TC164-JR07IM

TC164 (8Pin/4R) 5% DATA SHEET CHIP RESISTORS ARRAY Product Specification – Mar. 24, 2004 V.4 Supersedes Date of Feb. 10, 2004 2 Chip Resistor Surface Mount TC SERIES 164 7 SCOPE T his specification describes TC164 series chip resistors made by thick film process. ORDERING INFORMATION P art number is identified by the series, size, tolerance, packing style, temperature coefficient, special type and resistance value. TC164 – X X X XX XXXX (1) (2) (3) (4) (5) MARKING TC164 (1) TOLERANCE J = ±5% YNSC020 F irst two digits for significant figure and 3rd digit for number of zeros Fig. 1 5% Marking, Value=56Ω (2) PACKAGING TYPE R = Paper taping reel Letter R: decimal place (3) TEMPERATURE CHARACTERISTIC OF RESISTANCE G = ±200ppm/°C – = Base on spec DIMENSION Concave termination a B T W1 W2 Table 1 TYPE B (mm) H (mm) P (mm) P L a TC164 0.3±0.15 0.5±0.15 0.8±0.05 3.2±0.20 0.6±0.1 0.3±0.15 1.6±0.15 (4) SPECIAL TYPE 07 = 7 inch dia. Reel 13 = 13 inch dia. Reel L (mm) T (mm) W1 (mm) W2 (mm) YNSC021 (5) RESISTANCE VALUE: 56R, 560R, 5K6, 56K, 1M. H Fig. 2 TC164 series chip resistors construction SCHEMATIC For dimension see Fig. 2 and Table 1 8 7 6 5 R1 R2 R3 R4 YNSC022 1 2 3 4 Fig. 3 Equivalent circuit diagram R1=R2=R3=R4 w ww.yageo.com M ar. 24, 2004 V.4 3 Chip Resistor Surface Mount TC SERIES 164 7 POWER RATING RATED POWER AT 70°C, TC164 =1/16W FOR ELEMENT Pmax (%Prated) 100 MRA632 ELECTRICAL CHARACTERISTICS Table 2 CHARACTERISTICS Operating Temperature Range Maximum Working Voltage Maximum Overload Voltage Dielectric Withstanding Voltage Number of Resistors TC164 1/16W –55°C to +155°C 50V 100V 100V 4 10Ω to 1MΩ Zero Ohm Jumper specification and without open/short Resistance To Soldering Heat Immerse the specimen in the solder pot at 260±5°C. for 10±1 seconds. Have the specimen stabilized at room temperature for 30 minutes minimum. Measure the resistance to determine ΔR/R(%). ±(1.0%+0.05Ω) No visible damage w ww.yageo.com M ar. 24, 2004 V.4 6 Chip Resistor Surface Mount TC SERIES 164 7 TYPE Moisture Resistance TEST METHOD Place the specimen in the test chamber and subject to 42 damp heat cycles. Each one of which consists of the steps 1 to 7 as figure 9. The total length of test is 1,000 hours. Have the specimen stabilized at room temperature for 24 hours after testing. Measure the resistance to determine ΔR/R(%). ACCEPTANCE STANDARD ±(2.0%+0.05Ω) No visible damage Life Place the specimen in the oven at 70±2°C. Apply the rated voltage to the specimen at the 1.5 hours on and 0.5 hour off cycle. The total length of test is 1,000 hours. Have the specimen stabilized at room temperature for one hour minimum after testing. Measure the ΔR/R(%). ±(3.0%+0.1Ω) No visible damage Solderability Immerse the specimen in the solder pot at 235±5°C for 5 sec. At least 95% solder coverage on the termination Bending Strength Mount the specimen on a test board as shown in the figure 8. Slowly apply the force till the board is bent for 5±1 sec. Measure the ΔR/R(%) at this position. Type Bent Distance (d) TC164 1mm ±(1.0%+0.05Ω) No visible damage Fig. 8 Principle of the bending test w ww.yageo.com M ar. 24, 2004 V.4 7 Chip Resistor Surface Mount TC SERIES 164 7 75 temperature [°C] 50 initial drying 24 hours 90 − 98% RH 80 − 98% RH 90 − 98% RH 80 − 98% RH 90 − 98% RH rate of change of temperature is unspecified, however, specimens shall not be subjected to radiant heating from chamber conditioning processes +10 °C (+18 °F) −2 °C (−3.6 °F) initial measurements as specified in 2.2 circulation of conditioning air shall be at a minimum cubic rate per minute equivalent to 10 times the volume of the chamber end of final cycle; measurements as specified in 2.7 25 0 temperature tolerance ±2 °C (±3.6 °F) unless otherwise specified STEP1 prior to first cycle only HBK073 optional sub-cycle if specified (2.3); sub-cycle performed during any 5 of the first 9 cycles; humidity uncontrolled during sub-cycle voltage applied as specified in 2.4 STEP2 STEP3 STEP4 STEP5 STEP6 STEP7 one cycle 24 hours; repeat as specified in 2.5 0 5 10 15 20 time [h] 25 Fig. 9 Conditions by change of temperature w ww.yageo.com M ar. 24, 2004 V.4