BCcomponents
DATA SHEET
150 CLZ Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance
Preliminary specification Supersedes data of 26th September 2001 File under BCcomponents, BC01 2002 Feb 27
BCcomponents
Preliminary specification
Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance
FEATURES
150 CLZ
• Polarized aluminum electrolytic capacitors, non-solid electrolyte, self healing • SMD-version with base plate, reflow solderable • Very low impedance, very high ripple current • Very long useful life: 3000 hours at 105 °C • Charge and discharge proof, no peak current limitation • Supplied in blister tape on reel.
APPLICATIONS Fig.1 Component outline.
CCA716
• SMD technology, for high mounting density • Industrial and professional applications • Automotive, general industrial • Smoothing, filtering, buffering.
140 CLH 125 °C
175 °C solid SMD
175 TMP
high temperature standard
150 CLZ
153 CLV
JW14
QUICK REFERENCE DATA DESCRIPTION Nominal case sizes (L × W × H in mm) Rated capacitance range, CR Tolerance on CR Rated voltage range, UR Category temperature range Endurance test at 105 °C: Useful life at 105 °C: case size ≤10 × 10 × 10 case size 10 × 10 × 14 Useful life at 40 °C; 1.8 × lR applied: case size ≤10 × 10 × 10 case size 10 × 10 × 14 Shelf life at 0 V, 105 °C Based on sectional specification Climatic category IEC 60068 125000 hours 150000 hours 1000 hours IEC 60384-18/CECC32300 55/105/56 2500 hours 3000 hours VALUE 8 × 8 × 10 to 10 × 10 × 14 33 to 1000 µF
±20%
6.3 to 63 V
−55 to +105 °C
2000 hours
2002 Feb 27
2
BCcomponents
Preliminary specification
Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance
Selection chart for CR, UR and relevant nominal case sizes (L × W × H in mm) Preferred types in bold. CR (µF) 33 47 68 100 150 220 330 470 680 1000 MARKING UR (V) 6.3 10 16 25 35 50
150 CLZ
63 8 × 8 × 10 8 × 8 × 10 10 × 10 × 10 10 × 10 × 10 10 × 10 × 14
− − − − − − − −
8 × 8 × 10
− − − − − − −
8 × 8 × 10 8 × 8 × 10 10 × 10 × 10 10 × 10 × 14
− − − − − −
8 × 8 × 10 8 × 8 × 10 10 × 10 × 10 10 × 10 × 14
− − − − −
8 × 8 × 10 8 × 8 × 10 10 × 10 × 10 10 × 10 × 14
− − − −
8 × 8 × 10
− − −
8 × 8 × 10 10 × 10 × 10
−
10 × 10 × 10 10 × 10 × 14
−
10 × 10 × 14
− − − − − −
− − − −
− − −
−
10 × 10 × 10
− −
−
• Rated capacitance (in µF) • Rated voltage (in V) • Black mark or ‘−’ sign indicating the cathode (the anode is identified by bevelled edges) • Code indicating group number (Z) • Date code, in accordance with “IEC 60062” .
2002 Feb 27
3
BCcomponents
Preliminary specification
Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance
MECHANICAL DATA
0.4 ±0.2
150 CLZ
L
WB
S L1 D
H
JW07
0.3 max.
Dimensions in mm. For dimensions see Table 1.
Fig.2 Dimensional outline. Table 1 Physical dimensions, mass and packaging quantities; see Fig.2 CASE CODE 0810 1010 1014 Lmax (mm) 8.5 10.5 10.5 Wmax (mm) 8.5 10.5 10.5 Hmax (mm) 10.5 10.5 14.3
NOMINAL CASE SIZE L×W×H (mm) 8 × 8 × 10 10 ×10 × 10 10 × 10 × 14 PACKAGING
∅D (mm)
8.0 10.0 10.0
Bmax (mm) 1.0 1.0 1.0
S (mm) 3.1 4.5 4.5
L1 max (mm) 9.9 11.8 11.8
MASS (g)
≈1.0 ≈1.3 ≈1.5
Supplied in blister tape on reel. For general packaging information refer to data handbook BC01, section “Packaging”. Table 2 Tape and reel dimensions CASE CODE 0810 1010 1014 PITCH P1 (mm) 16 16 16 TAPE WIDTH W (mm) 24 24 24 TAPE THICKNESS T2 (mm) 11.8 11.8 15.0 REEL DIA. (mm) 380 380 330 PACKAGING QUANTITY PER REEL 500 500 250
NOMINAL CASE SIZE L×W×H (mm) 8 × 8 × 10 10 ×10 × 10 10 × 10 × 14
2002 Feb 27
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BCcomponents
Preliminary specification
Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance
MOUNTING The capacitors are designed for automatic placement on to printed-circuit boards. Optimum dimensions of soldering pads depend amongst others on soldering method, mounting accuracy, print lay-out and/or adjacent components. For recommended soldering pad dimensions, refer to Fig.3 and Table 3 Soldering Soldering conditions are defined by the curve, temperature versus time, where the temperature is that measured on the soldering pad during processing. For maximum conditions refer to Fig.4. Any temperature versus time curve which does not exceed the specified maximum curves may be applied. AS A GENERAL PRINCIPLE, TEMPERATURE AND DURATION SHALL BE THE MINIMUM NECESSARY REQUIRED TO ENSURE GOOD SOLDERING CONNECTIONS. HOWEVER, THE SPECIFIED MAXIMUM CURVES SHOULD NEVER BE EXCEEDED. Table 3
150 CLZ
b
CCA857
a
For dimensions see Table 3.
c
a
Fig.3 Recommended soldering pad dimensions.
Recommended soldering pad dimensions; see Fig.3 a (mm) 3.5 4.3 4.3 b (mm) 2.5 2.5 2.5 c (mm) 3.0 4.0 4.0
CASE CODE 0810 1010 1014
MBA533
280 T PAD
o ( C) 260
240 220 200 180 160 140 120 100 80 0 50 100 150 200 t (s) 250
Fig.4
Maximum temperature load during infrared reflow soldering measured on the soldering pad.
2002 Feb 27
5
BCcomponents
Preliminary specification
Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance
ELECTRICAL DATA AND ORDERING INFORMATION Unless otherwise specified, all electrical values in Table 4 apply at Tamb = 20 °C, P = 86 to 106 kPa, RH = 45 to 75%. SYMBOL CR IR IL2 Tan δ Z Ordering example Table 4 UR (V) 6.3 10 Electrical data and ordering information; preferred types in bold CR (µF) 470 1000 330 470 680 1000 16 220 330 470 680 25 150 220 330 470 35 100 220 330 50 68 100 220 63 33 47 47 68 100 NOMINAL CASE SIZE L×W×H (mm) 8 × 8 × 10 10 × 10 × 10 8 × 8 × 10 8 × 8 × 10 10 × 10 × 10 10 × 10 × 14 8 × 8 × 10 8 × 8 × 10 10 × 10 × 10 10 × 10 × 14 8 × 8 × 10 8 × 8 × 10 10 × 10 × 10 10 × 10 × 14 8 × 8 × 10 10 × 10 × 10 10 × 10 × 14 8 × 8 × 10 10 × 10 × 10 10 × 10 × 14 8 × 8 × 10 8 × 8 × 10 10 × 10 × 10 10 × 10 × 10 10 × 10 × 14 IR 105 °C (mA) 100 kHz 435 670 435 435 670 850 435 435 670 850 420 420 640 820 405 630 790 333 490 620 270 270 390 390 507 IL2 2 min (µA) 30 63 33 47 68 100 35 53 75 109 38 55 83 118 35 77 116 34 50 110 21 30 30 43 63 Tan δ 100 Hz 0.24 0.24 0.20 0.20 0.20 0.20 0.16 0.16 0.16 0.16 0.14 0.14 0.14 0.14 0.12 0.12 0.12 0.12 0.12 0.12 0.10 0.10 0.10 0.10 0.10 Z 100 kHz +20 °C ( Ω) 0.25 0.13 0.25 0.25 0.13 0.10 0.25 0.25 0.13 0.10 0.28 0.28 0.14 0.11 0.30 0.15 0.12 0.48 0.24 0.19 0.65 0.65 0.38 0.38 0.29 DESCRIPTION rated capacitance at 100 Hz, tolerance ±20% rated RMS ripple current at 100 kHz, 105 °C max. leakage current after 2 minutes at UR max. dissipation factor at 100 Hz max. impedance at 100 kHz
150 CLZ
Electrolytic capacitor 150 CLZ series 220 µF/50 V; ±20% Nominal case size: 10 × 10 × 14 mm; taped on reel Catalogue number: 2222 150 95102.
CATALOGUE NUMBER 2222 150 ..... 95311 95301 95411 95412 95401 95402 95511 95512 95501 95502 95611 95612 95601 95602 95011 95001 95002 95111 95101 95102 95812 95811 95801 95802 95803
2002 Feb 27
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BCcomponents
Preliminary specification
Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance
Additional electrical data PARAMETER Voltage Surge voltage for short periods Reverse voltage for short periods Current Leakage current Inductance Equivalent series inductance (ESL) Resistance Equivalent series resistance (ESR) at 100 Hz calculated from tan δmax and CR (see Table 4) Capacitance (C) typ. 16 nH after 2 minutes at UR IEC 60384-18, subclause 4.14 IEC 60384-18, subclause 4.16 Us ≤ 1.15 × UR Urev ≤ 1 V CONDITIONS
150 CLZ
VALUE
IL2 ≤ 0.01 × CR × UR
ESR = tan δ / 2πfCR
1.2 C C0 1.1 2
JW15
1
1.0
2 0.9
Curve 1: 10 V. Curve 2: 63 V. C0 = capacitance at 20 °C, 100 Hz.
1 0.8 −60
−40
−20
0
20
40
60
80
100 120 Tamb (°C)
140
Fig.5 Typical multiplier of capacitance as a function of ambient temperature.
2002 Feb 27
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BCcomponents
Preliminary specification
Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance
Dissipation factor (tan δ)
150 CLZ
102
JW16
tan δ tan δ 0
1
10
2
1
2 1
Curve 1: 10 V. Curve 2: 63 V. Tan δ0 = typical tan δ at 20 °C, 100 Hz.
10−1 −60
−40
−20
0
20
40
60
80
100 Tamb (°C)
120
Fig.6 Multiplier of dissipation factor (tan δ) as a function of ambient temperature.
Equivalent series resistance (ESR)
10
JW17
ESR ESR 0
3 2 1
1 1 2 3
Curve 1: 10 V. Curve 2: 35 V. Curve 3: 63 V. ESR0 = typical ESR at 20 °C, 100 Hz.
0.1 101 102 103 104 f (Hz) 105
Fig.7 Typical multiplier of ESR as a function of frequency.
2002 Feb 27
8
BCcomponents
Preliminary specification
Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance
Impedance (Z)
150 CLZ
102 Z (Ω ) 10 1 2 3
JW169
1
UR = 1 0 V Curve 1: case code 0810, 470 µF. Curve 2: case code 1010, 680 µF. Curve 3: case code 1014, 1000 µF. Tamb = 20 °C.
0.1
0.01 10
10 2
10 3
10 4
f (Hz)
10 5
Fig.8 Typical impedance as a function of frequency.
102 Z (Ω ) 10
JW170
1
1 2 0.1 3
UR = 3 5 V Curve 1: case code 0810, 100 µF. Curve 2: case code 1010, 220 µF. Curve 3: case code 1014, 330 µF. Tamb = 20 °C.
0.01 10
10 2
10 3
10 4
f (Hz)
10 5
Fig.9 Typical impedance as a function of frequency.
2002 Feb 27
9
BCcomponents
Preliminary specification
Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance
150 CLZ
102 Z (Ω ) 10
JW171
1 1 2 3 0.1
UR = 6 3 V Curve 1: case code 0810, 47 µF. Curve 2: case code 1010, 68 µF. Curve 3: case code 1014, 100 µF. Tamb = 20 °C.
0.01 10
10
2
10
3
10
4
f (Hz)
10
5
Fig.10 Typical impedance as a function of frequency.
RIPPLE CURRENT AND USEFUL LIFE Table 5 Multiplier of ripple current (IR) as a function of frequency FREQUENCY (Hz) 100 300 1000 3000 10000 30000 100000 IR MULTIPLIER UR = 6.3 to 25 V 0.70 0.80 0.85 0.93 0.95 0.97 1.00 UR = 35 V 0.65 0.80 0.85 0.93 0.95 0.97 1.00 UR = 50 to 63 V 0.60 0.75 0.85 0.93 0.95 0.97 1.00
2002 Feb 27
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BCcomponents
Preliminary specification
Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance
150 CLZ
3.8 IA IR 3.7 3.6 3.5 3.4 3.3 3.2 3.1 3.0
MEA240
2.8 lifetime multiplier
2.6
1.
2.4
0 1. 5
2.2
2. 0 3. 0
2.0
4. 0 6. 0
1.8
8. 0 12
1.6
20
1.4 1.2 1.0 0.8 0.5 0.0
30 60 0 10 0 15 0 20
40 50 60 70 80 90 100 110 Tamb ( oC) 1)
IA = actual ripple current at 100 kHz. IR = rated ripple current at 100 kHz, 105 °C. (1) Useful life at 105 °C and IR applied: case code ≤1010: 2500 hours; case code = 1014: 3000 hours.
Fig.11 Multiplier of useful life as a function of ambient temperature and ripple current load.
2002 Feb 27
11
BCcomponents
Preliminary specification
Aluminum electrolytic capacitors SMD (Chip) Long life base plate, very low impedance
SPECIFIC TESTS AND REQUIREMENTS General tests and requirements are specified in data handbook BC01, section “Tests and Requirements”. Table 6 Test procedures and requirements TEST NAME OF TEST Mounting REFERENCE IEC 60384-18, subclause 4.3 PROCEDURE (quick reference) shall be performed prior to tests mentioned below; reflow soldering; for maximum temperature load refer to chapter “Mounting” Tamb = 105 °C; UR applied; 2000 hours
150 CLZ
REQUIREMENTS
∆C/C: ±5%
tan δ ≤ spec. limit IL2 ≤ spec. limit UR = 6.3 V; ∆C/C: ±25% UR ≥ 10 V; ∆C/C: ±20% tan δ ≤ 2 × spec. limit IL2 ≤ spec. limit
Endurance
IEC 60384-18/ CECC32300, subclause 4.15
Useful life
CECC 30301, subclause 1.8.1
Tamb = 105 °C; UR and IR applied; case size ≤10 × 10 × 10: 2 500 hours case size = 10 × 10 × 14: 3 000 hours,
∆C/C: ±50%
tan δ ≤ 3 × spec. limit IL2 ≤ spec. limit no short or open circuit total failure percentage: ≤1%
Shelf life (storage at high temperature)
IEC 60384-18/ CECC32300, subclause 4.17
Tamb = 105 °C; no voltage applied; 1000 hours after test: UR to be applied for 30 minutes, 24 to 48 hours before measurement
for requirements see ‘Endurance test’ above
2002 Feb 27
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