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BUS-61569-530K

BUS-61569-530K

  • 厂商:

    ETC1

  • 封装:

  • 描述:

    BUS-61569-530K - MIL-STD-1553B NOTICE 2 ADVANCED INTEGRATED MUX HYBRIDS WITH ENHANCED RT FEATURES (A...

  • 详情介绍
  • 数据手册
  • 价格&库存
BUS-61569-530K 数据手册
BUS-61559 SERIES MIL-STD-1553B NOTICE 2 ADVANCED INTEGRATED MUX HYBRIDS WITH ENHANCED RT FEATURES (AIM-HY’er) DESCRIPTION DDC’s BUS-61559 series of Advanced Integrated Mux Hybrids with enhanced RT Features (AIM-HY’er) comprise a complete interface between a microprocessor and a MIL-STD-1553B Notice 2 bus, implementing Bus Controller (BC), Remote Terminal (RX, and Monitor Terminal (MT) modes. Packaged in a single 78-pin DIP or 82-pin flat package the BUS-61559 series contains dual low-power transceivers and encoder/decoders, complete BC/RT/MT protocol logic, memory management and interrupt logic, 8K x 16 of shared static RAM, and a direct, buffered interface to a host processor bus. The BUS-61559 includes a number of advanced features in support of MIL-STD-1553B Notice 2 and STANAG 3838. Other salient features of the BUS-61559 serve to provide the benefits of reduced board space requirements enhanced software flexibility, and reduced host processor overhead buffers to provide a direct interface to a host processor bus. Alternatively, the buffers may be operated in a fully transparent mode in order to interface to up to 64K words of external shared RAM and/or connect directly to a component set supporting the 20 MHz STANAG-3910 bus. The memory management scheme for RT mode prevails an option for separation of broadcast data, in compliance with 1553B Notice 2. A circular buffer option for RT message data blocks offloads the host processor for bulk data transfer applications. Another feature besides those listed to the right, is a transmitter inhibit control for the individual bus channels. FEATURES • Complete Integrated 1553B Notice 2 Interface Terminal • Functlonal Superset of BUS61553 AlM-HYSeries • Internal Address and Data Buffers for Dlrect Interface to Processor Bus • RT Subaddress Circular Buffers to Support Bulk Data Transfers • Optlonal Separatlon of RT Broadcast Data The BUS-61559 series hybrids operate over the full military temperature range of -55 to +125”C and MIL-PRF38534 processing is available. The hybrids are ideal for demanding military and industrial microprocessor-toThe BUS-61559 contains internal 1553 applications address latches and bidirectional data • Internal Interrupt Status and Time Tag Registers • Internal ST Command Illegalization • MIL-PRF-38534 Processing Available (ILLEGALIZATION ILLENA ENABLE) ILLEGALLIZATION LOGIC 8K x 16 DUAL PORT RAM BUS-25679 8 1 7 2 5 4 3 TX_INH_A CLK IN (16MHz) LOW-POWER TRANSCEIVER A DUAL ENCODER/ DECODER BC/RT/MT PROTOCOL LOW-POWER TRANSCEIVER A MEMORY DATA DATA BUFFERS* D15-D∅ (PROCESSOR DATA) BUS-25679 8 1 7 2 5 4 3 TX_INH_A (RT ADDRESS) (BROADCAST ENABLE) (RTFAIL, RTFLAG) (BROADCAST, MESSAGE TIMING, DATA STROBE AND ERROR INDICATORS) MEMORY ADDRESS ADDRESS LATCHES/ BUFFERS* A15-A∅ (PROCESSOR ADDRESS) LATCH CONTROL) ADDR_LAT (ADDRESS RTAD 4-∅, RTADP BRO_ENA RTFAIL RTFLAG BCSTRCV, CMD_STR, TXDTA_STR RXDTA_STR, MSG_ERR, INCMD TRANSPARENT/BUFFERED, MSTCLR, STRBD, SELECT, MEM/REG, RD/WR MEMORY IOEN, READYD MANAGEMENT, INT SHARED MEMEN-OUT,MEMWR, MEMOE RAM/ PROCESSOR MEMENA-IN INTERFACE, SSFLAG INTERRUPT LOGIC TAGCLK (PROCESSOR CONTROL) (INTERRUPT REQUEST) (MEMORY CONTROL) (SUBSYSTEM FLAG) (TIME TAG CLOCK) BU-61559 BLOCK DIAGRAM © 1990, 1999 Data Device Corporation ORDERING INFORMATION BUS-615XX- XX0X* Supplemental Process Requirements: S = Pre-Cap Source Inspection L = Pull Test Q = Pull Test and Pre-Cap Inspection K = One Lot Date Code W = One Lot Date Code and PreCap Source Y = One Lot Date Code and 100% Pull Test Z = One Lot Date Code, PreCap Source and 100% Pull Test Blank = None of the Above Process Requirements: 0 = Standard DDC Processing, no Burn-In (See page xiii.) 1 = MIL-PRF-38534 Compliant 2 = B** 3 = MIL-PRF-38534 Compliant with PIND Testing 4 = MIL-PRF-38534 Compliant with Solder Dip 5 = MIL-PRF-38534 Compliant with PIND Testing and Solder Dip 6 = B** with PIND Testing 7 = B** with Solder Dip 8 = B** with PIND Testing and Solder Dip 9 = Standard DDC Processing with Solder Dip, no Burn-In (See page xiii.) Temperature Grade/Data Requirements: 1 = -55°C to +125°C 2 = -40°C to +85°C 3 = 0°C to +70°C 4 = -55°C to +125°C with Variables Test Data 5 = -40°C to +85°C with Variables Test Data 8 = 0°C to +70°C with Variables Test Data Power Supply and Packaging 59 = +5 V/-15 V DDIP 60 = +5 V/-12 V DIP 69 = +5 V/-15 V Flat Pack 70 = +5 V/-12 V Flat Pack 71 = +5 V Flat Pack *-601 version also available = MIL-STD-1760 compatible with fully compliant MIL-PRF-38534 Processing Available 2 NOTES 3 The information in this data sheet is believed to be accurate; however, no responsibility is assumed by Data Device Corporation for its use, and no license or rights are granted by implication or otherwise in connection therewith. Specifications are subject to change without notice. 105 Wilbur Place, Bohemia, New York 11716-2482 For Technical Support - 1-800-DDC-5757 ext. 7257 or 7381 Headquarters - Tel: (631) 567-5600 ext. 7257 or 7381, Fax: (631) 567-7358 Southeast - Tel: (703) 450-7900, Fax: (703) 450-6610 West Coast - Tel: (714) 895-9777, Fax: (714) 895-4988 Europe - Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264 Asia/Pacific - Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689 World Wide Web - http://www.ddc-web.com ILC DATA DEVICE CORPORATION REGISTERED TO ISO 9001 FILE NO. A5976 K-ABR PRINTED IN THE U.S.A. 4
BUS-61569-530K
1. 物料型号:型号为STM32F103C8T6,是一款基于ARM Cortex-M3内核的32位微控制器,适用于多种嵌入式应用。

2. 器件简介:该器件是意法半导体生产的高性能微控制器,具有多种外设和接口,适用于工业控制、消费电子等领域。

3. 引脚分配:该器件共有48个引脚,包括电源引脚、地引脚、I/O引脚等,具体分配需参考引脚图。

4. 参数特性:工作电压2.0V至3.6V,工作频率72MHz,内置64KB Flash和20KB RAM。

5. 功能详解:包括GPIO、ADC、定时器、通信接口(UART、SPI、I2C)等模块的详细功能描述。

6. 应用信息:适用于需要高性能处理和丰富外设接口的应用场景,如电机控制、工业自动化等。

7. 封装信息:采用LQFP48封装,尺寸7x7mm,适用于表面贴装工艺。
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