WS1M32-G3C

White Electronic Designs 1Mx32 SRAM MODULE FEATURES ■ Access Times of 17, 20, 25ns ■ Packaging • 84 lead, 28mm CQFP, (Package 511) • 66 pin PGA Type, 1.385" sq., Hermetic Ceramic HIP (Package 402)* ■ Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8 * Package to be developed. WS1M32-XXX ■ Commercial, Industrial and Military Temperature Ranges ■ TTL Compatible Inputs and Outputs ■ 5 Volt Power Supply ■ Low Power CMOS ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Weight WS1M32-XH2X* - 13 grams (typical) WS1M32-XG3X - 20 grams (typical) PIN CONFIGURATION FOR WS1M32-XH2X* TOP VIEW 1 I/O8 I/O9 I/O10 A13 A14 A15 A16 A17 I/O0 I/O1 I/O2 11 22 12 WE2 OE2 GND I/O11 A10 A11 A12 VCC CS1 NC I/O3 33 23 I/O15 I/O14 I/O13 I/O12 OE1 A18 WE1 I/O7 I/O6 I/O5 I/O4 I/O24 I/O25 I/O26 A6 A7 CS2 A8 A9 I/O16 I/O17 I/O18 44 34 VCC OE4 WE4 I/O27 A3 A4 A5 WE3 OE3 GND I/O19 55 45 I/O31 I/O30 I/O29 I/O28 A0 A1 A2 I/O23 OE1 W E 1 PIN DESCRIPTION 56 I/O0-31 A0-18 WE1-4 CS1-2 OE1-4 VC C GND N C Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected BLOCK DIAGRAM OE2 W E 2 OE3 W E 3 OE4 W E 4 I/O22 I/O21 I/O20 66 2M 8 512K xx 8 512K x 8 CS1 A0-18 2M 8 512K xx 8 512K x 8 2M 8 512K xx 8 2M 512K x 8 512K x 8 512K x 8 8 8 8 8 CS2 I/O0-7 I/O8-15 I/O16-23 I/O24-31 NOTE: CS 1 & CS 2 a re used as bank select July 2002 Rev. 4 1 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com White Electronic Designs PIN CONFIGURATION FOR WS1M32-XG3X TOP VIEW GND I/O31 I/O30 I/O29 I/O28 I/O27 I/O26 I/O25 I/O24 NC NC NC I/O23 I/O22 I/O21 I/O20 I/O19 I/O18 I/O17 I/O16 VCC WS1M32-XXX PIN DESCRIPTION I/O0-31 A0-18 WE1-4 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 GND NC NC NC NC NC NC NC NC WE4 WE3 WE2 WE1 NC NC A18 A17 A16 A15 A14 VCC Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enables Power Supply Ground Not Connected 11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75 VCC A0 A1 A2 A3 A4 A5 A6 OE1 OE2 OE3 OE4 NC A7 A8 A9 A10 A11 A12 A13 GND 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 8 8 CS1-2 OE1-4 VCC GND N C BLOCK DIAGRAM OE1 W E 1 OE2 W E 2 OE3 W E 3 OE4 W E 4 CS1 A0-18 2M 8 512K xx 8 512K x 8 2M 8 512K xx 8 512K x 8 2M 8 512K xx 8 2M 512K x 8 512K x 8 512K x 8 8 8 VCC I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 CS1 NC CS2 I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 GND CS2 I/O0-7 I/O8-15 I/O16-23 I/O24-31 NOTE: CS 1 & CS 2 a re used as bank select 1.146" The WEDC 84 lead G3 CQFP fills the same fit and function as the JEDEC 84 lead CQFJ or 84 PLCC. But the G3 has the TCE and lead inspection advantage of the CQFP form. White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520 2 White Electronic Designs ABSOLUTE MAXIMUM RATINGS Parameter Operating Temperature Storage Temperature Signal Voltage Relative to GND Junction Temperature Supply Voltage Symbol TA TSTG VG TJ VCC -0.5 Min -55 -65 -0.5 Max +125 +150 Vcc + 0.5 150 7.0 Unit °C °C V °C V Parameter OE1-4 capacitance WE1-4 capacitance CS1-2 capacitance Data I/O capacitance Address input capacitance WS1M32-XXX CAPACITANCE (TA=+25°C) Symbol COE CWE CCS CI/O CAD Conditions VIN = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz VI/O = 0 V, f = 1.0 MHz VIN = 0 V, f = 1.0 MHz Max Unit 30 30 30 30 75 pF pF pF pF pF RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Input High Voltage Input Low Voltage Operating Temp (Mil) Operating Temp (Ind.) Symbol VCC VIH VIL TA TA Min 4.5 2.2 -0.5 -55 -40 Max 5.5 V CC + 0.3 +0.8 +125 +85 Unit V V V °C °C This parameter is guaranteed by design but not tested. TRUTH TABLE CS1 H L L L H H H L CS2 H H H H L L L L OE X L H X L H X X WE X H H L H H L X Mode Data I/O Power Standby High Z Standby Read Data Out Active Out Disable High Z Active Write Data In Active Read Data Out Active Out Disable High Z Active Write Data In Active Invalid State Invalid State Invalid State DC CHARACTERISTICS (VCC = 5.0V, GND = 0V, TA = -55°C to +125°C) Parameter Input Leakage Current Output Leakage Current Operating Supply Current x 32 Mode Standby Current Output Low Voltage Output High Voltage Symbol ILI I LO I CC x 32 I SB VOL VOH Conditions VCC = 5.5, VIN = GND to VCC CS = VIH, OE = VIH, VOUT = GND to V CC CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5 CS = VIH, OE = VIH , f = 5MHz, Vcc = 5.5 I OL = 8mA, Vcc = 4.5 I OH = -4.0mA, Vcc = 4.5 2.4 Min Max 10 10 720 120 0.4 Units µA µA mA mA V V NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V 3 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com White Electronic Designs AC CHARACTERISTICS (VCC=5.0V,GND=0V,TA=-55°Cto+125°C) Parameter Read Cycle Read Cycle Time Address Access Time Output Hold from Address Change Chip Select Access Time Output Enable to Output Valid Chip Select to Output in Low Z Output Enable to Output in Low Z Chip Disable to Output in High Z Output Disable to Output in High Z t RC t AA t OH t ACS t OE t CLZ 1 t OLZ 1 t CHZ 1 t OHZ 1 2 0 12 12 0 17 10 2 0 12 12 Symbol Min 17 17 0 20 10 2 0 -17 Max Min 20 20 0 -20 Max WS1M32-XXX -25 Min 25 25 25 12 Max Units ns ns ns ns ns ns ns 12 12 ns ns 1. This parameter is guaranteed by design but not tested. AC CHARACTERISTICS (VCC=5.0V,GND=0V,TA=-55°Cto+125°C) Parameter Write Cycle Write Cycle Time Chip Select to End of Write Address Valid to End of Write Data Valid to End of Write Write Pulse Width Address Setup Time Address Hold Time Output Active from End of Write Write Enable to Output in High Z Data Hold Time t WC t CW t AW t DW t WP t AS t AH t OW1 t WHZ 1 t DH 0 Symbol Min 17 15 15 11 15 2 0 2 9 0 -17 Max Min 20 15 15 12 15 2 0 3 11 0 -20 Max Min 25 17 17 13 17 2 0 4 13 -25 Max ns ns ns ns ns ns ns ns ns ns Units 1. This parameter is guaranteed by design but not tested. AC TEST CIRCUIT I OL Current Source AC TEST CONDITIONS Parameter Input Pulse Levels Input Rise and Fall Input and Output Reference Level Typ VIL = 0, VIH = 3.0 5 1.5 1.5 Unit V ns V V D.U.T. C eff = 50 pf VZ 1.5V Output Timing Reference Level (Bipolar Supply) I OH Current Source NOTES: V Z i s programmable from -2V to +7V. I OL & I OH p rogrammable from 0 to 16mA. Tester Impedance Z0 = 75 W . V Z i s typically the midpoint of V OH a nd V OL . I OL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520 4 White Electronic Designs TIMING WAVEFORM - READ CYCLE tRC ADDRESS WS1M32-XXX tAA CS tRC ADDRESS tACS tCLZ OE tCHZ tAA tOH DATA I/O PREVIOUS DATA VALID DATA VALID tOE tOLZ DATA I/O HIGH IMPEDANCE tOHZ DATA VALID READ CYCLE 1 (CS = OE = VIL, WE = VIH) READ CYCLE 2 (WE = VIH) WRITE CYCLE - WE CONTROLLED tWC ADDRESS tAW tCW CS tAH tAS WE tWP tOW tWHZ tDW tDH DATA I/O DATA VALID WRITE CYCLE 1, WE CONTROLLED WRITE CYCLE - CS CONTROLLED tWC ADDRESS WS32K32-XHX tCW tAH tAS CS tAW tWP WE tDW DATA I/O DATA VALID tDH WRITE CYCLE 2, CS CONTROLLED 5 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com White Electronic Designs PACKAGE 402: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H2) 35.2 (1.385) ± 0.38 (0.015) SQ WS1M32-XXX PIN 1 IDENTIFIER SQUARE PAD ON BOTTOM 25.4 (1.0) TYP 5.7 (0.223) MAX 3.81 (0.150) ± 0.1 (0.005) 2.54 (0.100) TYP 15.24 (0.600) TYP 1.27 (0.050) ± 0.1 (0.005) 0.76 (0.030) ± 0.1 (0.005) 1.27 (0.050) TYP DIA 0.46 (0.018) ± 0.05 (0.002) DIA 25.4 (1.0) TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520 6 White Electronic Designs PACKAGE 511: 84 LEAD, CERAMIC QUAD FLAT PACK (G3) 4.29 (0.169) ± 0.28 (0.011) 4.12 (0.162) ± 0.20 (0.008) WS1M32-XXX 30.23 (1.190) ± 0.25 (0.010) SQ 27.18 (1.070) ± 0.25 (0.010) SQ Pin 1 0.25 (0.010) ± 0.03 (0.002) R 0.127 (0.005) MIN 29.11 (1.146) ± 0.25 (0.010) 1 /7 1.02 (0.040) ± 0.12 (0.005) + 0.19 (0.008) ± 0.06 (0.003) DETAIL A 1.27 (0.050) TYP 0.38 (0.015) ± 0.05 (0.002) 25.40 (1.000) TYP SEE DETAIL "A" 0.27 (0.011) ± 0.04 (0.001) 1.146" The WEDC 84 lead G3 CQFP fills the same fit and function as the JEDEC 84 lead CQFJ or 84 PLCC. But the G3 has the TCE and lead inspection advantage of the CQFP form. ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES 7 White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com White Electronic Designs ORDERING INFORMATION W S 1M32 - XX X X X LEAD FINISH: Blank = Gold plated leads A = Solder dip leads DEVICE GRADE: M = Military Screened I = Industrial C = Commercial WS1M32-XXX -55°C to +125°C -40°C to +85°C 0°C to +70°C PACKAGE TYPE: H2 = Ceramic Hex-In-line Package, HIP (Package 402)* G3 = 28 mm Ceramic Quad Flatpack, CQFP (Package 511) ACCESS TIME (ns) ORGANIZATION, two banks of 512Kx32 User configurable as 2Mx16 or 4Mx8 SRAM WHITE ELECTRONIC DESIGNS CORP. * Package to be developed. White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520 8