SFH9310

Gabellichtschranke Slotted Interrupter SFH 9310 Wesentliche Merkmale • Kompaktes Gehäuse • GaAs-IR-Sendediode (950 nm) • Si-Fototransistor mit Tageslichtsperrfilter Features • Compact type • GaAs infrared emitter (950 nm) • Silicon phototransistor detector with daylight-cutoff filter Applications • Speed control • Motor control • Monitoring of paper feed in printers, copiers, facsimiles • Disk drives • Control of print head in printers • Coin detection • Optoelectronic switches Anwendungen • Geschwindigkeitsüberwachung • Motorsteuerung • Überwachung des Papiervorschubs in Druckern, Kopier- und Faxgeräten • Speicherlaufwerke • Steuerung des Druckkopfes in Druckern • Münzdetektion • Optoelektronische Schalter Typ Type SFH 9310 Bestellnummer Ordering Code Q62702-P5214 Gehäuse Package Schwarzes Polykarbonat Plastikgehäuse, Anschlüsse im 2.54-mm Raster, Senderseite durch Buchstaben „E“, Empfängerseite durch Buchstaben „S“ gekennzeichnet, Kathode / Transistoremitter durch schräge Kante gekennzeichnet. Black polycarbonate plastic material housing, solder tabs 2.54-mm (1/10”) spacing, emitter side marked with letter “E”, sensor side marked with letter “S”, cathode / emitter of transistor marked with edge at an angle. 2001-02-22 1 SFH 9310 Grenzwerte TA = 25 °C Maximum Ratings Bezeichnung Parameter Sender (GaAs-Diode) Emitter (GaAs Diode) Sperrspannung Reverse voltage Durchlaßstrom Forward current Verlustleistung Power dissipation Wärmewiderstand Thermal resistance Empfänger (Si-Fototransistor) Detector (Silicon Phototransistor) Kollektor-Emitter-Spannung Collector-emitter voltage Kollektor-Emitter-Spannung, (t ≤ 2 min) Collector-emitter voltage, (t ≤ 2 min) Emitter-Kollektor-Spannung Emitter-collector voltage Kollektorstrom Collector current Verlustleistung Total power dissipation Wärmewiderstand Thermal resistance Gabellichtschranke Slotted Interrupter Lagertemperatur Storage temperature range Betriebstemperatur Operating temperature range Elektrostatische Entladung Electrostatic discharge Symbol Symbol Wert Value Einheit Unit VR IF (DC) Ptot RthJA 5 60 100 280 V mA mW K/W VCE VCE VEC IC Ptot RthJA 30 70 7 50 150 280 V mA mW K/W Tstg Top ESD – 40 … + 85 – 40 … + 85 2 °C kV 2001-02-22 2 SFH 9310 Kennwerte TA = 25 °C Characteristics Bezeichnung Parameter Sender (GaAs-Diode) Emitter (GaAs Diode) Wellenlänge der Strahlung Wavelength of peak emission Durchlaβspannung Forward voltage IF = 20 mA, tp = 20 ms Sperrstrom Reverse current VR = 5 V Kapazität Capacitance VR = 0 V, f = 1 MHz Empfänger (Si-Fototransistor) Detector (Silicon Phototransistor) Wellenlänge der max. Fotoempfindlichkeit Wavelength of max. sensitivity Spectr. Bereich der Fotoempfindlichkeit Spectral range of sensitivity S = 10% of Smax Kapazität Capacitance VCE = 0 V, f = 1 MHz, E = 0 Dunkelstrom Dark current VCE = 20 V λS max λ 920 840 … 1080 nm nm λpeak 950 1.2 (≤ 1.4) nm V Symbol Symbol Wert Value Einheit Unit VF IR 0.01 (≤ 1) µA C0 16 pF CCE 6.5 pF ICEO 2 (≤ 50) nA 2001-02-22 3 SFH 9310 Kennwerte TA = 25 °C Characteristics (cont’d) Bezeichnung Parameter Gabellichtschranke Slotted interrupter Kollektor-Emitterstrom Collector-emitter current IF = 20 mA; VCE = 5 V Kollektor-Emitter-Sättigungsspannung Collector-emitter-saturation voltage IF = 20 mA; IC = 0.2 mA Anstiegs- und Abfallzeit Rise and fall time VCC = 5 V, IC = 1 mA, RL = 1 kΩ Symbol Symbol Wert Value Einheit Unit ICE min. ICE typ. VCE sat > 0.7 mA ≤ 0.4 V tr tf 13 17 µs µs 2001-02-22 4 SFH 9310 Forward Current IF = f (VF) Single pulse, tp = 20 µs ΙF 10 4 mA 10 3 OHF00367 Max. Permissible Forward Current IF = f (TA) 90 OHF00372 Dark Current ICEO = f (TA) VCE = 20 V, E = 0 Ι CEO 10 3 nA OHF00380 Ι F mA 70 10 2 R thJA = 280 K/W 60 50 10 2 10 1 40 10 1 10 0 30 20 10 0 10 -1 10 10 -2 0 0.5 1 1.5 2 2.5 3 V VF 4 0 0 20 40 60 80 C TA 120 10 -1 0 20 40 60 80 ˚C 100 TA Total Power Dissipation for Emitter and Detector Ptot = f (TA) 160 P tot 140 120 100 80 60 40 20 0 Emitter OHF00410 Detector 0 20 40 60 80 ˚C 100 TA 2001-02-22 5 SFH 9310 Maßzeichnung Package Outlines 2 1 3 4 14.4 (0.567) 6.2 (0.244) 5.8 (0.228) Marking this side 2.34 (0.092) 8.0 (0.315) 2.74 (0.108) 10.5 (0.413) 10.1 (0.398) 3.5 (0.138) 2.5 (0.098) 0.6 (0.024) 0.4 (0.016) 7.8 (0.307) 14.0 (0.551) 5.2 (0.205) 4.8 (0.189) Optical axis 0.5 (0.020) 0.3 (0.012) 10.5 (0.413) 10.1 (0.398) 0.6 (0.024) 0.4 (0.016) 2.54 (0.100) 2.0 (0.079) 1 Circuitry 4 Emitter Sensor 2 3 GPXY6010 Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). 2001-02-22 6 7.7 (0.303) SFH 9310 Löthinweise Soldering Conditions Bauform Type Tauch-, Schwalllötung Dip, Wave Soldering Peak Temp. (solderbath) SFH 9310 260 °C Max. Time in Peak Zone 10 s Reflowlötung Reflow Soldering Peak Temp. (package temp.) n. a. Max. Time in Peak Zone – Kolbenlötung Iron Soldering (Iron temp.) 300 °C < 5 s Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg © All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2001-02-22 7