RFP-250250-4AA3

Model RFP-250250-4AAXX Surface Mount Attenuators 8 Watts Surface Mount Attenuators General Specifications Resistive Element: Substrate: Terminals: Thick film Beryllium oxide ceramic Thick film silver Electrical Specifications Features • DC - 2.5 GHz • 8 Watts • BeO Ceramic • Non-Nichrome Resistive Element • Low VSWR • 100% Tested Attenuation Value: Frequency Range: Power: 1, 2, 3, 4, 5, 6, 9, 10, 20 or 30 dB DC - 2.5 GHz 8 Watts Notes: Tolerance is ±.010, unless otherwise specified. Operating temperature is -55°C to +150°C (see chart). Designed to meet or exceed applicable portions of MIL-E-5400. All dimensions are in inches. Specifications subject to change without notice. Outline Drawing TOP VIEW SIDE VIEW .040 BOTTOM VIEW .250 .230 RFP AA XXdB HATCHED AREA INDICATES LOCATION OF PROTECTIVE COATING .060 .170 .115 .250 .055 Note: XX denotes attenuation value. .085 .165 VER. 12/5/01 Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369 1 Model RFP-250250-4AAXX % OF RATED POWER Surface Mount Attenuators 2 Specifications PART NUMBER ATTENUATION (dB)TOL. (+/-dB) WIDTH LENGTH THK POWER (WATTS) VSWR FREQ.(GHz) RFP-250250-4AA1 RFP-250250-4AA2 RFP-250250-4AA3 RFP-250250-4AA4 RFP-250250-4AA5 RFP-250250-4AA6 RFP-250250-4AA9 RFP-250250-4AA10 RFP-250250-4AA20 RFP-250250-4AA30 1 2 3 4 5 6 9 10 20 30 0.30 0.40 0.40 0.40 0.40 0.40 0.40 0.40 0.75 1.50 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 8 8 8 8 8 8 8 8 8 8 1.20:1 1.20:1 1.20:1 1.20:1 1.25:1 1.30:1 1.30:1 1.30:1 1.25:1 1.20:1 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.0 Power Derating Suggested Mounting Procedures SOLDER PASTE 100 75 50 25 0 25 50 75 100 125 150 SOLDER PASTE SCREW (2 PLS.) SOLDER FILLED VIA PC BOARD HEATSINK 1. Solder part in place using 60/40 type solder with controlled temperature iron (700°F). P.C.B. SOLDER INTERFACE TEMPERATURE — °C 2. Drill thermal vias through PCB and fill with solder, such as 60/40 type. 3. To ensure good thermal connectivity to heat sink, drill and tap heatsink and mount PCB board to heat sink using screws. Available on Tape and Reel for Pick and Place Manufacturing. Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121 Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369