UY3864X

U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Features Package φ3 Round shape type, UB,UC,UG : Water Clear epoxy UY : Pale Yellow Clear epoxy UR : Pale Red Clear epoxy ・Outer Dimension φ3 Round shape type ・Operation temperature range. Storage Temperature :-40℃∼100℃ Operating Temperature :-40℃∼85℃ ・No lead package and lead–free soldering compatible Product features Dominant wavelength Blue Blue Green Green Yellow Red : : : : : 470nm (UB) 505nm (UC) 525nm (UG) 590nm (UY) 626nm (UR) Half Intensity Angle UB,UC,UG UY,UR : 56 deg. : 66 deg. Die materials Rank grouping parameter Soldering methods ESD Packing UB,UC,UG : InGaN, UY,UR : AlGaInP Sorted by luminous intensity per rank taping TTW (Through The Wave) soldering and manual soldering InGaN : Less than 1kV(HBM), Bulk : 200pcs(MIN.) AlGaInP : More than 2kV(HBM) Recommended Applications Amusement Equipment, Electric Household Appliances, OA/FA, Other General Applications 2004.10.29 Page 1 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Color and Luminous Intensity Dominant Wavelength λ d (nm) T YP. IF MIN. (Ta=25℃) Part No. Material Emitted Color Lens Color Luminous Intens ity Iv (mc d) T YP. IF UB3804X UC3804X UG3804X UY3864X UR3864X InGa N InGa N InGa N AlGa InP AlGa InP B lue B lue Green Green Y ellow Red P ale Y ellow P ale Red Water Clear Clear 470 505 525 590 630 20 20 20 20 20 240 672 960 250 220 672 2,688 2,688 500 440 20 20 20 20 20 2004.10.29 Page 2 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Absolute Maximum Ratings Ite m P owe r Dissipa tion F orwa rd Curre nt P ulse F orwa rd Curre nt ※ 1 De ra ting (T a =25℃ o r hi g he r) Re ve rse Volta ge Ope ra ting T e m p e ra ture S tora ge T e m p e ra ture S ymbol Pd IF IF R M ⊿ IF VR T opr T s tg Absolute Ma x imum Ra tings UB 105 25 60 0.33 5 UC 105 25 60 0.33 5 UG 105 25 60 0.33 5 -40~ +85 -40~ +100 UY 150 50 100 0.67 5 UR 150 50 100 0.67 5 Unit mW mA mA mA/℃ V ℃ ℃ (Ta=25℃) ※1 IFRM Measurement condition : Pulse Width≦1ms., Duty≦1/20. 2004.10.29 Page 3 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Electro-Optical Characteristics Characteristics UB TYP. Forward Voltage IF=20mA VF MAX. Reverse Current Peak Wavelength Dominant Wavelength Spectral Line Half Width Half Intensity Angle VR =5V IF=20mA IF=20mA IF=20mA IF=20mA IR λp λd ⊿λ 2θ 1/2 MAX. TYP. TYP. TYP. TYP. 4.2 100 465 470 26 56 4.2 100 502 505 30 56 4.2 100 517 525 35 56 2.8 100 592 590 18 66 2.8 100 641 630 18 66 μA nm nm nm deg. 3.7 UC 3.7 UG 3.7 UY 2.2 UR 2.2 V (Ta=25℃) Item Conditions Symbol Unit 2004.10.29 Page 4 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Luminous Intensity Rank Ra nk MIN. (Ta=25℃) UB MAX. MIN. UC MAX. IV （ mcd ） UG MIN. MAX. MIN. UY MAX. MIN. UR MAX. Condition 440 600 880 1,200 1,760 IF = 20mA A B C D E F G H 672 960 240 336 480 672 960 1,344 480 672 960 1,344 1,920 1,344 1,920 2,688 3,840 1,344 1,920 2,688 3,840 5,376 960 1,344 1,920 2,688 3,840 5,376 1,920 2,688 3,840 5,376 7,680 - 250 350 500 700 1,000 1,400 500 700 1,000 1,400 2,000 - 220 300 440 600 880 1,200 ※Please contact our sales staff concerning rank designation of UY and UR. 2004.12.27 Page 5 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UB) Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Spatial Distribution Example Condition : Ta = 25℃ Relative Intensity Wavelength [nm] Forward Voltage vs. Forward Current Condition : Ta = 25℃ Forward Current vs. Relative Intensity Condition : Ta = 25℃ Forward Current IF(mA) Forward Voltage VF(V) Relative Intensity Forward Current IF(mA) 2004.10.29 Page 6 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UB) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f ≧ 50Hz Ambient Temperature vs. Relative Intensity Condition : IF=20mA Maximum Forward Current : IF MAX. (mA) Ambient Temperature : Ta(℃) Relative Intensity Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Ambient Temperature : Ta(℃) Power Dissipation : Pd (mW) Forward Voltage VF(V) Ambient Temperature : Ta(℃) 2004.10.29 Page 7 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UB) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Condition : Ta = 25℃ Maximum Forward Current : IF MAX. (mA) Pulse Width vs. Maximum Tolerable Peak Current Condition : Ta = 25℃ Duty (%) IF peak Max./IF DC MAX. Pulse Width : tw (μs) 2004.10.29 Page 8 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UC) Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Spatial Distribution Example Condition : Ta = 25℃ Relative Intensity Wavelength [nm] Forward Voltage vs. Forward Current Condition : Ta = 25℃ Forward Current vs. Relative Intensity Condition : Ta = 25℃ Forward Current IF(mA) Forward Voltage VF(V) Relative Intensity Forward Current IF(mA) 2004.10.29 Page 9 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UC) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f ≧ 50Hz Ambient Temperature vs. Relative Intensity Condition : IF=20mA Maximum Forward Current : IF MAX. (mA) Ambient Temperature : Ta(℃) Relative Intensity Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Ambient Temperature : Ta(℃) Power Dissipation : Pd (mW) Forward Voltage VF(V) Ambient Temperature : Ta(℃) 2004.10.29 Page 10 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UC) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Condition : Ta = 25℃ Maximum Forward Current : IF MAX. (mA) Pulse Width vs. Maximum Tolerable Peak Current Condition : Ta = 25℃ Duty (%) IF peak Max./IF DC MAX. Pulse Width : tw (μs) 2004.10.29 Page 11 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UG) Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Spatial Distribution Example Condition : Ta = 25℃ Relative Intensity Wavelength [nm] Forward Voltage vs. Forward Current Condition : Ta = 25℃ Forward Current vs. Relative Intensity Condition : Ta = 25℃ Forward Current IF(mA) Forward Voltage VF(V) Relative Intensity Forward Current IF(mA) 2004.10.29 Page 12 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UG) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f ≧ 50Hz Ambient Temperature vs. Relative Intensity Condition : IF=20mA Maximum Forward Current : IF MAX. (mA) Ambient Temperature : Ta(℃) Relative Intensity Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Ambient Temperature : Ta(℃) Power Dissipation : Pd (mW) Forward Voltage VF(V) Ambient Temperature : Ta(℃) 2004.10.29 Page 13 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UG) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Condition : Ta = 25℃ Maximum Forward Current : IF MAX. (mA) Pulse Width vs. Maximum Tolerable Peak Current Condition : Ta = 25℃ Duty (%) IF peak Max./IF DC MAX. Pulse Width : tw (μs) 2004.10.29 Page 14 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UY) Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Spatial Distribution Example Condition : Ta = 25℃ Relative Intensity Wavelength [nm] Forward Voltage vs. Forward Current Condition : Ta = 25℃ Forward Current vs. Relative Intensity Condition : Ta = 25℃ Forward Current IF(mA) Forward Voltage VF(V) Relative Intensity Forward Current IF(mA) 2004.10.29 Page 15 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UY) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f ≧ 50Hz Ambient Temperature vs. Relative Intensity Condition : IF=20mA Maximum Forward Current : IF MAX. (mA) Ambient Temperature : Ta(℃) Relative Intensity Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Ambient Temperature : Ta(℃) Power Dissipation : Pd (mW) Forward Voltage VF(V) Ambient Temperature : Ta(℃) 2004.10.29 Page 16 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UY) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Condition : Ta = 25℃ Maximum Forward Current : IF MAX. (mA) Pulse Width vs. Maximum Tolerable Peak Current Condition : Ta = 25℃ Duty (%) IF peak Max./IF DC MAX. Pulse Width : tw (μs) 2004.10.29 Page 17 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UR) Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Spatial Distribution Example Condition : Ta = 25℃ Relative Intensity Wavelength [nm] Forward Voltage vs. Forward Current Condition : Ta = 25℃ Forward Current vs. Relative Intensity Condition : Ta = 25℃ Forward Current IF(mA) Forward Voltage VF(V) Relative Intensity Forward Current IF(mA) 2004.10.29 Page 18 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UR) Derating Ambient Temperature vs. Maximum Forward Current Repetition Frequency : f ≧ 50Hz Ambient Temperature vs. Relative Intensity Condition : IF=20mA Maximum Forward Current : IF MAX. (mA) Ambient Temperature : Ta(℃) Relative Intensity Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Power Dissipation vs. Ambient Temperature Ambient Temperature : Ta(℃) Power Dissipation : Pd (mW) Forward Voltage VF(V) Ambient Temperature : Ta(℃) 2004.10.29 Page 19 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Technical Data(UR) Dynamic Drive Rating Duty cycle vs. Maximum Forward Current Condition : Ta = 25℃ Maximum Forward Current : IF MAX. (mA) Pulse Width vs. Maximum Tolerable Peak Current Condition : Ta = 25℃ Duty (%) IF peak Max./IF DC MAX. Pulse Width : tw (μs) 2004.10.29 Page 20 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Package Dimensions (Unit: mm) 2004.10.29 Page 21 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type TTW (Through The Wave) soldering Conditions Pre-heating Solder Bath Temp. Dipping Time 100 ℃ 60 s 265 ℃ 5s (MAX.) (MAX.) (MAX.) (MAX.) 1) The dip soldering process shall be 2 times maximum. 2) The product shall be cooled to normal temperature before the second dipping process. Manual Soldering Conditions Iron tip temp. Soldering time and frequency 400 ℃ (MAX.) 3s (MAX.) 2 times (MAX.) 2004.10.29 Page 22 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Reliability Testing Result Reliability Testing Result Room Temp. Operating Life Resistance to Soldering Heat Temperature Cycling Wet High Temp. Storage Life High Temp. Storage Life Low Temp. Storage Life Lead Tension Vibration, Variable Frequency Applicable Standard EIAJ ED4701/100(101) EIAJ ED4701/300(302) EIAJ ED4701/100(105) EIAJ ED4701/100(103) EIAJ ED4701/200(201) EIAJ ED4701/200(202) EIAJ ED4701/400(401) EIAJ ED4701/400(403) Testing Conditions Ta = 25 ℃, IF = Maxium Rated Current 260 ±5 ℃, 3mm from package base Minimum Rated Storage Temperature(30min) ～Normal Temperature(15min) ～Maximum Rated Storage Temperature(30min) ～Normal Temperature(15min) Ta = 60 ±2 ℃, RH = 90 ±5% Ta = Maximum Rated Storage Temperature Ta = Minimum Rated Storage Temperature 10N,1time ( 0.4 and Flat Package : 5N) 98.1m/s ( 10G), 100 ～ 2 KHz sweep for 20min., XYZ each direction 2 □ Duration 1,000 h 10sec Failure 0/25 0/25 5 cycles 0/25 1,000 h 1,000 h 1,000 h 10sec 2h 0/25 0/25 0/25 0/10 0/10 Failure Criteria Items Luminous Intensity Forward Voltage Reverse Current Cosmetic Appearance Symbols Iv VF IR - Conditions IF Value of each product Luminous Intensity IF Value of each product Forward Voltage VR = Maximum Rated Reverse Voltage V - Failure criteria Testing Min. Value ＜ Spec. Min. Value x 0.5 Testing Max. Value ≧ Spec. Max. Value x 1.2 Testing Max. Value ≧ Spec. Max. Value x 2.5 No notable, decoloration, deformation and cracking 2004.10.29 Page 23 U□38□4X Series Single Color φ3 Flush Mount Round Shape Type Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products described in the data sheets are made to be used in standard electronic applications such as office automation appliances, communication devices, audio visual, home appliances, and measuring instruments. 5) If the products in the data sheets are to be used for purposes other than the above which requires high level reliability and safety where failure and or malfunction of the product may cause death or other serious effects on the human body such as airplane, space activity, transportation, medical, nuclear), please contact our sales personnel. 6) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 7) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 8) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com 2004.10.29 Page 24