UDT-455HS

Photops™ Photodiode-Amplifier Hybrids The Photop™ Series, combines a photodiode with an operational amplifier in the same package. Photops™ general-purpose detectors have a spectral range from either 350 nm to 1100 nm or 200 nm to 1100nm. They have an integrated package ensuring low noise output under a variety of operating conditions. These op-amps are specifically selected by UDT Sensors engineers for compatibility to our photodiodes. Among many of these specific parameters are low noise, low drift and capability of supporting a variety of gains and bandwidths determined by the external feedback components. Operation from DC level to several MHz is possible in an either unbiased configuration for low speed, low drift applications or biased for faster response time. LN-Series Photops™ are to be used with OV-bias. Any modification of the above devices is possible. The modifications can be simply adding a bandpass optical filter, integration of additional chip (hybrid) components inside the same package, utilizing a different op-amp, photodetector replacement, modified package design and / or mount on PCB or ceramic. For your specific requirements, contact one of our Applications Engineers. " APPLICATIONS • General Purpose Light Detection • Laser Power Monitoring • Medical Analysis • Laser Communications • Bar Code Readers • Industrial Control Sensors • Pollution Monitoring • Guidance Systems • Colorimeter " FEATURES • Detector/Amplifier Combined • Adjustable Gain/Bandwidth • Low Noise • Wide Bandwidth • DIP Package • Large Active Area Great Britain: LASER COMPONENTS (UK) Ltd., Phone: +44 1245 491 499, Fax: +44 1245 491 801, info@lasercomponents.co.uk Photops™ (Photodiode Specifications) Typical Electro-Optical Specifications at TA=23ºC Shunt Resistance (MΩ) Model Number A ctive Area Responsivity (A/W) Capacitance (pF) Dark Current (nA) Reverse Voltage NEP (W/√Hz) Temp.* Range (°C) Package Style ¶ Operating Storage Area (mm2) Dimension (mm) 254 nm 970 nm 0V -10 V -10 V -10 mV typ. 0V 254 nm typ. -10V 970 nm typ. V max. 350-1100 nm Spectral Range UDT-451 UDT-455 UDT-455LN** UDT-455HS UDT-020D UDT-555D 16 100 4.57 φ 11.3 φ 5.1 2.54 φ --0.60 0.65 330 1500 60 300 0.5 2 10 25 85 15 0.25 3 --1.9 e- 14 3.9 e -14 -30 ~ +100 0 ~ +70 max. min. min. typ. typ. typ. typ. typ. 29 / DIP 1.4 e- 14 30** 30 / TO-5 31 / TO-8 32 / Special 200-1100 nm Spectral Range UDT-455UV UDT455UV/LN** UDT-020UV UDT-055UV UDT-555UV UDT555UV/LN** 100 11.3 φ 4500 10 2.9 e -13 5.1 2.54 φ 300 100 9.2 e -14 30 / TO-5 16 50 4.57 φ 7.98 φ 0.10 0.14 --- 1000 2500 --- 50 20 1.3 e -13 2.1 e -13 --5** 31 / TO-8 32 / Special 32 / Special Operational Amplifier Specifications Typical Electro-Optical Specifications at TA=23 ºC Quiescent Supply Current (mA) Temp. Coefficient Input Offset Voltage Model Number 1 kHz ± 15 V max. max. typ. typ. typ. min. mV max. µV / ºC max. typ. typ. pA max. MHz typ. min. V / µs typ. min. V / mV typ. min. nV/√Hz typ. typ. fA/√ Hz typ. UDT-451 UDT-455 UDT-455UV UDT-020D UDT-020UV UDT-455HS UDT-455LN** UDT455UV/LN** UDT-055UV UDT-555D UDT-555UV --- ±15 ±18 1.4 2.5 3.0 6.0 10 --- 30 200 --- 4.0 --- 13 50 150 --- 18 --- ±15 ±18 2.8 5.0 0.5 3 4 30 ±80 ±400 3.0 5.4 5 9 50 200 20 15 --±5 ±15 ±15 ±18 ±18 4.8 0.9 8.0 1.8 0.5 0.26 3 1 4 --- 30 20 ±80 0.15 ±500 0.3 11 0.5 26 1 25 0.5 40 3 50 50 200 2500 20 78 15 27 0.22 --- ±15 ±22 2.7 4.0 0.4 1 3 10 ±40 ±200 3.5 5.7 7.5 11 75 220 20 15 ¶ For mechanical drawings please refer to pages 55 thru 66. ** LN – Series Devices are to be used with a 0V Bias. * Non-Condensing temperature and Storage Range, Non-Condensing Environment. Great Britain: LASER COMPONENTS (UK) Ltd., Phone: +44 1245 491 499, Fax: +44 1245 491 801, info@lasercomponents.co.uk 1 kHz 100 Hz Supply Voltage (V) Input Offset Voltage Input Bias Current Gain Bandwidth Product Slew Rate Open Loop Gain, DC Input Noise Voltage Input Noise Current 10 10 10 10 Photop Series Schematic Diagrams The output voltage is proportional to the light intensity of the light and is given by: (1) Frequency Response (Photodiode/Amplifier Combination) The frequency response of the photodiode / amplifier combination is determined by the characteristics of the photodetector, pre-amplifier as well as the feedback resistor (RF) and feedback capacitor (CF). For a known gain, (RF), the 3dB frequency response of the detector/pre-amp combination is given by: (2) However, the desired frequency response is limited by the Gain Bandwidth Product (GBP) of the op-amp. In order to have a stable output, the values of the RF and CF must be chosen such that the 3dB frequency response of the detector / pre-amp combination, be less than the maximum frequency of the op-amp, i.e. f3dB fmax. (3) where CA is the amplifier input capacitance. In conclusion, an example for frequency response calculations, is given below. For a gain of 108, an operating frequency of 100 Hz, and an opamp with GBP of 5 MHz: (4) Thus, for CF = 15.9 pF, CJ = 15 pF and CA = 7 pF, fmax is about 14.5 kHz. Hence, the circuit is stable since f 3dB fmax. For more detailed application specific discussions and further reading, refer to the APPLICATION NOTES INDEX in the catalog. Note: The shaded boxes represent the Photop™ components and their connections. The components outside the boxes are typical recommended connections and components. Great Britain: LASER COMPONENTS (UK) Ltd., Phone: +44 1245 491 499, Fax: +44 1245 491 801, info@lasercomponents.co.uk Photodiode Care and Handling Instructions AVOID DIRECT LIGHT Since the spectral response of silicon photodiode includes the visible light region, care must be taken to avoid photodiode exposure to high ambient light levels, particularly from tungsten sources or sunlight. During shipment from UDT Sensors, your photodiodes are packaged in opaque, padded containers to avoid ambient light exposure and damage due to shock from dropping or jarring. AVOID SHARP PHYSICAL SHOCK Photodiodes can be rendered inoperable if dropped or sharply jarred. The wire bonds are delicate and can become separated from the photodiode’s bonding pads when the detector is dropped or otherwise receives a sharp physical blow. CLEAN WINDOWS WITH OPTICAL GRADE CLOTH / TISSUE Most windows on UDT Sensors photodiodes are either silicon or quartz. They should be cleaned with isopropyl alcohol and a soft (optical grade) pad. OBSERVE STORAGE TEMPERATURES AND HUMIDITY LEVELS Photodiode exposure to extreme high or low storage temperatures can affect the subsequent performance of a silicon photodiode. Storage temperature guidelines are presented in the photodiode performance specifications of this catalog. Please maintain a non-condensing environment for optimum performance and lifetime. OBSERVE ELECTROSTATIC DISCHARGE (ESD) PRECAUTIONS UDT Sensors photodiodes, especially with IC devices (e.g. Photops) are considered ESD sensitive. The photodiodes are shipped in ESD protective packaging. When unpacking and using these products, anti-ESD precautions should be observed. DO NOT EXPOSE PHOTODIODES TO HARSH CHEMICALS Photodiode packages and/or operation may be impaired if exposed to CHLOROTHENE, THINNER, ACETONE, or TRICHLOROETHYLENE. INSTALL WITH CARE Most photodiodes in this catalog are provided with wire or pin leads for installation in circuit boards or sockets. Observe the soldering temperatures and conditions specified below: Soldering Iron: Soldering 30 W or less Temperature at tip of iron 300°C or lower. Bath Temperature: Immersion Time: Soldering Time: DO NOT USE DO NOT USE 260±5°C. within 5 Sec. within 3 Sec. Dip Soldering: Vapor Phase Soldering: Reflow Soldering: Photodiodes in plastic packages should be given special care. Clear plastic packages are more sensitive to environmental stress than those of black plastic. Storing devices in high humidity can present problems when soldering. Since the rapid heating during soldering stresses the wire bonds and can cause wire to bonding pad separation, it is recommended that devices in plastic packages to be baked for 24 hours at 85°C. The leads on the photodiode SHOULD NOT BE FORMED. If your application requires lead spacing modification, please contact UDT Sensors Applications group at (310)978-0516 before forming a product’s leads. Product warranties could be voided. Great Britain: LASER COMPONENTS (UK) Ltd., Phone: +44 1245 491 499, Fax: +44 1245 491 801, info@lasercomponents.co.uk 1. Parameter Definitions: A a B c = = = = Distance from top of chip to top of glass. Photodiode Anode. Distance from top of glass to bottom of case. Photodiode Cathode (Note: cathode is common to case in metal package products unless otherwise noted). W = Window Diameter. F.O.V. = Filed of View (see definition below). 2. Dimensions are in inches (1 inch = 25.4 mm). 3. Pin diameters are 0.018 ± 0.002" unless otherwise specified. 4. Tolerances (unless otherwise noted) General: 0.XX ±0.01" 0.XXX ±0.005" Chip Centering: ±0.010" Dimension ‘A’: ±0.015" 5. Windows All ‘UV’ Enhanced products are provided with QUARTZ glass windows, 0.027 ± 0.002" thick. All ‘XUV’ products are provided with removable windows. All ‘DLS’ PSD products are provided with A/R coated glass windows. All ‘FIL’ photoconductive and photovoltaic products are epoxy filled instead of glass windows. Great Britain: LASER COMPONENTS (UK) Ltd., Phone: +44 1245 491 499, Fax: +44 1245 491 801, info@lasercomponents.co.uk Mechanical Specifications All units in inches. Pinouts are bottom view. www.lasercomponents.com Issue: 02/04 / V1 / HW / www/pdf/udt/ photops.pdf Great Britain: LASER COMPONENTS (UK) Ltd., Phone: +44 1245 491 499, Fax: +44 1245 491 801, info@lasercomponents.co.uk