M1D-95

一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 DOOR CHIME DUAL TONE WIRELESS DOOR BELL FEATURES 功能叙述 功能叙述 • 3 door chime sound. M1E/M1D-95 遥控门铃 IC M1D-95 D2 WEST MINISTER D1 DING DING D0 DING DONG APPLICATION 产品应用 产品应用 • Door bell system. 门铃系统. ELECTRICAL CHARACTERISTICS 电气规格 电气规格 Characteristics 工作电压 Operating Voltage 工作电流 Operating Current 静态电流 Quiescent Current 推动电流 Driving Current 振荡频率 Oscillator Frequency 工作温度 Operating Temperature Sym. VDD IOP ISB IOL FOSC Temp. Min. 2.4 ─ ─ 1 ─ 0 Typ. 4.5 0.3 1 ─ 80 25 Max. 5 1 10 ─ ─ 60 ( @VDD=4.5V unless otherwise specified ) Unit V mA μA mA KHz ℃ No load @ VDS=1.2V External±30% REMARKS APPLICATION DIAGRAM 参考电路图 参考电路图 M1E A0 A1 A2 A3 A4 A5 A6 A7 VSS 9 10 1 18 VDD DO M1D-95 IR / RF VDD IR / RF A0 A1 1 16 X Y Rosc A2 A3 TE D3 D2 D1 D0 A4 A5 A6 A7 Y X DIN OUT 1K Rosc VDD VSS 8 9 * Rosc ~ M1E : 270KΩ; M1D-95 : 390KΩ * All specs and applications shown above subject to change without prior notice. ( 以上电路及规格仅供参考,本公司得径行修正 ) 1/3 2004-10-06 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 DOOR CHIME DUAL TONE WIRELESS DOOR BELL APPLICATION DIAGRAM 参考电路图 参考电路图 CHIP FORM M1E/M1D-95 遥控门铃 IC A0 A1 VDD IR / RF DO A2 A3 Y Rosc A4 A5 1.74 x 1.74 mm2 底=VDD M1E X TE D3 D2 D1 D0 SOUND D2 WEST MINISTER D1 DING DONG D0 DING DONG A6 A7 VSS VDD Rosc Y A0 A1 A2 A3 A4 A5 A6 A7 VSS OUT IR / RF X 2.00 x1.39 mm2 底=VDD 1K M1D-95 DIN VDD * Rosc ~ M1E : 270KΩ; M1D-95 : 390KΩ *All specs and applications shown above subject to change without prior notice. ( 以上电路及规格仅供参考,本公司得径行修正 ) 2/3 2004-10-06 一華半導體股份有限公司 MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 DOOR CHIME DUAL TONE WIRELESS DOOR BELL ASSIGNMENT & POSITION 5 6 7 M1E/M1D-95 遥控门铃 IC 8 4 (M1D-95) Y 9 X ( 0,0 ) 3 2 1 16 15 14 13 12 11 10 No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 NAME A0 VDD TEST3 OSC2 OSC1 DIM BZ TEST VSS A7 A6 A5 A4 A3 A2 A1 X -561 -560.25 -562.5 -560.25 -317.25 -163.5 559.5 559.5 559.5 559.5 559.5 379.5 198.75 23.25 -150 -325.5 UNIT : um Y -870 -723.75 -585.75 537 870 869.25 869.25 636.75 480 717.75 -872 -867.75 -867.75 -868.5 -867.75 -868.5 * CHIP SIZE ~ 2.00 x 1.39 mm2 * IC substrate should be connected to VDD in PCB (PCB 上 IC 必须接 VDD) 3/3 2004-10-06