CXA2674EM

Optical Pickup Chipset with Photodetector PDIC for Blue-Violet Laser Diodes CXA2674EM CXA2673EM The age of the blue-violet laser diode has arrived making even higher recording densities possible. Sony has now developed a new photodiode semiconductor wafer process and a new package for photodetector IC for use with blue-violet laser diodes. This article introduces a chipset for use with blueviolet laser diodes; a chipset that concentrates the industry’s leading technologies in a unified system. CXA2674EM RF/Servo PDIC for blue-violet laser diodes I Includes a high-sensitivity photodiode (0.3 A/W at 405 nm) I Low-noise amplifier I Standby mode function I Cavity mold glass sealed small package CXA2673EM Laser front monitor PDIC for blue-violet laser diodes I Two-channel structure (Vin1, Vin2) I Standby mode function I Cavity mold glass sealed small package CXA2674EM The CXA2674EM is a photodetector IC (PDIC) that detects both RF and servo signals and mounted in a record/playback optical pickup that supports the blue-violet laser diode used for Blu-ray and other optical discs. This device is fabricated in a leading-edge process that improves the optoelectronic conversion characteristics in the blue-violet wavelength range to almost the theoretical limits. It also achieves a high signal-to-noise ratio by including a low-noise amplifier. This device features a standby mode function that allows power consumption to be minimized when the device is not being operated. (Operating mode: 30 mA, standby mode: 2 mA) This product is provided in a newly-developed package that is appropriate for photodetection in the wavelength range of the blue-violet laser. Newly-Developed Package for Blue-Violet Laser Diodes Sony has developed a new cavity mold glass sealed package for blue-violet laser diodes. Conventional transparent plastic packages have low transparency in the wavelength range of the blue-violet laser diode, and furthermore, it has been shown that long-term exposure to blue-violet laser diode light degrades plastic package material. Therefore, Sony developed this new package that mounts the silicon chips in a molded cavity area and seals them in that area with glass that has antireflection coating on both sides, thus resolving both these problems. CXA2673EM The CXA2673EM is a photodetector IC (PDIC) developed for use as a laser power monitor and mounted in a record/playback optical pickup that uses the blue-violet laser diode used for Blu-ray and other optical discs. This device adopts the same leading-edge process used for the CXA2674EM and the same package. It provides excellent performance as a front monitor for blue-violet laser diodes. V O I C E No rose without a thorn. While the blue laser diode was a miraculous development, and it is an extremely attractive device, it was not easy to develop a PDIC that could receive that light. Revising the fabrication process was, of course, necessary, and we even developed a new package in creating this new product! This is a very friendly product and can be used by almost anyone. It’s good to be able to relax again now that this project is done. 8 GND EHo 1 Vcc 18 17 Vout 900 Ω 18 2 3 4 200 Ω Vc 17 16 ×1 15 14 13 ×1 12 11 10 16 SLEEP 15 SW Ao Bo Co Do 5 200 Ω 14 Vin1 13 Vin2 1.75 kΩ PD Eo Ho Fo Go 6 7 GND 12 ×1 ×1 8 9 11 IV_OUT 1 Vcc 2 SLEEP 3 Bo 4 Ho 5 Vc 6 Go 7 Co 8 FGo 9 GND 10 I Figure 1 CXA2673EM Block Diagram I Figure 2 CXA2674EM Block Diagram 0.160 0.160 0.030 φ0.7 mm 0.005 B A 0.130 C Photosensitive area position: At the package center 0.005 0.130 D 0.005 0.130 0.130 0.005 Unit: mm I Figure 3 CXA2673EM Acceptance Pattern Dimensions I Figure 4 CXA2674EM Acceptance Pattern Dimensions 0.240 G H E F +0.09 0.14 –0.03 +0.09 0.25 –0.03 5.0V 1 Vcc GND 18 0.05 M SAB 2 SLEEP 0.05 M SAB EHo 17 1.0 ±0.1 5.8 5.2 18 10 1.1 ±0.1 0.8 A 0.4 10 18 3 Bo Ao 16 (0.18) φ0.2 3.3 0.4 ±0.05 0.5 ±0.05 4 Ho CB DA Eo 15 4.4 5.0 φ0.5 PIN 1 INDEX 9 0.5 1 (0.23) +0.09 0.35 –0.03 +0.09 0.24 –0.03 0.02 MAX 2.1V 5 Vref G H Fo 14 B ×4 0.05 S A B 0.1 ±0.1 1 9 PIN 1 INDEX 6 Go 0.05 M 0.05 M SAB F E Do 13 7 Co SW 12 SAB 8 FGo S RF– 11 S Gold plating 9 GND RF+ 10 0.05 S Unit: mm Terminal section * Load conditions: 1 kΩ//10 pF The photosensitive area position is at the package center. I Figure 6 CXA2673/74EM Package Dimensions I Figure 5 CXA2674EM Pin Configuration Ao Bo Co Do RF+ RF– SW 5.4 kΩ Do Ao Eo Fo 9