PS1102HA
Features
Package 2125 Type, Water clear epoxy
Surface Mount Phototransistor/2125 Type
Product features
・Outer Dimension 2.0 x 1.25 x 0.8mm ( L x W x H ) ・ Small Size ・Photo Current : 2mA TYP. (VCE=5V,Ee=5mW/cm2) ・Wide Distribution ・No lead package ・Lead–free soldering compatible
Peak Sensitivity Wavelength Half Intensity Angle Die materials Rank grouping parameter Assembly method Soldering methods
880nm θx = 130 deg., θy = 135 deg. Si Sorted by photo current per rank taping Auto pick & place machine (Auto Mounter)
Reflow soldering, and manual soldering ※Please refer to Soldering Conditions about soldering.
Taping and reel ESD
4,000pcs per reel in a 8mm width tape. (Standard) Reel diameter:φ180mm 2kV (HBM)
Recommended Applications
Car Audio, Electric Household Appliances, OA/FA, PC/Peripheral Equipment, Other General Applications
2004.11.17
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PS1102HA
Surface Mount Phototransistor/2125 Type
Abs olute Maximum R atings
Ite m Colle ctor Dissipa tion Colle ctor-E mitte r Volta g e E mitte r-Colle ctor Volta g e Colle ctor Curre nt Ope ra ting T e mpe ra ture S tora g e Te mpe ra ture
S ymbol Abs olute Max imum Ratings
(Ta=25℃)
Unit mW V V mA ℃ ℃
Pc V CE O V E CO Ic T opr T s tg
75 30 5 20 -30∼ +85 -40∼ +90
E lectro- Optical Characteris tics
Ite m S ymbol Cha ra cte ristics Min. T YP . 0.4 2
(Ta=25℃)
Conditions V CE =5V, E e =5mW/cm 2
※1
Unit mA mA
P hoto Curre nt
Ic
Re sponse T ime
V C E =10V, Ic=2mA, R L =100Ω V CE O=10V V C E =5V V C E =5V
tr/tf
T YP .
8/9
μs
Da rk Curre nt P e a k S e nsitivity Wa ve le ng th S pa tia l Ha lf Width
IC E O λp ⊿θ
Ma x . T YP . T YP .
0.1 880 130(θ x ) 135(θ y)
μA nm de g.
※ 1 Color te mpe ra ture is 2,856K. E mploys a sta nda rd tungste n la mp.
2004.11.17
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PS1102HA
Surface Mount Phototransistor/2125 Type
Photo Current Rank
Ic(mA) R ank MIN. A B C D E 0.4 0.7 1.2 2.1 3.6 MAX . 0.8 1.4 2.4 4.2 7.2 V CE = 5V E e = 5mW/cm
2
(Ta=25℃)
Condition
※Please contact our sales staff concerning rank designation.
2004.11.17
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PS1102HA
Surface Mount Phototransistor/2125 Type
Technical Data
Relative Sensitivity vs. Sensitivity Wavelength
Condition : Ta = 25℃, VCE = 5V
Spatial Distribution Example
Condition : Ta = 25℃
Relative Sensitivity
Sensitivity Wavelength [nm]
Radiation Luminance vs. Relative Photo Current
Condition : Ta = 25℃, VCE = 5V
Collector-Emitter Voltage vs. Photo Current
Condition : Ta = 25℃
Relative Photo Current Ic
Radiation Luminance Ee(mW/cm2) It is based on Ee=5mW/cm2. Employs a standard tungsten lamp of 2,856K.
Photo Current Ic (mA)
Collector-Emitter Voltage VCE(V) Employs a standard tungsten lamp of 2,856K.
2004.11.17
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PS1102HA
Surface Mount Phototransistor/2125 Type
Technical Data
Response Time Measuring Circuit
Load Resistance vs. Response Time
Condition : VCE=10V, Ic=2mA, Ta=25℃
Response Time (μs)
Load Resistance : RL(Ω)
Ambient Temperature vs. Collector Dissipation
Ambient Temperature vs. Dark Current
Condition : VCEO = 10V
Collector Dissipation : Pc(mW)
Ambient Temperature : Ta(℃)
Dark Current : ICEO(nA)
Ambient Temperature : Ta(℃)
2004.11.17
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PS1102HA
Surface Mount Phototransistor/2125 Type
Technical Data
Ambient Temperature vs. Relative Photo Current
Condition : VCE = 5V
Relative Photo Current Ic (mA)
Ambient Temperature : Ta(℃)
2004.11.17
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PS1102HA
Surface Mount Phototransistor/2125 Type
Package Dimensions
(Unit: mm) Weight: (2.84)mg
Recommended Soldering Pattern
(Unit: mm)
Taping Specification
Quantity: 4,000pcs/ reel (standard)
(Unit: mm)
2004.11.17
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PS1102HA
Surface Mount Phototransistor/2125 Type
Reflow Soldering Conditions
1) The above profile temperature gives the maximum temperature of the device resin surface. Please set the temperature so as to avoid exceeding this range. 2) Total times of reflow soldering process shall be no more than 2 times. When the second reflow soldering process is performed, intervals between the first and second reflow should be short as possible (while allowing some time for the component to return to normal temperature after the first reflow) in order to prevent the device from absorbing moisture. 3) Temperature fluctuation to the device during the pre-heating process shall be minimized.
Manual Soldering Conditions
Iron tip temp. Soldering time and frequency 350 ℃ 3s 1 time (MAX.) (30 W Max.) (MAX.) (MAX.)
2005.1.7
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PS1102HA
Surface Mount Phototransistor/2125 Type
Reliability Testing Result
Reliability Testing Result Room Temp. Operating Life Applicable Standard EIAJ ED4701/100(101) Testing Conditions Ta = 25℃, Pc = Maxium Rated Power Dissipation (Pretreatment) Individual standard (Reflow Soldering) Pre-heating 150 ℃ 1 20s →Operating Heating 240 ℃ 5 s (Pretreatment) Individual standard (Reflow Soldering) Pre-heating 180 ℃ 1 20s →Operating Heating 260 ℃ 5 s Minimum Rated Storage Temperature(30min) ~Normal Temperature(15min) ~Maximum Rated Storage Temperature(30min) ~Normal Temperature(15min) Ta = 60±2 ℃, RH = 90±5% Ta = Maximum Rated Storage Temperature Ta = Minimum Rated Storage Temperature 98.1m/s ( 10G), 100 ~ 2 KHz sweep for 20min., XYZ each direction
2
Duration 1,000 h
Failure 0/16
-
0/16
Resistance to Soldering Heat
EIAJ ED4701/300(301)
-
0/16
Temperature Cycling Wet High Temp. Storage Life High Temp. Storage Life Low Temp. Storage Life Vibration, Variable Frequency
EIAJ ED4701/100(105) EIAJ ED4701/100(103) EIAJ ED4701/200(201) EIAJ ED4701/200(202) EIAJ ED4701/400(403)
5 cycles
0/16
1,000 h 1,000 h 1,000 h 2h
0/16 0/16 0/16 0/16
Failure Criteria
Items Symbols Conditions
EE Value of each product Radiant Intensity of Photo Current VCE Value of each product Collector-emitter Voltage of Photo Current VCEO Value of each product Collector-emitter Voltage of Dark Current -
Failure criteria
Photo Current
IC
Testing Max. Value ≧Initial Value x 1.3 Testing Min. Value ≦ Initial Value x 0.7
Dark Current Cosmetic Appearance
ICEO -
Testing Max. Value ≧ Spec. Max. Value x 1.2 No notable, decoloration, deformation and cracking
2004.11.17
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PS1102HA
Surface Mount Phototransistor/2125 Type
Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet
1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products described in the data sheets are made to be used in standard electronic applications such as office automation appliances, communication devices, audio visual, home appliances, and measuring instruments. 5) If the products in the data sheets are to be used for purposes other than the above which requires high level reliability and safety where failure and or malfunction of the product may cause death or other serious effects on the human body such as airplane, space activity, transportation, medical, nuclear), please contact our sales personnel. 6) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 7) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 8) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com
2004.11.17
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