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BUS-61560-890Z

BUS-61560-890Z

  • 厂商:

    ETC1

  • 封装:

  • 描述:

    BUS-61560-890Z - MIL-STD-1553B NOTICE 2 ADVANCED INTEGRATED MUX HYBRIDS WITH ENHANCED RT FEATURES (A...

  • 详情介绍
  • 数据手册
  • 价格&库存
BUS-61560-890Z 数据手册
BUS-61559 SERIES MIL-STD-1553B NOTICE 2 ADVANCED INTEGRATED MUX HYBRIDS WITH ENHANCED RT FEATURES (AIM-HY’er) DESCRIPTION DDC’s BUS-61559 series of Advanced Integrated Mux Hybrids with enhanced RT Features (AIM-HY’er) comprise a complete interface between a microprocessor and a MIL-STD-1553B Notice 2 bus, implementing Bus Controller (BC), Remote Terminal (RX, and Monitor Terminal (MT) modes. Packaged in a single 78-pin DIP or 82-pin flat package the BUS-61559 series contains dual low-power transceivers and encoder/decoders, complete BC/RT/MT protocol logic, memory management and interrupt logic, 8K x 16 of shared static RAM, and a direct, buffered interface to a host processor bus. The BUS-61559 includes a number of advanced features in support of MIL-STD-1553B Notice 2 and STANAG 3838. Other salient features of the BUS-61559 serve to provide the benefits of reduced board space requirements enhanced software flexibility, and reduced host processor overhead buffers to provide a direct interface to a host processor bus. Alternatively, the buffers may be operated in a fully transparent mode in order to interface to up to 64K words of external shared RAM and/or connect directly to a component set supporting the 20 MHz STANAG-3910 bus. The memory management scheme for RT mode prevails an option for separation of broadcast data, in compliance with 1553B Notice 2. A circular buffer option for RT message data blocks offloads the host processor for bulk data transfer applications. Another feature besides those listed to the right, is a transmitter inhibit control for the individual bus channels. FEATURES • Complete Integrated 1553B Notice 2 Interface Terminal • Functlonal Superset of BUS61553 AlM-HYSeries • Internal Address and Data Buffers for Dlrect Interface to Processor Bus • RT Subaddress Circular Buffers to Support Bulk Data Transfers • Optlonal Separatlon of RT Broadcast Data The BUS-61559 series hybrids operate over the full military temperature range of -55 to +125”C and MIL-PRF38534 processing is available. The hybrids are ideal for demanding military and industrial microprocessor-toThe BUS-61559 contains internal 1553 applications address latches and bidirectional data • Internal Interrupt Status and Time Tag Registers • Internal ST Command Illegalization • MIL-PRF-38534 Processing Available (ILLEGALIZATION ILLENA ENABLE) ILLEGALLIZATION LOGIC 8K x 16 DUAL PORT RAM BUS-25679 8 1 7 2 5 4 3 TX_INH_A CLK IN (16MHz) LOW-POWER TRANSCEIVER A DUAL ENCODER/ DECODER BC/RT/MT PROTOCOL LOW-POWER TRANSCEIVER A MEMORY DATA DATA BUFFERS* D15-D∅ (PROCESSOR DATA) BUS-25679 8 1 7 2 5 4 3 TX_INH_A (RT ADDRESS) (BROADCAST ENABLE) (RTFAIL, RTFLAG) (BROADCAST, MESSAGE TIMING, DATA STROBE AND ERROR INDICATORS) MEMORY ADDRESS ADDRESS LATCHES/ BUFFERS* A15-A∅ (PROCESSOR ADDRESS) LATCH CONTROL) ADDR_LAT (ADDRESS RTAD 4-∅, RTADP BRO_ENA RTFAIL RTFLAG BCSTRCV, CMD_STR, TXDTA_STR RXDTA_STR, MSG_ERR, INCMD TRANSPARENT/BUFFERED, MSTCLR, STRBD, SELECT, MEM/REG, RD/WR MEMORY IOEN, READYD MANAGEMENT, INT SHARED MEMEN-OUT,MEMWR, MEMOE RAM/ PROCESSOR MEMENA-IN INTERFACE, SSFLAG INTERRUPT LOGIC TAGCLK (PROCESSOR CONTROL) (INTERRUPT REQUEST) (MEMORY CONTROL) (SUBSYSTEM FLAG) (TIME TAG CLOCK) BU-61559 BLOCK DIAGRAM © 1990, 1999 Data Device Corporation ORDERING INFORMATION BUS-615XX- XX0X* Supplemental Process Requirements: S = Pre-Cap Source Inspection L = Pull Test Q = Pull Test and Pre-Cap Inspection K = One Lot Date Code W = One Lot Date Code and PreCap Source Y = One Lot Date Code and 100% Pull Test Z = One Lot Date Code, PreCap Source and 100% Pull Test Blank = None of the Above Process Requirements: 0 = Standard DDC Processing, no Burn-In (See page xiii.) 1 = MIL-PRF-38534 Compliant 2 = B** 3 = MIL-PRF-38534 Compliant with PIND Testing 4 = MIL-PRF-38534 Compliant with Solder Dip 5 = MIL-PRF-38534 Compliant with PIND Testing and Solder Dip 6 = B** with PIND Testing 7 = B** with Solder Dip 8 = B** with PIND Testing and Solder Dip 9 = Standard DDC Processing with Solder Dip, no Burn-In (See page xiii.) Temperature Grade/Data Requirements: 1 = -55°C to +125°C 2 = -40°C to +85°C 3 = 0°C to +70°C 4 = -55°C to +125°C with Variables Test Data 5 = -40°C to +85°C with Variables Test Data 8 = 0°C to +70°C with Variables Test Data Power Supply and Packaging 59 = +5 V/-15 V DDIP 60 = +5 V/-12 V DIP 69 = +5 V/-15 V Flat Pack 70 = +5 V/-12 V Flat Pack 71 = +5 V Flat Pack *-601 version also available = MIL-STD-1760 compatible with fully compliant MIL-PRF-38534 Processing Available 2 NOTES 3 The information in this data sheet is believed to be accurate; however, no responsibility is assumed by Data Device Corporation for its use, and no license or rights are granted by implication or otherwise in connection therewith. Specifications are subject to change without notice. 105 Wilbur Place, Bohemia, New York 11716-2482 For Technical Support - 1-800-DDC-5757 ext. 7257 or 7381 Headquarters - Tel: (631) 567-5600 ext. 7257 or 7381, Fax: (631) 567-7358 Southeast - Tel: (703) 450-7900, Fax: (703) 450-6610 West Coast - Tel: (714) 895-9777, Fax: (714) 895-4988 Europe - Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264 Asia/Pacific - Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689 World Wide Web - http://www.ddc-web.com ILC DATA DEVICE CORPORATION REGISTERED TO ISO 9001 FILE NO. A5976 K-ABR PRINTED IN THE U.S.A. 4
BUS-61560-890Z
### 物料型号 - BUS-61559系列:这是一系列集成MIL-STD-1553B Notice 2接口终端的高级混合集成电路。

### 器件简介 - 高级集成Mux混合集成电路(AIM-HY’er):BUS-61559系列包含双低功耗收发器和编解码器,完整的BC/RT/MT协议逻辑,内存管理和中断逻辑,8K x 16共享静态RAM,以及直接接口到主机处理器总线。

### 引脚分配 - 78针DIP或82针扁平封装:BUS-61559系列采用78针双列直插封装(DIP)或82针扁平封装。

### 参数特性 - 支持MIL-STD-1553B Notice 2和STANAG 3838:BUS-61559系列支持这些标准,具有先进的功能,如内部地址锁存器和双向数据缓冲器,以提供直接接口到主机处理器总线。

### 功能详解 - 内部地址和数据缓冲器:用于直接接口到处理器总线。 - RT子地址循环缓冲区:支持大数据量传输。 - 可选的RT广播数据分离:符合1553B Notice 2。 - 内部中断状态和时间标记寄存器:提供中断管理。 - 内部ST命令非法化:增强系统安全性。

### 应用信息 - 军事和工业应用:适用于要求严格的军事和工业微处理器到1553接口的应用。

### 封装信息 - 78针DIP或82针扁平封装:提供两种封装选项,适用于不同的应用需求。
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