TM8706

TM8706 tenx technology GENERAL DESCRIPTION The TM8706 is an embedded high-performance 4-bit microcomputer with LCD/LED driver. It contains all the necessary functions, such as 4-bit parallel processing ALU, ROM, RAM, I/O ports, timer, clock generator, dual clock operation, Resistance to Frequency Converter(RFC), EL panel driver, LCD driver, look-up table, watchdog timer and key matrix scanning circuitry in a signal chip. FEATURE 1. Low power dissipation. 2. Powerful instruction set (178 instructions). Binary addition, subtraction, BCD adjust, logical operation in direct and index addressing mode. Single-bit manipulation (set, reset, decision for branch). Various conditional branch. 16 working registers and manipulation. Table look-up. LCD driver data transfer. 3. Memory capacity. ROM capacity RAM capacity 4096 512 x 16 bits. x 4 bits. 4 Bit Microcontroller 4. LCD driver output. 9 common outputs and 41 segment outputs (up to drive 369 LCD segments). 1/2 Duty, 1/3 Duty, 1/4 Duty, 1/5 Duty, 1/6Duty, 1/7Duty, 1/8Duty or 1/9Duty is selected by MASK option. 1/2 Bias, 1/3 Bias or 1/4 Bias is selected by MASK option. Single instruction to turn off all segments. COM5~9,SEG1~41 could be defined as CMOS or P_open drain type output by mask option. 5. Input/output ports. Port IOA 4 pins (with internal pull-low), muxed with SEG24~SEG27. Port IOB 4 pins (with internal pull-low). muxed with SEG28~SEG31 Port IOC 4 pins (with internal pull-low, low-level-hold), muxed with SEG32 ~ SEG35. IOC port had built in the input signal chattering prevention circuitry. Port IOD 4 pins (with internal pull-low), muxed with SEG36 ~ SEG39. IOD port had built in the input signal chattering prevention circuitry. 6. 8 level subroutine nesting. 7. Interrupt function. External factors 4 (INT pin, Port IOC, IOD & KI input). tenx technology, inc. Rev 2.4 03/12/01 TM8706 Internal factors 4 (Pre-Divider, Timer1, Timer2 & RFC). 8. Built-in EL-light driver. ELC, ELP (Muxed with SEG28, SEG29). 9. Built in Alarm, clock or single tone melody generator. BZB, BZ (Muxed with SEG30, SEG31). 10. Built-in resistance to frequency converter. CX, RR, RT, RH (Muxed with SEG24 ~ SEG27). 11. Built in key matrix scanning function. K1~K16 (Shared with SEG1~SEG16). KI1~KI4 (Muxed with SEG32 ~ SEG35). 12. Two 6-bit programmable timer with programmable clock source. 13. Watch dog timer. 14. Built-in Voltage doubler, halver, tripler, quartic charge pump circuit. 15. Dual clock operation slow clock oscillation can be defined as X’tal or external RC type oscillator by mask option. fast clock oscillation can be defined as 3.58MHz ceramic resonator, internal R or external R type oscillator by mask option. 16. HALT function. 17. STOP function. APPLICATION Timer / Calendar / Calculator / Thermometer BLOCK DIAGRAM 2 tenx technology, inc. Rev 2.4 03/12/01 TM8706 B1-4 ELC, ELP BZB,BZ B-PORT EL DRIVER ALARM A1-4 CX RR,RT,RH C1-4 KI1~4 D1-4 COM1-9 SEG1-41 VDD1-4 A-PORT RFC C-PORT KEY-IN LCD DRIVER D-PORT SEGMENT PLA 4 BITS DATA BUS FREQUENCY GENERATOR INDEX ROM 256(16-N) X 8 BITS DATA RAM 512 X 4 BITS ALU PREDIVIDER 6 BITS PRESET TIMER 1 & 2 CONTROL CIRCUIT RESET INT 8 LEVELS STACK 12 BITS PROGRAM COUNTER INSTRUCTION DECODER PROGRAM ROM (2048+128N) X 16 BITS N:0->16 OSCILLATOR CUP0,1,2 XTIN,OUT CFIN,OUT TM8706 BLOCK DIAGRAM PAD DIAGRAM 3 tenx technology, inc. Rev 2.4 03/12/01 TM8706 50 60 40 66 1 30 10 20 The substrate of chip should be connected to GND. PAD COORDINATE 4 tenx technology, inc. Rev 2.4 03/12/01 TM8706 No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 Name BAK XIN XOUT CFIN CFOUT GND VDD1 VDD2 VDD3 VDD4 CUP0 CUP1 CUP2 COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 SEG1(K1) SEG2(K2) SEG3(K3) SEG4(K4) SEG5(K5) SEG6(K6) SEG7(K7) SEG8(K8) SEG9(K9) SEG10(K10) SEG11(K11) X 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 89.50 204.50 319.50 434.50 549.50 669.50 789.50 909.50 1029.50 1149.50 1269.50 1389.50 1509.50 1629.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 Y 1229.50 1114.50 999.50 884.50 769.50 654.50 539.50 424.50 309.50 194.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 197.50 322.50 439.50 554.50 669.50 784.50 899.50 1014.50 1129.50 No 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 Name SEG12(K12) SEG13(K13) SEG14(K14) SEG15(K15) SEG16(K16) SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24/IOA1/CX SEG25/IOA2/RR SEG26/IOA3/RT SEG27/IOA4/RH SEG28/IOB1/ELC SEG29/IOB2/ELP SEG30/IOB3/BZB SEG31/IOB4/BZ SEG32/IOC1/KI1 SEG33/IOC2/KI2 SEG34/IOC3/KI3 SEG35/IOC4/KI4 SEG36/IOD1 SEG37/IOD2 SEG38/IOD3 SEG39/IOD4 SEG40 SEG41 RESET INT TEST X 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1677.50 1558.50 1430.45 1305.00 1164.50 1024.00 881.50 766.50 651.50 536.50 421.50 306.50 191.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 72.50 Y 1244.50 1359.50 1474.50 1589.50 1704.50 1819.50 1934.50 2049.50 2175.00 2300.00 2477.00 2507.50 2507.50 2507.50 2507.50 2507.50 2507.50 2507.50 2507.50 2507.50 2507.50 2507.50 2507.50 2477.00 2300.00 2175.00 2049.50 1934.50 1819.50 1704.50 1589.50 1474.50 1359.50 PIN DESCRIPTION 5 tenx technology, inc. Rev 2.4 03/12/01 TM8706 Name BAK VDD1,2,3,4 I/O P P Description Positive Back-up voltage. At Li power mode, connect a 0.1u capacitor to GND. LCD supply voltage, and positive supply voltage. .In Ag Mode, connect positive power to VDD1. .In Li or ExtV power mode, connect positive power to VDD2. Input pin for external reset request signal, built-in internal pull-down resistor. Input pin for external INT request signal. . Falling edge or rising edge triggered is defined by mask option. . Internal pull-down or pull-up resistor is defined by mask option. Test signal input pin. Switching pins for supply the LCD driving voltage to the VDD1, 2,3,4 pins. . Connect the CUP0, CUP1 and CUP2 pins with non-polarized electrolytic capacitors when chip operated in 1/2, 1/3 or 1/4 bias mode. . In no BIAS mode application, leave these pins opened. Time base counter frequency (clock specified. LCD alternating frequency. Alarm signal frequency) or system clock oscillation. . The usage of 32KHz Crystal oscillator or external RC oscillator is defined by mask option. System clock oscillation for FAST clock only or DUAL clock operation. . The usage of 3.58MHz ceramic/resonator oscillator or external R type oscillator is defined by mask option Output pins for driving the common pins of the LCD panel. COM5~9 could be defined as COMS or Open Drain type output. Output pins for driving the LCD panel segment. Input / Output port A, (muxed with SEG24~27) Input / Output port B, (muxed with SEG28~31) Input / Output port C, (muxed with SEG32~35) Input / Output port D, (muxed with SEG36~39) 1 input pin and 3 output pins for RFC application. (muxed with SEG24~27) Output port for El panel driver. (muxed with SEG28~29) Output port for alarm, clock or single tone melody generator. (muxed with SEG30~31) Output port for key matrix scanning.(Shared with SEG1~SEG16) Input port for key matrix scanning.(Muxed with SEG32~SEG35) Negative supply voltage. RESET INT I I TEST CUP0,1,2 O XIN XOUT I O CFIN CFOUT COM1~9 SEG1-41 IOA1-4 IOB1-4 IOC1-4 IOD1~4 CX RR/RT/RH ELC/ELP BZB/BZ K1~K16 KI1~4 GND I O O O I/O I/O I/O I/O I O O O O I P ABSOLOUTE MAXIMUM RATINGS 6 tenx technology, inc. Rev 2.4 03/12/01 TM8706 GND= 0V Name Symbol VDD1 Maximum Supply Voltage VDD2 VDD3 VDD4 Maximum Input Voltage Maximum output Voltage Vin Vout1 Vout2 Vout3 Maximum Operating Temperature Maximum Storage Temperature Topg Tstg Range -0.3 to 5.5 -0.3 to 5.5 -0.3 to 8.5 -0.3 to 8.5 -0.3 to VDD1/2+0.3 -0.3 to VDD1/2+0.3 -0.3 to VDD3+0.3 -0.3 to VDD4+0.3 -20 to +70 -25 to +125 Unit V V V V V V V V ℃ ℃ POWER CONSUMPTION at Ta=-20℃ to 70℃,GND= 0V Name HALT mode Sym. Condition Min. Typ. 2 Max. Unit uA IHALT1 Only 32.768KHz Crystal oscillator operating, without loading. Ag mode, VDD1=1.5V, BCF = 0 IHALT2 Only 32.768KHz Crystal oscillator operating, without loading. Li mode, VDD2=3.0V, BCF = 0 2 uA STOP mode ISTOP 1 uA Note : When RC oscillator function is operating, the current consumption will depend on the frequency of oscillation. ALLOWABLE OPERATING CONDITIONS at Ta=-20℃ to 70℃,GND= 0V 7 tenx technology, inc. Rev 2.4 03/12/01 TM8706 Name Symb. VDD1 Supply Voltage VDD2 VDD3 VDD4 Oscillator Start-Up Voltage Oscillator Sustain Voltage Supply Voltage Supply Voltage Input “H” Voltage Input “L” Voltage Input “H” Voltage Input “L” Voltage Input “H” Voltage Input “L” Voltage Input “H” Voltage Input “L” Voltage Input “H” Voltage Input “L” Voltage Input “H” Voltage Input “L” Voltage Operating Freq VDDB VDD1 VDD2 Vih1 Vil1 Vih2 Vil2 Vih3 Vil3 Vih4 Vil4 Vih5 Vil5 Vih6 Vil6 Fopg1 Fopg2 Fopg3 Crystal Mode RC Mode CF Mode OSCIN at Ag Battery Mode Li Battery Mode Crystal Mode Ag Mode EXT-V, Li Mode Ag Battery Mode 1.2 1.2 2.4 1.65 5.25 V V V V V V V V V V V V V V V KHZ 1000 3580 KHZ KHz VDDB Crystal Mode 1.3 V Condition Min. 1.2 2.4 2.4 2.4 Max. 5.25 5.25 8.0 8.0 Unit V V V V VDD1-0.7 VDD1+0.7 -0.7 0.7 VDD2-0.7 VDD2+0.7 -0.7 0.8xVDD1 0 0.7 VDD1 0.2xVDD1 VDD2 0.2xVDD2 VDD2 0.2xVDD2 VDDO 0.2xVDDO OSCIN at Li Battery 0.8xVDD2 Mode 0 CFIN at Li Battery 0.8xVDD2 or EXT-V Mode RC Mode 0 0.8xVDDO 0 32 10 1000 8 tenx technology, inc. Rev 2.4 03/12/01 TM8706 INTERNAL RC FREQUENCY RANGE Option Mode 250KHz BAK 1.2V~1.5V 2.4V~5.0V 500KHz 1.2V~1.5V 2.4V~5.0V Min. 300KHz 200KHz 550KHz 400KHz Typ. 350KHz 250KHz 650KHz 500KHz Max. 400KHz 300KHz 750KHz 600KHz ELECTRICAL CHARACTERISTICS at#1:VDD1=1.2V(Ag); at#2:VDD2=2.4V(Li): at#3:VDD2=4V(Ext-V); Input Resistance Name “L” Level Hold Tr(IOC) Symb. Rllh1 Rllh2 Rllh3 IOC Pull-Down Tr Rmad1 Rmad2 Rmad3 INT Pull-up Tr Rintu1 Rintu2 Rintu3 INT Pull-Down Tr Rintd1 Rintd2 Rintd3 RES Pull-Down R Rres1 Rres2 Rres3 Condition Vi=0.2VDD1,#1 Vi=0.2VDD2,#2 Vi=0.2VDD2,#3 Vi=VDD1,#1 Vi=VDD2,#2 Vi=VDD2,#3 Vi=VDD1,#1 Vi=VDD2,#2 Vi=VDD2,#3 Vi=GND,#1 Vi=GND,#2 Vi=GND,#3 Vi=GND or VDD1,#1 Vi=GND or VDD2,#2 Vi=GND or VDD2,#3 Min. 10 10 5 200 200 100 200 200 100 200 200 100 5 5 5 Typ. 40 40 20 500 500 250 500 500 250 500 500 250 20 20 20 Max. 100 100 50 1000 1000 500 1000 1000 500 1000 1000 500 50 50 50 Unit Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm Kohm DC Output Characteristics 9 tenx technology, inc. Rev 2.4 03/12/01 TM8706 Name Symb. Condition Port Min. 0.8 COM5~9 SEG1~41 1.5 2.5 0.2 0.3 0.5 Typ. 0.9 1.8 3.0 0.3 0.6 1.0 Max. 1.0 2.1 3.5 0.4 0.9 1.5 Unit V V V V V V Voh1c Ioh=-200uA,#1 Output ”H” Voltage Voh2c Ioh=-1mA,#2 Voh3c Ioh=-3mA,#3 Vol1c Output ”L” Voltage Vol2c Vol3c Iol=400uA,#1 Iol=2mA,#2 Iol=6mA,#3 Segment Driver Output Characteristics Name Symb. Condition Static Display Mode Voh1d Ioh=-1uA,#1 Output ”H” Voltage Voh2d Ioh=-1uA,#2 Voh3d Ioh=-1uA,#3 Vol1d Output ”L” Voltage Vol2d Vol3d Iol=1uA,#1 Iol=1uA,#2 Iol=1uA,#3 1.0 2.2 COM-n 3.8 0.2 0.2 0.2 SEG-n 1.0 2.2 3.8 0.2 0.2 0.2 V V V V V V V V V V V V For Min. Typ. Max. Unit. Voh1e Ioh=-10uA,#1 Output ”H” Voltage Voh2e Ioh=-10uA,#2 Voh3e Ioh=-10uA,#3 Vol1e Output ”L” Voltage Vol2e Vol3e Iol=10uA,#1 Iol=10uA,#2 Iol=10uA,#3 1/2 Bias Display Mode Output ”H” Voltage Voh12f Ioh=-1uA,#1,#2 Voh3f Output ”L” Voltage Ioh=-1uA,#3 SEG-n 2.2 3.8 0.2 0.2 2.2 COM-n 3.8 1.0 COM-n 1.8 1.4 2.2 V V V V V V V V Vol12f Iol=1uA,#1,#2 Vol3f Iol=1uA,#3 Output ”H” Voltage Voh12g Ioh=-10uA,#1,#2 Voh3g Ioh=-10uA,#3 Output ”M” Voltage Vom12g Iol/h=+/-10uA,#1,#2 Vom3g Iol/h=+/-10uA,#3 1/3 Bias display Mode 10 tenx technology, inc. Rev 2.4 03/12/01 TM8706 Output ”H” Voltage Voh12h Ioh=-1uA,#1,#2 Voh3h Ioh=-1uA,#3 Output ”M1” Voltage Vom1h Iol/h=+/-10uA,#1,#2 Vom13h Iol/h=+/-10uA,#3 Output ”M2” Voltage Vom22h Iol/h=+/-10uA,#1,#2 Vom23h Iol/h=+/-10uA,#3 Output ”L” Voltage Vol12h Iol=1uA,#1,#2 Vol3h Output ”H” Voltage Iol=1uA,#3 3.4 5.8 1.0 COM-n 1.8 2.2 3.8 1.4 2.2 2.6 4.2 0.2 0.2 SEG-n 3.4 5.8 1.0 1.8 2.2 3.8 1.4 2.2 2.6 4.2 0.2 0.2 V V V V V V V V V V V V V V V V Voh12i Ioh=-10uA,#1,#2 Voh3i Ioh=-10uA,#3 Output ”M1” Voltage Vom12i Iol/h=+/-10uA,#1,#2 Vom13i Iol/h=+/-10uA,#3 Output ”M2” Voltage Vom22i Iol/h=+/-10uA,#1,#2 Vom23i Iol/h=+/-10uA,#3 Output ”L” Voltage Vol12i Vol3i Iol=10uA,#1,#2 Iol=10uA,#3 1/4 Bias display Mode Output ”H” Voltage Output ”M2” Voltage Output ”L” Voltage Output ”H” Voltage Output ”M1” Voltage Output ”M3” Voltage Output ”L” Voltage Voh12j Ioh=-1uA,#1,#2 Vom22j Iol/h=+/-10uA,#1,#2 Vol12j Iol=1uA,#1,#2 SEG-n 4.6 2.2 2.6 0.2 4.6 COM-n 1.0 3.4 1.4 3.8 0.2 V V V V V V V Voh12k Ioh=-10uA,#1,#2 Vom12k Iol/h=+/-10uA,#1,#2 Vom22k Iol/h=+/-10uA,#1,#2 Vol12k Iol=10uA,#1,#2 TYPICAL APPLICATION CIRCUIT 11 tenx technology, inc. Rev 2.4 03/12/01 TM8706 This application circuit is simply an example, and is not guaranteed to work. LCD Panel 3.58MHz Crystal COM1~9, SEG1~41 CUP0 0.1uf CFIN CFOUT CUP1 15P XIN 15P 32.768KHz Crystal XOUT CUP2 VDD4 VDD3 VDD2 RH RT RR CX GND VDD1 BAK 0.1u 1.5V 0.1u 0.1uf 0.1u 0.1u 0.1uf TM8706 0.1u L ELP RESET EL Plant External INT. INT ELC I/O Port IOA,IOB,IOC,IOD BZ(BZB) Choke Buzzer K1~K16 KI1~KI4 Key Scanning Key Matrix Ag power mode, 1/4 Bias, 1/9 Duty 12 tenx technology, inc. Rev 2.4 03/12/01