MULTILAYER CERAMIC CAPACITORS
CC Series
X7R
16V TO 100V
DATA SHEET
Product specification – Aug. 13, 2003 V.06 Supersedes Date of Jun. 19, 2003
2
Surface Mount Multilayer Ceramic Capacitors
CC
SERIES
X7R, 16V to 100V
8
SCOPE T his specification describes Yageo CC X7R series chip capacitors. ORDERING INFORMATION P art number is identified by the series, size, tolerance, packing style, temperature coefficient, rated voltage and capacitance value.
CC × × × × × × X7R × BB × × ×
(1) (2) (3) (4) (5)
CONSTRUCTION
terminations
(1) SIZE – INCH BASED (METRIC)
0402 (1005) 0603 (1608) 0805 (2012) 1206 (3216) 1210 (3225) 1812 (4532)
Fig. 1 Surface mounted multilayer ceramic capacitor construction
electrodes
MLB457
ceramic material
(2) TOLERANCE
J = ±5% K = ±10%
DIMENSION
For dimension see Table 1
(3) PACKING STYLE
R = 7” paper tape K = 7” blister tape P = 13” paper tape F = 13” blister tape C = Bulk case
Fig. 2 Surface mounted multilayer ceramic capacitor dimension
T
W
L2
L4 L1
L3
MBB211
Table 1 TYPE L1 (mm) W (mm) T (mm) L2/L3 (mm) L4 (mm) min. max. min. max. min. CC0402
1. 0±0.05 0.5±0.05 0.45 0.55 0.15 0.30 0.40
CC0603
1.6±0.10 0.73 0.87 0.20 0.60 0.40
CC0805
2.0±0.10 0.50 1.35 0.25 0.75 0.55
CC1206
3.2±0.15 1.6±0.15 0.50 1.35 0.25 0.75 1.40
CC1210
3.2±0.20 2.5±0.20 0.50 1.80 0.25 0.75 1.40
CC1812
4.5±0.20 3.2±0.20 0.50 1.80 0.25 0.75 2.20
(4) RATED VOLTAGE
7 = 16V 8 = 25V 9 = 50V 0 = 100V
0.8±0.07 1.25±0.10
(5) CAPACITANCE VALUE:
First two for significant figures and 3rd for number of zero Letter “R” for decimal point
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Surface Mount Multilayer Ceramic Capacitors
CC
SERIES
X7R, 16V to 100V
8
CAPACITANCE RANGE & THICKNESS FOR 16V & 25V
Table 2 CAPACITANCE (nF) 3.3 4.7 6.8 10 15 22 33 47 68 100 150 220 330 470 680 1,000
1.25±0.1 1.15±0.1 0.85±0.1 0.85±0.1 0.85±0.1 0.5 to 1.0 1.15±0.1 0.8±0.07 0.6±0.1 0.85±0.1 0.5±0.05 0.8±0.07
16V 0402
0603
0805
1206
25V 0402
0.5±0.05
0603
0805
1206
1210
0.6±0.1
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Surface Mount Multilayer Ceramic Capacitors
CC
SERIES
X7R, 16V to 100V
8
CAPACITANCE RANGE & THICKNESS FOR 50V & 100V
Table 3 CAPACITANCE (nF) 0.10 0.15 0.22 0.33 0.47 0.68 1.0 1.5 2.2 3.3 4.7 6.8 10 15 22 33 47 68 100 150 220 330 470 680 1,000
1.2 to 1.75 0.85±0.1 0.5 to 1.0 0.5 to 1.0 0.85±0.1 0.85±0.1 0.8±0.07 0.6±0.1 0.85±0.1 0.6±0.1 0.5±0.05
50V 0402
0603
0805
1206
0.6±0.1
1210
1812
100V 0805
1206
1210
1812
0.85±0.1
1.15±0.1
1.15±0.1
0.9 to 1.3 0.9 to 1.3 0.9 to 1.3 0.9 to 1.3
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Surface Mount Multilayer Ceramic Capacitors
CC
SERIES
X7R, 16V to 100V
8
THICKNESS CLASSES AND PACKING QUANTITY
Table 4 THICKNESS CLASSIFICATION (mm) 0.5±0.05 0.6±0.10 0.8±0.07 0.85±0.10 0.5 to 1.0 0.9 to 1.3 1.15±0.10 1.25±0.10 1.2 to 1.75 8mm TAPE WIDTH / AMOUNT PER REEL Ø180mm, 7” Paper Blister
10,000 4,000 4,000 4,000 ------------------4,000 3,000 3,000 3,000 ---
12mm TAPE WIDTH / AMOUNT PER REEL Ø180mm, 7” Blister 1812
--------2,000 1,500 ----1,000
AMOUNT PER BULK CASE 0402
50,000 -----------------
Ø330mm, 13” Paper Blister
50,000 20,000 15,000 15,000 ------------------10,000 10,000 10,000 10,000 ---
0603
----15,000 -------------
0805
--10,000 --8,000 ------5,000 ---
ELECTRICAL CHARACTERISTICS
Table 5 CHARACTERISTICS Operation temperature range Temperature characteristic/coefficient (TC) Capacitance tolerance Dissipation factor (Tan d) Insulation resistance (IR) Dielectric withstanding Voltage TEST CONDITIONS
--With respect to 20°C within operation temperature range 1Vrms/1KHz at 20°C 1Vrms/1KHz at 20°C At Ur (rated voltage) for 1 minute At 2.5×Ur (for Ur≤100V) 1.5×Ur+100V for 5sec
REQUIREMENT
–55°C to +125°C ±15% ±5%, ±10% 25V, 50V &100V; ≤2.5% 16V; ≤3.5% C≤10nF; Rins ≥10GΩ C>10nF; Rins x C≥500s No breakdown
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Surface Mount Multilayer Ceramic Capacitors
CC
SERIES
X7R, 16V to 100V
8
TAPING REEL
Table 6 TAPE WIDE ØA (mm) ØB (mm) ØD (mm) ØC (mm) W (mm) Tmax (mm) 8mm
180 62±1.5 20.5 12.75±0.15/–0 8.4+1.5/–0 14.4
8mm
330 62±1.5 20.5 12.75±0.15/–0 8.4+1.5/–0 14.4
12mm
180 62±1.5 20.5 12.75±0.15/–0 12.4+2/–0 18.4
handbook, full pagewidth
T
D
C
B
A
W
MSA284_b
Fig. 3 Reel dimension
For dimension see Table 6
PAPER TAPE SPECIFICATION
Table 7 DIMENSION A (mm) B (mm) W (mm) E (mm) F (mm) P0 (mm) P1 (mm) P2 (mm) ØD0 (mm) T (mm) 0402
0.62±0.05 1.12±0.05 8.0±0.2 1.75±0.1 3.5±0.05 4±0.05 2±0.05 2±0.05 1.5+0.1 0.6±0.05
For dimension see Table 7
0603
1.10±0.05 1.90±0.05 8.0±0.2 1.75±0.1 3.5±0.05 4±0.05 4±0.1 2±0.05 0.95±0.05
0805
1.65±0.05 2.4±0.05 8.0±0.2 1.75±0.1 3.5±0.05 4±0.05 4±0.1 2±0.05 0.95±0.05
1206
2.0±0.1 3.5±0.1 8.0±0.2 1.75±0.1 3.5±0.05 4±0.05 4±0.1 2±0.05 1.5+0.1/–0 0.95±0.05
A cover tape T D0 P2
P0
E
F B
W
MBG251_a
P1
Fig. 4 Paper tape dimension
1.5+0.1 1.5+0.1/–0
BLISTER TAPE SPECIFICATION
Table 8 DIMENSION A (mm) B (mm) W (mm) E (mm) F (mm) P0 (mm) P1 (mm) P2 (mm) ØD0 (mm) Tmax (mm) 0805
0.20 0.20 8.1±0.2 1.75±0.1 3.5±0.05 4±0.1 4±0.1 2±0.05 3.5
1206
0.30 0.30 8.1±0.2 1.75±0.1 3.5±0.05 4±0.1 4±0.1 2±0.05 3.5
1210
0.30 0.30 8.1±0.2 1.75±0.1 3.5±0.05 4±0.1 4±0.1 2±0.05 3.5
1812
0.40 0.40 12.0±0.2 1.75±0.1 5.5±0.05 4±0.1 8±0.1 2±0.05 1.5+0.1/–0 3.5
For dimension see Table 8
P0 D0 P2 E
cover tape B
F
W
MBG516_a
A T P1 direction of unreeling
D1
1.5+0.1/–0 1.5+0.1/–0 1.5+0.1/–0
Fig. 5 Leader/trailer tape dimension
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Surface Mount Multilayer Ceramic Capacitors
CC
SERIES
X7R, 16V to 100V
8
PACKING METHOD LEADER/TRAILER TAPE SPECIFICATION
leader end
cover tape only
trailer end
empty compartments with cover tape
120
40 mm
trailer (max. 260 mm)
leader
400 mm
MEA529 - 2
Fig. 6 Leader and trailer tape dimension
METHOD OF MOUNTING For normal use the capacitors may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering, reflow soldering (including vapor phase soldering) or conductive adhesive in accordance with CECC 00802 classification A.
Typical values (sold line) Process limits (dotted lines)
300 10 s 260 ¡C 245 ¡C 215 ¡C 200 180 ¡C 40 s 10 s
MLA859
T
(¡C) 250
150
130 ¡C
100 2 K/s 50
0 0 50 100 150 200 t (s) 250
Fig. 7 Recommended reflow soldering profile
Typical values (sold line) Process limits (dotted lines) The capacitors may be soldered twice in accordance with this method if desired
300 10 s
MLA861
T
(¡C) 250 235 ¡C to 260 ¡C second wave
200
first wave
5 K/s 2 K/s
150
200 K/s
100 ¡C to 130 ¡C 100
forced cooling
50
2 K/s
0 0 50 100 150 200 t (s) 250
Fig. 8 Recommended wave soldering profile
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Surface Mount Multilayer Ceramic Capacitors
CC
SERIES
X7R, 16V to 100V
8
TEST AND REQUIREMENT
Table 9 IEC384-10 4.9 4.10 4.11 4.12 TEST ITEMS
Bending Resistance to soldering heat Solderability Rapid change of temperature
CONDITIONS
Bending rate 1mm/s, jig. radius 340mm 260±5°C for 10±0.5s in static solder bath 235±5°C for 2±0.5s in a static solder bath Preconditioning –55°C to +125°C, 5cycles Preconditioning
REQUIREMENTS
∆C/C≤10% –5%≤∆C/C≤10% 75% minimum coverage of metallic area ∆C/C within 15% ∆C/C within 15% Tan δ≤7% IR≥500MΩ or RxC≥25s whichever is less ∆C/C within 20% Tan δ≤7% IR≥1,000MΩ or RxC≥50s whichever is less ∆
4.14
Damp heat
At 40°C, 90 to 95% RH and Ur applied (max. 500V) for 500 hours Preconditioning
4.15
Endurance
2xUr applied for 1,000 hours, at upper category temperature
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