AG606-PCB

AG606 Product Features x x x x x x 50 – 860 MHz ±0.7 dB Gain Flatness +20 dBm P1dB +37 dBm Output IP3 +73 dBm Output IP2 -68 dBc CTB The Communications Edge TM Product Information Push-Pull CATV Amplifier Product Description The AG606 is a dual amplifier containing two internal matched amplifiers optimal for a push-pull configuration. The internal amplifiers employ InGaP HBT technology for a cost-effective low-distortion solution. The AG606 is ideal for drop amplifiers, splitters, and other low to moderate power outside plant CATV applications. The amplifier can also be useful in low power headend applications such as linear laser drivers. The AG606 has excellent VSWR when used in a 75 : push-pull configuration. It is provided in a low-cost environmentally-friendly lead-free/green/RoHS-compliant SOT-89 package. Functional Diagram 1 2 3 4 8 7 6 5 x -80 dBc CSO +34 dBmV/channel, 79 channels x Matched amplifiers for a +34 dBmV/channel, 79 channels push-pull configuration x +7V Single Positive Supply x MTTF > 1000 Years Function Amp 1 Input Amp 2 Input Amp 2 Output Amp 1 Output Ground Pin No. 1 4 5 8 2, 3, 6, 7, Backside paddle Applications x CATV Head End Equipment x CATV Line Amplifiers x FTTH Repeaters Single-ended Device Specifications(1) Parameter Test Frequency Gain Output IP3 (2) Device Current Device Voltage ¡ Typical Performance (3) Parameter Frequency Gain (4) Input Return Loss Output Return Loss CTB (5) CSO (5) XMOD (5) Output P1dB Output IP2 (6) Output IP3 (2) Noise Figure (4) Device Bias Units Min MHz dB dBm mA V 13.2 +33.5 76 Typ 800 14.3 +36 82.5 5.25 Max 15.5 90 Units MHz dB dB dB dBc dBc dBc dBm dBm dBm dB V 50 14.3 21 17 -69 -81 -60 +20.7 +73.6 +37.5 5 Typical 250 450 860 14.2 13.9 12.9 28 18 11 18 16 18 -67 -67 -87 -80 -61 -60 +20.5 +20.3 +22 +76.1 +76.4 +76.6 +37.5 +37.3 +39.2 5 5.3 5.9 +5.25 V @ 165 mA 1. Test conditions unless otherwise noted: T = 25ºC, 800 MHz on each individual single-branch amplifier in a 50 test fixture using a +7V supply and a 20.5 dropping resistor. 2. 3OIP measured with two tones at an output power of +5 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Typical parameters reflect performance in a push-pull application circuit. 4. Balun, board, and connector losses have not been extracted, but typically account of 0.4 dB loss midband and 1.1 dB loss at 860 MHz. 5. Measured at +34 dBmV/channel, 79 channels Flat Loading. 6. OIP2 is measured at f1 + f2 at 5 dBm / tone. ¡ Absolute Maximum Rating Operating Case Temperature Storage Temperature Supply Voltage RF Input Power (continuous) Junction Temperature Parameter -40 to +85 qC -55 to +125 qC +7 V +13dBm +250 qC Rating Ordering Information Part No. AG606* AG606-G AG606-PCB * Push-pull Dual Amplifier (lead-tin SOIC8 Pkg) (lead-free/green/RoHS-compliant SOIC8 Pkg) Description Push-pull CATV Amplifier Fully Assembled CATV Evaluation Board Operation of this device above any of these parameters may cause permanent damage. This package is being phased out in favor of the green package type which is backwards compatible for existing designs. Specifications and information are subject to change without notice.         WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com W eb site: www.wj.com Page 1 of 6 July 2005 AG606 The Communications Edge TM Product Information Push-Pull CATV Amplifier Typical Device Data  50: Z0 S-Parameters (Vdev = +5.25 V, Icc = 82.5 mA, T = 25 C, unmatched 50 ohm system, calibrated to device leads) These represent a single-ended amplifier in the AG606, with there being two matched amplifiers inside the package. Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 50 -12.03 178.56 14.61 177.32 -18.85 -0.01 -17.45 178.57 100 -12.09 174.32 14.61 175.28 -18.74 -1.56 -17.08 178.23 150 -11.81 172.20 14.62 173.13 -18.76 -2.21 -17.28 176.63 200 -11.81 169.91 14.59 170.74 -18.81 -3.25 -16.86 176.45 250 -11.64 168.30 14.62 168.67 -18.77 -3.74 -17.24 173.88 300 -11.79 166.47 14.63 165.71 -18.81 -4.12 -17.00 174.14 350 -11.76 164.70 14.68 163.24 -18.79 -4.96 -17.20 172.40 400 -12.02 162.35 14.59 161.23 -18.84 -5.99 -16.85 173.24 450 -11.92 159.27 14.48 158.25 -18.82 -5.99 -17.02 170.87 500 -11.92 156.13 14.53 156.14 -18.80 -6.63 -16.70 169.98 550 -11.77 154.71 14.48 154.05 -18.86 -7.58 -16.78 167.35 600 -11.75 151.64 14.52 151.45 -18.79 -8.02 -16.47 167.79 650 -11.67 150.04 14.45 148.59 -18.74 -9.17 -16.49 164.94 700 -11.89 147.47 14.41 146.59 -18.83 -9.41 -16.48 164.76 750 -11.72 145.07 14.43 144.30 -18.89 -10.48 -16.43 161.86 800 -11.76 143.08 14.33 141.92 -18.87 -11.22 -16.23 161.91 850 -11.56 141.20 14.36 139.40 -18.87 -11.88 -15.86 158.92 900 -11.65 138.97 14.26 137.14 -18.80 -12.23 -15.78 159.88 950 -11.57 137.28 14.28 134.86 -18.79 -13.52 -15.51 156.89 1000 -11.56 135.12 14.19 132.17 -18.86 -13.15 -15.34 156.79 ¢ ¢ Typical Device Data  37.5: Z0 S-Parameters (Vdev = +5.25 V, Icc = 82.5 mA, T = 25 C, unmatched 37.5 ohm system, calibrated to device leads) These represent a single-ended amplifier in the AG606, with there being two matched amplifiers inside the package. Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 50 -34.66 173.49 14.79 177.27 -18.66 -0.06 -19.98 -0.57 100 -33.64 133.95 14.81 175.12 -18.54 -1.71 -20.40 -3.63 150 -30.17 137.29 14.82 172.89 -18.56 -2.45 -20.15 -4.04 200 -29.21 131.02 14.80 170.45 -18.60 -3.54 -20.91 -7.28 250 -27.90 131.37 14.83 168.30 -18.57 -4.11 -20.34 -5.91 300 -28.12 124.34 14.84 165.33 -18.61 -4.51 -20.82 -9.61 350 -27.59 122.31 14.88 162.80 -18.59 -5.40 -20.57 -10.25 400 -27.52 110.86 14.79 160.77 -18.65 -6.45 -21.33 -14.80 450 -25.69 107.75 14.68 157.66 -18.62 -6.58 -21.31 -13.74 500 -24.49 101.63 14.73 155.45 -18.61 -7.32 -21.94 -15.66 550 -23.76 104.95 14.68 153.27 -18.66 -8.35 -22.13 -13.89 600 -22.84 100.16 14.72 150.61 -18.59 -8.86 -22.79 -18.83 650 -22.46 101.72 14.65 147.66 -18.53 -10.10 -23.13 -17.61 700 -22.06 95.00 14.60 145.62 -18.64 -10.38 -23.54 -19.44 750 -21.15 95.84 14.62 143.20 -18.70 -11.58 -24.06 -16.74 800 -20.79 94.07 14.53 140.77 -18.68 -12.37 -25.05 -20.60 850 -20.09 95.55 14.56 138.11 -18.67 -13.17 -26.61 -16.06 900 -19.78 92.24 14.45 135.83 -18.60 -13.53 -27.43 -23.50 950 -19.42 92.70 14.48 133.44 -18.59 -14.94 -29.28 -17.34 1000 -18.88 90.91 14.39 130.68 -18.66 -14.64 -31.32 -18.82 Specifications and information are subject to change without notice.         WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com W eb site: www.wj.com Page 2 of 6 July 2005 AG606 The Communications Edge TM Product Information Push-Pull CATV Amplifier Application Circuit PC Board Layout Circuit Board Material: .028” FR4, 4 - layer, 1 oz copper, Microstrip line details: width = .021”, spacing = .021”. C1, C2, R3, C3, R4 and C4 are shown in the silkscreen but are not required in the schematic. Typical RF Performance at 25qC Frequency Gain(1) Input R.L. Output R.L. CTB(2) CSO(2) XMOD(2) Output P1dB Output IP2(3) Output IP3(4) Noise Figure(1) Device Current Device Voltage MHz dB dB dB dBc dBc dBc dBm dBm dBm dB mA V 50 250 450 860 14.3 14.2 13.9 12.9 21 28 18 11 17 18 16 18 -69 -67 -67 -81 -87 -80 -60 -61 -60 +20.7 +20.5 +20.3 +22 +73.6 +76.1 +76.4 +76.6 +37.5 +37.5 +37.3 +39.2 5 5 5.3 5.9 165 +5.25 T1: M/A Com ETC1 -1 -13 T2: M/A Com ETC1 -1 -13 5. All components are 0603 in size unless otherwise noted. 6. 1% tolerance is for R1 and R2. 7. The dc resistance of L1 and L2 should be less than 1 ohm. 1. Balun, board, and connector losses have not been extracted, but typically account for 0.4 dB loss midband and 1.1 dB loss at 860 MHz. 2. CSO, CTB, & XMOD are measured at +34 dBmV/channel, 79 channels Flat Loading. 3. OIP2 is measured at f1 + f2 at 5 dBm / tone. 4. OIP3 is measured at 5 dBm / tone with 1 MHz spacing. Recommended Bias Resistor Values Supply Voltage 7V 8V 9V 10 V 12 V 24 V R1/R2 Value 20.5 ohms 32.5 ohms 44.5 ohms 56.5 ohms 81 ohms 227 ohms Size 1206 1210 2010 2010 2010 2 Watts 75 : Push-Pull Application Circuit Performance (Vsupply = +7 V, Rbias= 20.5 :, 25q C) S11 vs. Frequency 0 -10 S22 (dB) 16 14 S21 vs. Frequency S22 vs. Frequency 0 -10 -20 -30 -40 S11 (dB) S21 (dB) 12 10 8 6 0 200 400 600 800 1000 Frequency (MHz) +25°C -40°C +85°C -20 -30 -40 0 200 400 600 800 1000 Frequency (MHz) +25°C -40°C +85°C +25°C -40°C +85°C 0 200 400 600 800 1000 Frequency (MHz) Specifications and information are subject to change without notice.         WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com W eb site: www.wj.com Page 3 of 6 July 2005 AG606 P1dB vs. Frequency 24 22 P1dB (dBm) The Communications Edge TM Product Information Push-Pull CATV Amplifier (Vsupply=7V, Rbias= 20.5 :, 25q C) Noise Figure vs. Frequency (Application Board) 75 : Push-Pull Application Circuit Performance (Cont’d) Noise Figure vs. Frequency at 25°C (Device) 7 6 NF (dB) 7 6 NF (dB) 20 18 16 14 0 200 400 600 800 1000 Frequency (MHz) +25°C -40°C +85°C 5 4 3 2 0 200 400 600 800 1000 Frequency (MHz) +25°C -40°C +85°C 5 4 3 2 0 200 400 600 800 1000 Frequency (MHz) 40 38 OIP3 (dBm) OIP3 vs. Frequency 1 MHz Spacing, +5dBm / Tone 85 80 OIP2 (dBm) OIP2 vs. Frequency 1 MHz Spacing, +5 dBm / Tone XMOD,CTB and CSO (dBc) XMOD, CTB and CSO vs. Frequency @ 34 dBmV at 25°C -50 -60 -70 -80 -90 XMOD CTB CSO 0 100 200 300 400 500 600 36 34 32 30 0 200 400 600 800 1000 Frequency (MHz) +25°C -40°C +85°C 75 70 65 60 0 200 400 600 800 1000 Frequency (MHz) +25°C -40°C +85°C -100 Frequency (MHz) CSO vs. Frequency 79 Channel Flat Loading, 34 dBmV -50 CTB (dBc) -50 -60 CTB vs. Frequency 79 Channel Flat Loading, 34 dBmV -50 -60 XMOD (dBc) XMOD vs. Frequency 79 Channel Flat Loading, 34 dBmV -60 CSO (dBc) -40°C +25°C +85°C -70 -80 -90 -100 0 100 200 -70 -80 -90 -100 -40°C +25°C +85°C -70 -80 -90 -100 -40°C +25°C +85°C 300 400 500 600 0 100 200 300 400 500 600 0 100 200 300 400 500 600 Frequency (MHz) Frequency (MHz) Frequency (MHz) -50 -60 CSO (dBc) CSO vs. Frequency 79 Channel Flat Loading at 25°C 30 dBmV 34 dBmV 38 dBmV 32 dBmV CTB (dBc) -50 -60 -70 -80 -90 CTB vs. Frequency 79 Channel Flat Loading at 25°C -50 -60 XMOD (dBc) XMOD vs. Frequency 79 Channel Flat Loading at 25°C 36 dBmV -70 -80 -90 -100 0 100 -70 -80 -90 -100 30 dBmV 34 dBmV 38 dBmV 0 100 200 300 32 dBmV 36 dBmV 200 300 400 500 600 -100 0 100 30 dBmV 34 dBmV 38 dBmV 200 300 32 dBmv 36 dBmV 400 500 600 400 500 600 Frequency (MHz) Frequency (MHz) Frequency (MHz) Specifications and information are subject to change without notice. £ £ £ £ WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com W eb site: www.wj.com Page 4 of 6 July 2005 AG606 The Communications Edge TM Product Information Push-Pull CATV Amplifier This package may contain lead-bearing materials. The plating material on the leads is SnPb. AG606 (SOIC-8 Package) Mechanical Information Outline Drawing Product Marking The component will be marked with an “AG606” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Value: Test: Standard: Class 1C 1000 to 2000 V Human Body Model (HBM) JEDEC Standard JESD22-A114 ESD Rating: Class IV Value 1000 V Test: Charge Device Model (CDM) Standard: JEDEC Standard JESD22-C101 MSL Rating: Level 1 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 ¥ ¦ Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135” ) diameter drill and have a final plated thru diameter of .25 mm (.010” ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. MTTF vs. GND Tab Temperature 10000 MTTF (Million Hrs) Land Pattern Thermal Specifications Parameter Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85q C 63q C/W 142q C Rating 1000 100 10 1 50 60 70 80 90 100 Tab Temperature (°C) Notes: 1. The thermal resistance is referenced from the hottest part of the junction to ground tab. 2. This corresponds to the typical biasing condition of +5.16V, 175 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 177 C. ¥ ¥ Specifications and information are subject to change without notice. ¤ ¤ ¤ ¤ WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com W eb site: www.wj.com Page 5 of 6 July 2005 AG606 The Communications Edge TM Product Information Push-Pull CATV Amplifier This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260qC reflow temperature) and lead (maximum 245qC reflow temperature) soldering processes. AG606-G (Lead-Free Package) Mechanical Information Outline Drawing Product Marking The component will be marked with an “ AG606G” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “ Application Notes” section. ESD / MSL Information ESD Rating: Value: Test: Standard: ESD Rating: Value Test: Standard: Class 1C 1000 to 2000 V Human Body Model (HBM) JEDEC Standard JESD22-A114 Class IV Passes greater than 1000 V Charge Device Model (CDM) JEDEC Standard JESD22-C101 ¥ MSL Rating: Level 2 at +260 C convection reflow Standard: JEDEC Standard J-STD-020A Mounting Config. Notes 1. 2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80/.0135” ) diameter drill and have a final plated through diameter of .25mm (.010” ) Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. To ensure reliable operation, device ground paddle-toground pad solder joint is critical. Add mounting screws near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. For optimal thermal performance, expose soldermask on backside where it contacts the heatsink. RF trace width depends upon the PC board material and construction. Use 1 oz. Copper minimum. If the PCB design rules allow, ground vias should be placed under the land pattern for better RF and thermal performance. Otherwise ground vias should be placed as close to the land pattern as possible. All dimensions are in mm. Angles are in degrees. Land Pattern 3. 4. 5. 6. 7. 8. 9. Thermal Specifications Parameter Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) MTTF vs. GND Tab Temperature 10000 MTTF (Million Hrs) Rating -40 to +85q C 63q C/W 142q C 1000 100 10 1 50 60 70 80 90 100 Tab Temperature (°C) Notes: 1. The thermal resistance is referenced from the hottest part of the junction to ground tab underneath the device. 2. This corresponds to the typical biasing condition of +5.16V, 175 mA at an 85 C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 177 C. ¥ ¥ Specifications and information are subject to change without notice. ¤ ¤ ¤ ¤ WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com W eb site: www.wj.com Page 6 of 6 July 2005