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AN17850A

AN17850A

  • 厂商:

    ETC1

  • 封装:

  • 描述:

    AN17850A - Silicon Monolithic Bipolar IC - List of Unclassifed Manufacturers

  • 数据手册
  • 价格&库存
AN17850A 数据手册
Prepared Checked Approved Product Specifications Ref No. Total Page Page No. A 17 1 AN17850A Structure Appearance Application Silicon Monolithic Bipolar IC SIL-12 Pins Plastic Package (FP-12S Power Type With Fin) Audio Function 70W (6Ω) x 1ch BTL Power Amplifier Built-in Standby and Muting Features Incorporating Various Protection Circuits A No. 1 2 3 4 5 6 7 8 Item Storage Temperature Absolute Maximum Ratings Symbol Tstg Topr Popr Gopr Sopr Vcc Icc PD Ratings -55 ~ +150 -25 ~ +75 1.013x105 ±0.61x105 Unit °C °C Pa m/s m/s V A W 2 2 Note Operating Ambient Temperature Operating Ambient Pressure Operating Constant Acceleration Operating Shock Power Supply V oltage Power Supply Current Power Dissipation 9,810 4,900 33 8.0 37.5 1 2 Operating Supply V oltage Range Vcc 10 V ~ 32V Note: 1) Without input signal, Vcc is up to 33V 2) Ta = 75°C with infinite heatsink Eff. Date 15-AUG-03 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1 Prepared Checked Approved Product Specifications Ref No. Total Page Page No. B-1 17 2 AN17850A B No. 1 2 3 4 5 6 7 8 9 Electrical Characteristics Item Quiescent Circuit Current Output Noise V oltage V oltage Gain Total Harmonic Distortion Maximum Output Power Output Offset V oltage Ripple Rejection Standby Current Muting Effects (Unless otherwise specified, the ambient temperature is 25°C±2°C, Vcc=30V, frequency=1kHz and RL=6Ω.) Test Symbol Circuit. Icq Vno Gvc THD Po V off RR 1 1 1 1 1 1 1 1 1 Condition No input ; Vstby = 5V Vmute = 5V; No Input, Rg=20kΩ Vstby = 5V;Vmute = 5V Limit Unit Note Min Typ Max - 100 0.54 40 0.07 70 0 55 1 75 300 1 42 0.4 - mA mVrms 1 Vin=20mV; Vstdby=5V Vmute = 5V Vin=20mV; Vstdby=5V Vmute = 5V; THD_OUT=10% Vstdby=5V;Vmute= 5V; 38 - dB % W mV 2 55 -350 45 - Rg=20kΩ; No input Vstdby=5V;Vmute=5V; Vripple=1Vrms * freq=120Hz, Rg=20kΩ No input ; vstdby=0V; Vmute=5V; Vin=20mV; Vstby=5V; Vmute = 0 to 5V** 350 - dB µA dB 1 I STB MT 100 - 65 2 * The measurement is by taking the ratio of output voltage with reference to the Vripple. ** The measurement is by taking the ratio of output (at Vmute = 0 V) to the output(at Vmute = 5V) Note : 1) With a filter band 20Hz ~20kHz (12 dB/OCT) used. 2) With a filter band 400Hz ~30kHz used. Eff. Date 15-AUG-03 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1 Prepared Checked Approved Product Specifications (Reference Data for Design) Ref No. Total Page Page No. B-2 17 3 AN17850A B Electrical Characteristics No Item 1 2 3 Standby on voltage Standby off voltage Mute on voltage (Unless otherwise specified, the ambient temperature is 25°C±2°C, Vcc=30V, frequency=1kHz and RL=6Ω.) Test Symbol Cir- Conditions cuit Vstdon Limits min typ max 4.5 4 1 1 - Unit Note V V V V 1 1 1 1 Vmute = 5V; Vin = 20mV; Istb < 100uA Vmute = 5V; Vin = 20mV; Gvc > 38 dB Vstd0ff Vmon Vmoff VStdby = 5V; Vin = 20mV; MT > 70 dB VStdby = 5V; Vin = 20mV; Gvc > 38 dB 4 Mute off voltage Note) The above characteristics are reference values determined for IC design, but not guaranteed values for shipping inspection. If problems were to occur, counter measures will be sincerely discussed. Eff. Date 15-AUG-03 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1 Prepared Checked Approved Product Specifications Ref No. Total Page Page No. C 17 4 AN17850A (Description of Test Circuits and Test Methods) Test Circuit 1 A SW1 + 2200µ D Vcc=30V Vripp=1Vrms freq=120 Hz 33µF 8.2kΩ 6 4 NC MUTE + 1 NC 12 VCC OUT/+VE 10 SW4 B A +5V 1 NC 5 IN AN17850A OUT/-VE 7 STDBY NC PWRGND 9 RL= 6 Ω AC, DC Voltmeter Distortion Meter Noise Meter A SW2 20k INGND 3 + 10µF 2 51k 8 OPEN Vin SW3 B A +5V No. 1 2 3 4 5 6 7 8 9 Item ICQ Vno Gvc THD PO Voff R.R ISTB MT SW1 OPEN Closed Closed Closed Closed Closed D OPEN Closed SW2 SW3 OPEN A OPEN A A A A OPEN OPEN OPEN A A A A A A B A SW4 A A A A A A A A B/A Note : * STB 'OFF' means 5V . MUTE 'OFF' means 5V . Eff. Date 15-AUG-03 FMSC-PSDA-002-01 REV 1 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. Prepared Checked Approved Product Specifications Ref No. Total Page Page No. D 17 5 AN17850A Circuit Function Block Diagram Protection circuit Thermal Shutdown Load Short VCC Short Ground Short ASO Protection Over Voltage protection REF + + - AN17850A - + MUTE NC STDBY IN GND NC IN MUTE -VE OUT NC PWR GND +VE OUT NC VCC 1 10µF + 2 51kΩ 3 4 5 6 33µF+ 20kΩ 8.2kΩ 7 8 9 10 11 12 2200µ + OFF/5V OFF/5V 6Ω ON/0V ON/0V VCC Pin Descriptions Pin No. 1 2 3 4 5 6 Pin Descriptions NC STDBY IN GND NC IN MUTE Pin No. 7 8 9 10 11 12 Pin Descriptions -VE PHASE OUTPUT NC PWR GND +VE PHASE OUTPUT NC VCC Eff. Date 15-AUG-03 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1 Prepared Checked Approved Product Specifications Ref No. Total Page Page No. E 17 6 AN17850A Package Name Unit : mm FP-12S ∅ 3.6 6.4 ± 0.3 7.7 ± 0.3 12 7.8 ± 0.3 29.96 ± 0.3 28.0 ± 0.3 20.0±0.1 0.6 R1.8 1 1.2 ± 0.1 +0.1 0.25 -0.05 2.54 0.6 ± 0.1 3.5 ± 0.3 Eff. Date 15-AUG-03 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1 29.6 ± 0.3 Name of item Date Code Company insignia Prepared Checked Approved Product Specifications Ref No. Total Page Page No. F 17 7 AN17850A SiN, Fe group, Ag plating, Solder plating, Ag paste, PSG, Cu group, Au plating, Solder dip, Au-Si alloy, (Structure Description) Chip surface passivation Lead frame material Inner lead surface process Outer lead surface process Chip mounting method Wire bonding method Wire material Mold material Molding method Fin material Others ( Others ( Others ( Others ( Solder, Others ( Others ( Others ( Others ( Multiplunger mold, Others ( Others ( ) ) ) ) ) ) ) ) ) ) 1 2, 6 2 6 3 4 4 5 5 7 Thermalsonic bonding, Au Epoxy, Transfer mold, Cu Group Package FP-12S 1 4 3 5 6 7 2 Eff. Date 15-AUG-03 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1 Prepared Checked Approved Product Specifications (Technical Data) Ref No. Total Page Page No. G-1 17 8 AN17850A Application Circuit VCC= 30V NC 4 12 VCC 2200µ IN GND 3 1 NC Output GND NC AN17850A 51kΩ 9 STB 10µF 2 STB Vref MUTE 8 8.2kΩ MUTE 33µF 6 OUT +ve 34dB 10 11 NC IN 20kΩ 5 34dB RL=6Ω 7 OUT -ve STB 'OFF' STB 'ON' Mute 'OFF' Mute 'ON' Eff. Date 15-AUG-03 FMSC-PSDA-002-01 REV 1 5V 0V 5V 0V Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. Eff. Date Prepared Checked Approved Product Specifications (Technical Data) Ref No. Total Page Page No. G-2 17 9 AN17850A (1) Tc = Ta, 62.5W ( θj-c = 2 °C/W ) (2) 20.83W ( θf = 4.0 °C/W ) PD - Ta Curves With a 100cm2 X 3mm Al heat sink (black colour coated) or a 200cm2 X 2mm Al heat sink (not lacquered) (3) 15.63W ( θf = 6.0 °C/W ) With a 100cm X 2mm Al heat sink (not lacquered) (4) 3.0W at Ta = 25°C ( θj-a = 42°C/W ) Without heat sink 2 80 70 62.5W 60 Power Dissipation PD ( W ) (1) 50 40 30 20.8W (2) 15.6W (3) 20 10 3.0W (4) 0 0 25 50 75 100 125 150 Ambient Temperature Ta ( °C ) Eff. Date 15-AUG-03 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1 Prepared Checked Approved Product Specifications (Technical Data) Ref No. Total Page Page No. G-3 17 10 AN17850A Area of Safe Operation 40 VCEmax = 32V ICmax = 8A Ta = 25°C 10 8 t= s 1m IC(A) t= 10 s m s 0m t= 10 1 0.3 1 10 70 VCE (V) Eff. Date 15-AUG-03 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1 Prepared Checked Approved Product Specifications (Technical Data) Ref No. Total Page Page No. G-4 17 11 AN17850A ta td VCC = 30V tb VCC = 0V tc STANDBY OFF STANDBY ON 5V 0V 5V 0V MUTE OFF MUTE ON Description ta tb tc td Wating time required for Standby to turn off after VCC is on. Wating time required for Mute turn off after Standby is off. Wating time required for Standby to turn on after Mute is on Waiting time required for VCC to turn off after Standby is on Minimum 0 500 300 0 Unit ms ms ms ms Eff. Date 15-AUG-03 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1 Prepared Checked Approved Pin No. Product Specifications (Technical Data) Ref No. Total Page Page No. G-5 17 12 DC BIAS (V) AN17850A Internal circuitry Function NC Standby 12 Description 1 2 Standby control pin Determined by external 400 2 Standby “ON” = 0V Standby “OFF” = 5V 100kΩ 100kΩ 10kΩ 3 3 4 5 IN GND NC INPUT 200Ω 5 Input ground 0V 400Ω AC input Terminal 0V 33kΩ 3 8.3kΩ 6 MUTE 12 6 400Ω 10.6kΩ MUTE Control MUTE “OFF” = 5V MUTE ON = 0V Determined by external 30kΩ 2.65kΩ 3 575Ω Eff. Date 15-AUG-03 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1 Prepared Checked Approved Pin No. Product Specifications (Technical Data) Ref No. Total Page Page No. G-5 17 13 DC BIAS (V) AN17850A Internal circuitry 12 Function Output (-) Description Negative output terminal 7 VCC/2 Pre Amp VCC/2 250Ω Driver cct 7 15kΩ 9 10kΩ 3 8 9 NC PWR GND Output Power Ground 12 0V VCC/2 10 Output (+) Pre Amp VCC/2 250Ω 15kΩ 9 Driver cct 10 Positive output terminal 10kΩ 3 11 12 NC VCC Power Supply Pin Typ 30V Eff. Date 15-AUG-03 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1 Prepared Checked Approved Product Specifications (Technical Data) Ref No. Total Page Page No. G-6 17 14 AN17850A TA HEAT SINK Power dissipation and Heat Sink TC CASE TJ DIE Definition of terms θCA θJC FIG1. Simplified Illustration of IC PD: Power Dissipation and Heat Sink attached Tj: Junction Temperature TC: Case Temperature TA: Ambient Temperature θJC: Thermal Resistance of junction to case θCA: Thermal Resistance of case to ambient, normally through heat sink The following two equations represent the relations of these terms. ( Tj - TC ) / θJC = PD (1) ( TC - TA ) / θCA = PD’ (2) For reliable and long-term, continuous operation, junction temperature should not exceed 125OC and θJC for FP-12S package is 2OC/W. Substitute these values in Equation 1. After specify the PD, TC can be determined. Assume no heat loss at the casing,i.e. all power is dissipated to the ambient through heat sink, which is quite true. So PD = PD’. Since TC is also known, one can determine the following using equation2: a) The rating of heat sink for specific maximum operating ambient temperature, or b) The maximum operating ambient temperature for specific heat sink rating. A more general equation can be used for rough calculation. ( TJ - TA ) / θJA = PD θJA = θCA + θJC (3) (4) In this case, θJA is total thermal resistance of the heat sink and IC package. Therefore, for specified power dissipation, either heat sink rating or maximum operating ambient temperature can be decided if the other is known. Take note that it’s essential to know PD value before hand in order to work out other quantities. PD calculation is as shown. PD = Vcc x Icc - Po_total Vcc: DC supply voltage Icc: RMS value of IC current Po_total: Total output power Eff. Date 15-AUG-03 FMSC-PSDA-002-01 REV 1 (5) Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. Prepared Checked Approved Product Specifications (Technical Data) Ref No. Total Page Page No. G-6 17 15 AN17850A Input DC biasing 5 20kΩ Vin Input DC bias is maintained at ground level. If the input signal contains DC bias voltage, AC coupling should be included on the application circuit. The value of 20kΩ resistor is set in order to achieve the minimum output DC offset. FIG2. Input DC Biasing Output Zobel Network It should be noted that this device is designed such that the Zobel network (RC pair) at the output pins is not necessary for stable operation. In practical application, the Zobel network may be applied optionally for two reasons: a) Ensuring stability for different PCB layout and speaker types. b) Ability to withstand to high ESD levels. FIG3. Output Zobel Network 10 7 Eff. Date 15-AUG-03 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1 Prepared Checked Approved Product Specifications (Technical Data) Ref No. Total Page Page No. G-6 17 16 AN17850A Standby operation 51kΩ 5 STB 10µF Standby pin should be connected with carefully selected components in order to avoid “Pop Noise” during Standby ON/OFF transient. The 51k resistor and 10uF capacitor pair can delay the rising of voltage at pin 5 to reach the Standby threshold. When Standby is switching on together with supply, this delay would be very useful to ensure no “Pop Noise”. FIG4. Standby Application circuit If the Standby voltage is provided by a microcontroller, the suppression of “Pop” could even be better. For further details of timing and delay for standby circuit, please refer to page 11. Mute operation Mute pin should be connected with carefully selected components in order to avoid “Pop Noise” during MUTE ON/OFF transient. The 8.2k resistor and 33uF capacitor pair can delay the rising of voltage at pin 6 to reach the Mute threshold. When Mute is switching on together with supply, this delay would be very useful to ensure no “Pop Noise”. 8.2kΩ 6 Mute 33µF FIG5. Mute application circuit For further details of timing and delay for Mute application circuit, please refer to page 11. Eff. Date 15-AUG-03 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1 Prepared Checked Approved Product Specifications Ref No. Total Page Page No. H 17 17 AN17850A (Precaution for use) 1) Ground the radiation fin so that there will be no difference in electric potential between the radiation fin and ground. 2) The thermal protection circuit operates at Tj at approximately 150 C. Thermal protection circuit is reset automatically when the temperature drops. 3) Be sure to attach heatsink to the IC before use. Make sure that the heatsink is secured to the chassis. 4) In order to prevent IC from being damaged during the fault test, prior to standby switching from on to off or vice versa, it is important to assert the mute on. Please refer to the timing diagram on page 11. Eff. Date 15-AUG-03 Eff. Date Eff. Date Eff. Date Semiconductor Company, Matsushita Electric Industrial Co., Ltd. FMSC-PSDA-002-01 REV 1
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