0603ESDA-TR1

0603ESDA-TR, PolySURG™ TR Series ESD Suppressor Features: • 0603/1608 foot print • Ideal ESD protection for high frequency, low voltage applications. • Exceeds testing requirements outlined in IEC 61000-4-2 • Ultra low capacitance (0.15pF maximum) • Very low leakage current • Fast response time • Bi-directional • Surface mount Applications • Computers & Peripherals • HDTV Equipment • DVD Players • A/V Equipment • Satellite Radio • Cell Phones • PDA’s • Digital Still Cameras • Digital Camcorders • MP3 / Multimedia Players • Set Top Boxes • External Storage • DSL Modems • High Speed Data Ports • USB 2.0 • IEEE 1394 • HDMI • DVI • High Speed Ethernet • Infiniband® Description The PolySURG™ 0603ESDA-TR ESD Suppressors protect valuable high-speed data circuits from ESD damage without distorting data signals as a result of its ultra-low (0.15pF maximum) capacitance. Ordering Information Catalog Number 0603ESDA-TR1 Packaging 5,000 pieces in paper tape on 7" (178mm) reel Part Ratings and Characteristics: Performance Characteristics Continuous operating voltage Clamping voltage2 capability4 Trigger voltage3 ESD Threat voltage Capacitance (@ 1 KHz ~ 1.8GHz) Leakage current (@ 12 VDC) Peak current2 Operating temperature ESD pulse withstand 2 Units VDC V V kV pF nA A °C # pulses Min 0.01 -56 20 Typ 35 125 8 5001 Max 24 60 15 0.15 45 +105 Notes: 1. Some shifting in characteristics may occur when tested over several hundred ESD pulses at very rapid rate of 1 pulse per second or faster. 2. Per IEC 61000-4-2, 30A @ 8kV, level 4, clamp measurement made 30ns after initiation of pulse, all tests in contact discharge mode. 3. Trigger measurement made using Transmission Line Pulse (TLP) method 4. PolySURG™ devices are capable of withstanding up to a 15 kV, 45A ESD pulse. Device ratings are given at 8kV per Note 1, unless otherwise specified. 0603ESDA-TR, PolySURG™ TR Series ESD Suppressor Product Dimension R T H Recommended Solder Pad Outline (per IPC-SM-782) L W EIA Size mm (in) 0.60 min (.023 min) 1.1 ref (.043 ref) 1.0 max (.039 max) L W H T R 0603ESDA 1.60 ± 0.10 0.80 ± 0.10 0.50 ± 0.10 0.30 ± 0.20 0.70 ± 0.10 (.063 ± .004) (.031 ± .004) (.020 ± .004) (.012 ± .008) (.028 ± .004) Tape-and-Reel Specification 4.0±0.1 (.157±.004) B 2.0±0.05 (.079±.002) 3.5±0.05 (.138±.002) A 8.0±0.30 (.315±.012) 2.0±0.75 (.079±.030) mm (inches) 4.0±0.1 (.157±.004) 1.5±0.10 (.059±.004) 1.75±0.1 (.069±.004) 21±0.8 (.827±.032) 13.0±0.5 (.512±.020) 2.0±0.5 (.080±.020) 60.0±1.5 (2.362±.059) 178.0±2.0 (7.008±.080) Dimension A B 0603 1.90±0.20 (.075±0.008) 1.10±0.20 (.043±0.008) 9.0±1.5 (.354±.059) Environmental Specifications: • Moisture Resistance per EIA/IS-722 Paragraph 4.4.2. This standard is based upon MIL-STD-202G Method 103B but with temperature and relative humidity at +85°C and 85% RH respectively. Test condition ‘A’ (240Hr) per MIL-STD-202G • Thermal shock: MIL-STD-202, Method 107G, -55°C to 125°C, 30 min. cycle, 10 cycles • Vibration: MIL-STD-202F, Method 201A,(10 to 55 to 10 Hz, 1 min. cycle, 2 hrs each in X-Y-Z) • Chemical resistance: ASTM D-543, 4 hrs @ 40°C, 3 solutions (H2O, detergent solution, defluxer) • Operating temperature characteristics, measurement at +25°C, +105°C and -56°C • Full load voltage: 14.4VDC, 18VDC & 24VDC for 1000 hrs, 25°C • Solder leach resistance and terminal adhesion: Per EIA-576 • Solderability: MIL-STD-202, Method 208 (95% coverage) 0603ESDA-TR, PolySURG™ TR Series ESD Suppressor Device Marking ESDA devices are marked on the tape and reel packages, not individually. Since the product is bi-directional and symmetrical, no orientation marking is required. Design Consideration The location in the circuit for the TR series has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a “0-stub” pad design (pad directly on the signal/data line and second pad directly on common ground). Processing Recommendations The TR series currently has a convex profile on the top surface of the part. This profile is a result of the construction of the deice. They can be processed using standard pick-and-place equipment. The placement and processing techniques for these devices are similar to those used for chip resistors and chip capacitors. Soldering Recommendations • Compatible with lead and lead-free solder reflow processes • Peak reflow temperatures and durations: • IR Reflow = 260°C max for 10 sec. max. • Wave Solder = 260°C max. for 10 sec. max. • Recommended IR Reflow Profile: 0603 7/05 © Cooper Electronic Technologies 2005 Visit us on the Web at www.cooperbussmann.com sales@cooperbussmann.com 1225 Broken Sound Pkwy. NW, Suite F Boca Raton, Florida 33487 Tel: +1-561-998-4100 Toll Free: +1-888-414-2645 Fax: +1-561-241-6640