Features
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HIGH PERFORMANCE TERMINATION NETWORK Miniaturized circuitry and packaging for space reduction Designed for gigabit communication networks
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Controlled impedance
CAT16-PT4F4 - Concave Chip Array
Electrical Characteristics
Resistance R1 .............................................100 ohms TCR ........................................±200 ppm/˚C Temperature Range .........-55 ˚C to +12 5˚C Max. Operating Voltage ....................5 VDC Max. Power Resistance ................ .0625 W Solderability .....................>95 % Coverage
Product Dimensions
16 15 14 13 12 11 10 9
.30 ± .10 DIA. (.012 ± .004)
.60 ± .10 (.024 ± .004) 1.60 ± .15 (.063 ± .060)
.45 ± .10 (.018 ± .004)
.40 ± .10 (.016 ± .004) .40 ± .10 (.016 ± .004)
.80 ± .10 (.031 ± .004)
6.40 ± .15 (.253 ± .006)
1
DIMENSIONS ARE: MM (INCHES)
2
3
4
5
6
7
8
Packaging Specifications
4000 pcs - per 7 " reel
4.0 ± .10 (.157 ± .004)
0.9 ± 0.1 (.035 ± .004)
2.00 ± 0.20 (.079 ± .008)
2.0 ± .05 (.079 ± .002)
13 ± 0.5 DIA. (.512 ± .020) 60.0 ± 1.0 DIA. (2.36 ± .039) 12.0 ± 0.2 (.472 ± .008) 21 ± 0.5 (.827 ± .020) 15.4 ± 1.0 (.606 ± .039) 13.0 ± 0.3 (.512 ± .012) 178.0 ± 2.0 (7.008 ± .080)
6.9 ± 0.2 (.272 ± .008)
5.5 ± 0.1 (.217 ± .004)
4.0 ±.10 (.158 ±.004)
1.5 +.10/-0 (.060 +.004/-0)
1.75 ± .10 (.069 ± .004)
Derating Curve
Rated power in percentage (%)
Land Pattern
Solder resist
100 80 60 40 20 0 -55 0 70 (°C) Ambient temperature 125
0.7 to 0.9 (.028 to .035)
Land
Chip resistor array CAT
2.0 to 2.2 (.079 to .087)
Schematic
0.4 to 0.45 (.016 to .0178)
0.80 (.032)
16
15
14
13
12
11
10
9
R1
R1
R1
R1
1
2
3
4
5
6
7
8
REV. 07/03 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
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