank B Write Command Bank B Write Write Command Command Bank B Bank B Precharge Activate Write Command Command Command Bank B Bank B Bank B *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 45 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Random Column Write (Page With Same Bank)(2 of 2) Burst Length=4, CAS Latency=3 T0 T1 CLK t CK T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE CS RAS CAS WE *BA0 A10 Ra Rd ADD Ra Ca Cb Cc Rd Cd DQM DQ Hi-Z Da0 Da1 Da2 Da3 Db0 Db1 Dc0 Dc1 Dc2 Dc3 Dd0 Dd1 Activate Command Bank B Write Command Bank B Write Write Command Command Bank B Bank B Precharge Command Bank B Activate Command Bank B Write Command Bank B *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 46 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Random Row Read (Interleaving Banks)(1 of 2) Burst Length=8, CAS Latency=2 T0 CLK t T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CK2 CKE High CS RAS CAS WE *BA0 A10 ADD t t RCD AC2 t RP DQM DQ Hi-Z QBa0 QBa1 QBa2 QBa3 QBa4 QBa5 QBa6 QBa7 QAa0 QAa1 QAa2 QAa3 QAa4 QAa5 QAa6 QAa7 QBb0 QBb1 Activate Command Bank B Read Command Bank B Activate Command Bank A Precharge Command Bank B Read Command Bank A Active Command Bank B Read Command Bank B *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 47 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Random Row Read (Interleaving Banks)(2 of 2) Burs Length=8, CAS Latency=3 T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CLK t CK3 CKE High CS RAS CAS WE *BA0 A10 ADD t RCD t AC3 t DQM RP DQ Hi-Z QBa0 QBa1 QBa2 QBa3 QBa4 QBa5 QBa6 QBa7 QAa0 QAa1 QAa2 QAa3 QAa4 QAa5 QAa6 QAa7 QBb0 Activate Command Bank B Read Command Bank B Activate Command Bank A Precharge Read Command Command Bank B Bank A Activate Command Bank B Read Precharge Command Command Bank B Bank A *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 48 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Random Row Write (Interleaving Banks)(1 of 2) Burst Length=8, CAS Latency=2 T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CLK t CK2 CKE High CS RAS CAS WE *BA0 A10 ADD DQM t RCD t DPL t RP DQ Hi-Z QAa0 QAa1 QAa2 QAa3 QAa4 QAa5 QAa6 QAa7 QBa0 QBa1 QBa2 QBa3 QBa4 QBa5 QBa6 QBa7 QAb0 QAb1 QAb2 QAb3 QAb4 Activate Command Bank A Write Command Bank A Activate Command Bank B Precharge Command Bank A Write Command Bank B Active Command Bank A Write Command Bank A Precharge Command Bank B *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 49 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Random Row Write (Interleaving Banks)(2 of 2) Burst Length=8, CAS Latency=3 T0 CLK T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 t CK CKE High CS RAS CAS WE *BA0 A10 ADD RBa DQM t DPL t RP t DPL DQ Hi-Z QAa0 QAa1 QAa2 QAa3 QAa4 QAa5 QAa6 QAa7 QBa0 QBa1 QBa2 QBa3 QBa4 QBa5 QBa6 QBb7 QAb0 QAb1 QAb2 QAb3 Activate Command Bank A Write Command Bank A Activate Command Bank B Precharge Write Command Command Bank A Bank B Activate Command Bank A Precharge Write Command Command Bank A Bank B *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 50 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Read and Write Cycle (1 of 2) Burst Length=4, CAS Latency=2 T0 T1 CLK t CK2 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE CS RAS CAS WE *BA0 A10 RAa ADD RAa CAa CAb CAc DQM Hi-Z DQ QAa0 QAa1 QAa2 QAa3 DAb0 DAb1 DAb3 QAc0 QAc1 QAc3 Activate Write Command Command Bank A Bank A Write The Write Data Command is Masked with a Bank A Zero Clock latency Read Command Bank A The Read Data is Masked with Two Clocks Latency *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 51 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Read and Write Cycle (2 of 2) Burst Length=4, CAS Latency=3 T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CLK t CK3 CKE CS RAS CAS WE *BA0 A10 RAa ADD RAa CAa CAb CAc DQM Hi-Z DQ QAa0 QAa1 QAa2 QAa3 DAb0 DAb1 DAb3 QAc0 QAc1 QAc3 Activate Command Bank A Read Command Bank A Write The Write Read Commandis Masked with a Command Bank A Bank A Zero Latency The Read Data is Masked with Two Clock Latency *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 52 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Interleaved Column Read Cycle (1 of 2) Burst Length=4, CAS Latency=2 T0 T1 CLK t CK2 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE CS RAS CAS WE *BA0 A10 Ra Ra ADD Ra Cb Ra Ca Cb Cc Cb Cd DQM t RCD t AC2 DQ Hi-Z QAa0 QAa1 QAa2 QAa3 QBa0 QBa1 QBb0 QBb1 QBc0 QBc1 QAb0 QAb1 QBd0 QBd1 QBd2 QBd3 Activate Read Activate Read Read Read Read Read Command Command CommandCommand CommandCommandCommand Command Bank A Bank B Bank A Bank B Bank B Bank B Bank A Bank B Precharge Command Bank A Precharge Command Bank B *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 53 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Interleaved Column Read Cycle (2 of 2) Burst Length=4, CAS Latency=3 T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CLK t CK3 CKE CS RAS CAS WE *BA0 A10 Ra Ra ADD Ra Ca Ra Ca Cb Cc Cb DQM t t RCD RRD QAa0 QAa1 QAa2 QAa3 QBa0 QBa1 QBb0 QBb1 QBc0 QBc1 QAb0 QAb1 QAb2 QAb3 t AC3 DQ Hi-Z Activate Command Bank A Read Command Bank A Activate Command Bank B Read Read Read Read Command Command Command Command Bank B Bank B Bank B Bank A Precharge Command Bank B Precharge Command Bank A *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 54 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Interleaved Column Write Cycle (1 of 2) Burst Length=4, CAS Latency=2 T0 T1 CLK t CK2 T2 T3 T4 T5 T6 T7 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE CS RAS CAS WE *BA0 A10 Ra Ra ADD Ra Ca Ra Ca Cb Cc Cb Cb DQM t RCD t RP t DPL t Hi-Z RRD DQ DAa0 DAa1 DAa2 DAa3 DBa0 DBa1 DBb0 DBb1 DBc0 DBc1 DAb0 DAb1 DBd0 DBd1 DBd2 DBd3 Activate Command Bank A Write Command Bank A Activate Command Bank B Write Command Bank B Write Write Write Command Command Command Bank B Bank B Bank A Precharge Command Bank A Write Command Bank B Precharge Command Bank B *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 55 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Interleaved Column Write Cycle (2 of 2) Burst Length=4, CAS Latency=3 T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CLK t CK3 CKE CS RAS CAS WE *BA0 A10 Ra Ra ADD Ra Ca Ra Ca Cb Cc Cb Cd t DQM t Hi-Z RCD t DPL t DPL RRD t RP DQ QAa0 QAa1 QAa2 QAa3 QBa0 QBa1 QBb0 QBb1 QBc0 QBc1 QAb0 QAb1 QBd0 QBd1 QBd2 QBd3 Activate Command Bank A Write Command Bank A Activate Command Bank B Write Write Write Write Command Command Command Command Bank B Bank B Bank B Bank A Write Command Bank B Precharge Command Bank A Precharge Command Bank B *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 56 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Auto Precharge after Read Burst (1 of 2) Burst Length=4, CAS Latency=2 T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CLK t CK2 Start Auto Precharge Bank B Start Auto Precharge Bank A Start Auto Precharge Bank B CKE High CS RAS CAS WE *BA0 A10 Ra Ra Rb Rc ADD Ra Ca Ra Ca Cb Rb Cb Rc Cc DQM DQ Hi-Z QAa0 QAa1 QAa2 QAa3 QBa0 QBa1 QBa2 QBa3 QAb0 QAb1 QAb2 QAb3 QBb0 QBb1 QBb2 QBb3 QAc0 QAc1 QAc2 Activate Command Bank A Read Command Bank A Activate Read with Command Auto Precharge Bank B Command Bank B Read with Auto Precharge Command Bank A Activate Command Read with Bank A Auto Precharge Command Read with Activate Bank B Auto Precharge Command Command Bank B Bank A *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 57 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Auto Precharge after Read Burst (2 of 2) Burst Length=4, CAS Latency=3 T0 T1 CLK t CK3 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE High Start Auto Precharge Bank B Start Auto Precharge Bank A Start Auto Precharge Bank B CS RAS CAS WE *BA0 A10 Ra Ra Rb ADD Ra Ca Ra Ca Cb Rb RBb Cb DQM DQ Hi-Z QAa0 QAa1 QAa2 QAa3 QBa0 QBa1 QBa2 QBa3 QAb0 QAb1 QAb2 QAb3 QBb0 QBb1 QBb2 Activate Command Bank A Activate Command Bank B Read Command Bank A Read with Auto Precharge Command Bank B Read with Auto Precharge Command Bank A Activate Command Bank B Write with Auto precharge Command Bank B *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 58 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Auto Precharge after Write Burst (1 of 2) Burst Length=4, CAS Latency=2 T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CLK t CK2 CKE High Start Auto Bank B Start Auto Bank A Start Auto Bank B CS RAS CAS WE *BA0 A10 Ra Ra Rb Rc ADD Ra Ca Ra Ca Cb Rb Cb Rc Cc DQM DQ Hi-Z QAa0 QAa1 QAa2 QAa3 QBa0 QBa1 QBa2 QBa3 QAb0 QAb1 QAb2 QAb3 QBb0 QBb1 QBb2 QBb3 QAc0 QAc1 QAc2 QAc3 Activate Write Write with Activate Command Command Command Auto Precharge Command Bank A Bank A Bank B Bank B *BA1=”L” , Bank C , D = Idle Activate Write with Activate Command Auto Precharge Command Bank A Command Bank B Write with Bank A Auto Precharge Write with Bank A Auto Precharge Command Bank B Start Auto Precharge Bank A G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 59 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Auto Precharge after Write Burst (2 of 2) Burst Length=4, CAS Latency=3 T0 T1 T2 CLK t CK3 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE High Start Auto Precharge Bank B Start Auto Precharge Bank A Start Auto Precharge Bank B CS RAS CAS WE *BA0 A10 Ra Ra Rb ADD Ra Ca Ra Ca Cb Rb RBb Cb DQM DQ Hi-Z QAa0 QAa1 QAa2QAa3 QBa0 QBa1 QBa2 QBa3 QAb0 QAb1QAb2 QAb3 QBb0 QBb1 QBb2 QBb3 Activate Command Bank A Activate Command Bank B Read Command Bank A Read with Auto Precharge Command Bank B Read with Auto Precharge Command Bank A Activate Command Bank B Write with Auto precharge Command Bank B G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 60 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 61 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Full Page Read Cycle (1 of 2) Burst Length=Full Page, CAS Latency=2 T0 CLK t T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CK2 CKE High CS RAS CAS WE *BA0 A10 Ra Ra Rb ADD Ra Ca Ra Ca Rb DQM t RP DQ Hi-Z QAa QAa+1 QAa+2 QAa-2 QAa-1 QAa QAa+1 QBa QBa+1 QBa+2 QBa+3 QBa+4 QBa+51 QBa+6 Activate Command Bank A Read Command Bank A Activate Command Bank B Read Command Bank B The burst counter wraps from the highest order page address back to zero during this time interval Full page burst operation does not terminate when the burst length is satisfied; the burst counter increments and continues bursting beginning with the starting address Precharge Command Bank B Burst Stop Command Activate Command Bank B *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 62 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Full Page Read Cycle (2 of 2) Burst Length=Full Page, CAS Latency=3 T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CLK t CK3 CKE High CS RAS CAS WE *BA0 A10 Ra Ra Rb ADD Ra Ca Ra Ca Rb DQM DQ Hi-Z QAa QAa+1QAa+2 QAa-2 QAa-1 QAa QAa+1 QBa0 QBa+1 QBa+2QBa+3 QBa+4 QBa+5 Activate Command Bank A Read Bank A Activate Bank B Read Bank B The burst counter from the highest page address back to during this time Full page burst does not teminate the burst length is the burst counter and continues beginning with the addres Precharg Command Bank B Burst Stop Comman Activate Comman Bank B *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 63 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Full Page Write Cycle (1 of 2) Burst Length=Full Page, CAS Latency=2 T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CLK t CK2 CKE High CS RAS CAS WE *BA0 A10 Ra Ra Rb ADD Ra Ca Ra Ca Rb DQM t BDL DQ Hi-Z QAa QAa+1 QAa+2 QAa+3 QAa-1 QAa QAa+1 QBa QBa+1 QBa+2 QBa+3 QBa+4 QBa+5 QBa+6 Activate Command Bank A Write Command Bank A Activate Command Bank B The burst counter wraps from the highest order page address back to zero during this time interval Write Command Bank B Data is ignored Precharge Command Bank B Full page burst operation does not terminate when the burst length is satisfied; the burst counter increments and continues bursting beginning with the starting address Burst Stop Command Activate Command Bank B *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 64 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Full Page Write Cycle (2 of 2) Burst Length=Full Page, CAS Latency=3 T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CLK t CK3 CKE High CS RAS CAS WE *BA0 A10 Ra Ra Rb ADD Ra Ca Ra Ca Rb DQM t Hi-Z DAa DAa+1 DAa+2 DAa+3 DAa-1 DAa BDL Data is ignored. DQ DAa+1 DBa DBa+1 DBa+2 DBa+3 DBa+4 DBa+5 Activate Command Bank A Write Command Bank A Activate Command Bank B The burst counter wraps from the highest order page address back to zero during this time interval Write Command Bank B Full page burst operation does not terminate when the burst length is satisfied; the burst counter increments and continues bursting beginning with the starting address Precharge Command Bank B Burst Stop Command Activate Command Bank B *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 65 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Full Page Random Column Read Burst Length=Full Page, CAS Latency=2 T0 T1 T2 CLK t CK2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE CS RAS CAS WE BA A10 Ra Ra Rb ADD Ra Ra Ca Ca Cb Cb Cc Cc Rb t RP DQM DQ Hi-Z QAa0 QBa0 QAb0 QAb1 QBb0 QBb1 QAc0 QAc1 QAc2 QBc0 QBc1 QBc2 Activate Activate Command Bank A Bank B Read Read Bank B Read Bank A Read Bank B Read Bank A Read Bank B Precharg Command Bank (Bank D) (Precharge Activate Comman Bank B Bank A *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 66 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Full Page Random Column Write Burst Length=Full Page, CAS Latency=2 T0 T1 T2 T3 CLK t CK2 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE CS RAS CAS WE *BA0 A10 Ra Ra Rb ADD Ra Ra Ca Ca Cb Cb Cc Cc Rb t RP DQM DQ Hi-Z QAa0 QBa0 QAb0 QAb1 QBb0 QBb1 QAc0 QAc1 QAc2 QBc0 QBc1 QBc2 Activate Command Bank A Activate Command Bank B Write Command Bank B Write Command Bank A Write Command Bank B Write Command Bank A Write Command Bank B Precharge Command Bank B (Bank D) (Precharge Termination) Write Data is masked Activate Command Bank B Write Command Bank A *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 67 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Precharge Termination of a Burst (1 of 2) Burst Length=8, CAS Latency=2 T0 T1 T2 T3 T4 T5 T6 T7 CLK t CK2 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE High CS RAS CAS WE *BA0 A10 RAa RAb RAc ADD RAa CAa RAb C Ab RAc CAc t DPL t RP t RP t RP DQM DQ Hi-Z QAa0 QAa1 QAa2 Da3 QAb0 QAb1 QAb2 QAc0 QAc1 QAc2 Activate Command Bank A Write Command Bank A Precharge Command Bank A Activate Command Bank A Read Command Bank A Precharge Command Bank A Activate Command Bank A Read Command Bank A Precharge Command Bank A Precharge Termination o f a Write Burst. Write da ta is masked. Precharge Termination of a Read Burst. *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 68 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Precharge Termination of a Burst (2 of 2) Burst Length=8, CAS Latency=3 T0 T1 CLK t CK3 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 CKE High CS RAS CAS WE *BA0 A10 RAa RAb RAc ADD RAa CAa RAb CAb RAc t DPL t t RP RAS t RP DQM t RCD DQ Hi-Z DAa0 DAa1 QAb0 QAb1 QAb2 QAb3 Activate Command Bank A Write Command Bank A Precharge Command Bank A Activate Command Bank A Read Command Bank A Activate Command Bank A Activate Command Bank A Write Data is masked Precharge Termination of a Write Burst. Precharge Termination of a Read Burst. *BA1=”L” , Bank C , D = Idle G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 69 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Ordering information Part Number GLT5640AL16 - 5.5TC GLT5640AL16 - 6TC GLT5640AL16 - 7TC GLT5640AL16 - 8TC GLT5640AL16 - 10TC GLT5640AL16P - 5.5TC GLT5640AL16P - 6TC GLT5640AL16P - 7TC GLT5640AL16P - 8TC GLT5640AL16P - 10TC GLT5640AL16L - 5.5TC GLT5640AL16L - 6TC GLT5640AL16L - 7TC GLT5640AL16L - 8TC GLT5640AL16L - 10TC Cycle time 5.5 ns 6 ns 7 ns 8 ns 10 ns 5.5 ns 6 ns 7 ns 8 ns 10 ns 5.5 ns 6 ns 7 ns 8 ns 10 ns Package 400mil, 54-Pin Plastic TSOP G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 70 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Parts Numbers (Top Mark) Definition : GLT 5 640A L 16 4 : DRAM 5 : Synchronous DRAM 6 : Standard SRAM /Pseudo SRAM 7 : Cache SRAM 8 : Synchronous Burst SRAM 9 : SGRAM P SPEED - 7 TC PACKAGE TS : TSOP(Type I) ST : sTSOP(Type I) TC : TSOPll (40/44) PL : PLCC FA : 300mil SOP FB : 330mil SOP FC : 445mil SOP J3 : 300mil SOJ J4 : 400mil SOJ P : PDIP(600mil) Q : PQFP TQ : TQFP FG : 48Pin BGA 9x12 FH : 48Pin BGA 8x10 FI : 48Pin BGA 6x8 FJ : 60Ball VFBGA -SRAM 064 : 64K 256 : 256K 512 : 512K 100 : 1M 200 : 2M 400 : 4M CONFIG. 04 : x04 08 : x08 16 : x16 32 : x32 -SRAM/PSEUDO SRAM T : PDIP(300mil) -DRAM 10 : 1M(C/EDO) 11 : 1M(C/FPM) 12 : 1M(H/EDO) 13 : 1M(H/FPM) 20 : 2M(EDO) 21 : 2M(FPM) 40 : 4M(EDO) 41 : 4M(FPM) 80 : 8M(EDO) 81 : 8M(FPM) 160 : 16M(EDO) 161 : 16M(FPM) 640 : 64M(EDO) 641 : 64M(FPM) 12 : 12ns 15 : 15ns 20 : 20ns 55 : 55ns 70 : 70ns 85 : 85ns 120 : 120ns -DRAM VOLTAGE Blank : 5V L : 3.3V M : 2.5V N : 2.0V 25 : 25ns 28 : 28ns 30 : 30ns 35 : 35ns 40 : 40ns 45 : 45ns 50 : 50ns 60 : 60ns 70 : 70ns 80 : 80ns 100 : 100ns SDRAM -SDRAM 40 : 4M 160 : 16M 320 : 32M,4Bank 640 : 64M 640A : 64M 1280 : 128M 020 – 2M 160 – 16M 320 – 32M POWER Blank : Standard L : Low Power LL : Low Low Power SL : Super Low Power 5 : 5ns/200 MHZ 5.5 : 5.5ns/183 MHZ 6 : 6ns/166 MHZ 7 : 7ns/143 MHZ 8 : 8ns/125 MHZ 10 : 10ns/100 MHZ -PSEUDO SDRAM Temperature Range E : Extended Temperature I : Industrial Temperature Blank : Commercial Temperature P : Pb – free part G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 71 - G -LINK GLT5640AL16 4M X 16 CMOS Synchronous Dynamic RAM Feb 2004 (Rev.0.1) Packaging Information • 400mil, 54-Pin Plastic TSOP DIM A A1 A2 b b1 c c1 D ZD e E E1 L R R1 MILLIMETERS MIN. --0.05 0.95 0.30 0.30 0.12 0.12 22.09 NOM. ----1.00 --------22.22 0.71 REF. 0.80 BASIC 11.56 10.03 0.40 0.12 0.12 11.76 10.16 0.50 ----11.96 10.29 0.60 0.25 --0.455 0.395 0.016 0.005 0.005 MAX. 1.20 0.15 1.05 0.45 0.40 0.21 0.16 22.35 MIN. --0.002 0.037 0.012 0.012 0.005 0.005 0.870 INCHES NOM. ----0.039 --------0.875 0.028 REF. 0.0315 BASIC 0.463 0.400 0.020 ----0.471 0.405 0.024 0.010 --MAX. 0.047 0.006 0.041 0.018 0.016 0.008 0.006 0.880 b b1 E1 A1 L RAD R1 54 28 A2 RAD R B B c DETAIL A 0¢X~8¢X SECTION B-B 1 D 27 c1 c BASE METAL WITH PLATING NOTE: 1. CONTROLLING DIMENSION : MILLIMETERS 2. DIMENSION D DOES NOT INCLUDE MOLD PROTRUSION. MOLD PROTRUSION SHALL NOT EXCEED 0.15mm(0.006") PER SIDE. DIMENSION E1 DOES NOT INCLUDE INTERLEAD PROTRUSION. INTERLEAD PROTRUSION SHALL NOT EXCEED 0.25mm(0.01") PER SIDE. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSIONS/INTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD TO BE WIDER THAN THE MAX b DIMENSION BY MORE THAN 0.13mm. DAMBAR INTRUSION SHALL NOT CAUSE THE LEAD TO BE NARROWER THAN THE MIN b DIMENSION BY MORE THAN 0.07mm. b ZD A DETAIL A e SEATING PLANE 0.100(0.004") E G-Link Technology Corporation, Taiwan Web : www.glink.com.tw Email : sales@glink.com.tw TEL : 886-2-27968078 - 72 -
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