MULTIWATT

® Thermal Data MULTIWATT Family 8,11,15 leads (JEDEC MO-048 ) 8 leads 11 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 3.9 W/cm°C 3.9 W/cm°C 15 leads leadframe slug copper high thermal conductivity Cu soft solder ( tin / lead ) epoxy resin 0.5 mm 1.5 mm die attach 15-50 µm 0.2 W/cm°C molding compound 3 mm 0.0063W/cm°C Typical assembly configuration before molding : Charts enclosed : 1) Rth(j-c) vs. die size and dissipating area 2) Rth(j-a) vs on board heat sink area 3) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data Rth(j-c) (ºC/W) MULTIWATT Family Tcase = 150 ºC 5 4 diss. area silicon 3 1) 2 die thickness = 375 µm solder thickness = 25 µm 1 0 1 Rth(j-a) (ºC/W) 50 2 3 4 5 6 Dissipating area on die ( mm ) die size = 20.000 sq.mils dissipating area = 2000 sq.mils 40 floating in air mounted on PC board 30 2) 20 mounted on TH17023 heat sink 10 0 0 1 2 3 Dissipated Power ( Watt ) 4 5 Transient Thermal Resistance (ºC/W) 100 SINGLE PULSE 30 10 Pd = 2 Watt, mounted on board die size = 35.000 sq.mils dissipating area = 2.000 sq.mils 3 3) 1 0.3 Pd = 2 Watt, mounted on board die size = 175x195 sq.mils dissipating area =16.000 sq.mils 0.1 0.03 0.001 0.01 0.1 1 Time or pulse width ( s ) 10 100 1,000 2/2 