ARC241

Array chip resistors size 4 × 0603 FEATURES • 4 × 0603 sized resistors in one 1206-sized package • Reduced reel exchange time • Low assembly costs • Reduced PCB area • Reduced size of final equipment • Higher component and equipment reliability. APPLICATIONS • Camcorders • Hand held measuring equipment • Car telephones • Computers • Portable radio, CD and cassette players. QUICK REFERENCE DATA VALUE DESCRIPTION ARC241 Resistance range Resistance tolerance and E-series Temperature coefficient Absolute maximum dissipation per resistive element at T amb = 70 °C Maximum permissible voltage Climatic category (IEC 60 068) Basic specification R-Array overview TYPE ARC241 ARC242 ARV241 ARV242 TERMINATION TECHNOLOGY concave concave convex convex SIZE 4 × 0603 4 × 0603 4 × 0603 4 × 0603 ±5%; E24 ser ies ≤±200 × 10−6/K ARV241 ARC242 DESCRIPTION The resistors are constructed on a high grade ceramic body (aluminium oxide). Internal metal electrodes are added at each end and connected by a resistive paste which is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to within tolerance, by laser cutting of this resistive layer. The resistive layer is covered with a protective coating and printed with the resistance value. Finally, external end terminations are added. For ease of soldering the outer layer of these end terminations is a lead-tin alloy. ARC241/ARC242 ARV241/ARV242 handbook, 2 columns R1 R2 R3 R4 CCA862 R1 = R2 = R3 = R4. For dimensions see Fig.3 and Table 3. Fig.1 Equivalent circuit diagram. ARV242 ±1%; E24/E96 ser ies ≤±200 × 10−6/K 10 Ω to 1 MΩ ±1%; E96 ser ies ≤±100 × 10−6/K 0.063 W 50 V (DC or RMS) 55/155/56 IEC 60 115-8 TOLERANCE (%) 5 1 5 1 1 Array chip resistors size 4 × 0603 FUNCTIONAL DESCRIPTION Product characterization Standard values of nominal resistance are taken from the E24 or E96 series for resistors with a tolerance of ±5% or ±1%. The values of the E24/E96 series are in accordance with “IEC publication 60 063”. Limiting values TYPE ARC241 ARC242 ARV241 ARV242 Note 1. This is the maximum voltage that may be continuously applied to the resistor element, see “IEC publication 60 115-8”. Fig.2 50 0.063 0 −55 0 50 70 ARC241/ARC242 ARV241/ARV242 DERATING The power that the resistor can dissipate depends on the operating ambient temperature; see Fig.2. handbook, 4 columns Pmax (%Prated) CCB412 100 LIMITING VOLTA GE(1) (V) LIMITING POWER (W) 50 100 155 Tamb (°C) Maximum dissipation (Pmax) in percentage of rated power as a function of the operating ambient temperature (Tamb). 3 Array chip resistors size 4 × 0603 MECHANICAL DATA Mass per 100 units TYPE ARC241 ARC242 ARV241 ARV242 Marking All resistors within the E24 series are marked with a 3-digit code and a 4-digit code for resistors of the E96 series, on the protective coat to designate the nominal resistance value. 3-DIGIT MARKING For values up to 91 Ω the R is used as a decimal point. For values of 100 Ω or greater the first 2 digits apply to the resistance value and the third indicates the number of zeros to follow. Example MARKING 12R 124 000 4-DIGIT MARKING For values up to 976 Ω the R is used as a decimal point. For values of 1 K or greater the first 3 digits apply to the resistance value and the fourth indicates the number of zeros to follow. Example MARKING 12R0 1203 RESISTANCE 12 Ω 120 kΩ RESISTANCE 12 Ω 120 kΩ jumper Table 3 Physical dimensions; see Fig.3 ARC241/242 SYMBOL VALUE L W T A B P E G C 3.20 1.60 0.60 0.60 0.35 0.80 0.50 0.50 0.10 TOL. +0.20/−0.10 +0.20/−0.10 ±0.20 ±0.15 ±0.15 ±0.15 ±0.15 ±0.15 min. VALUE 3.20 1.60 0.55 0.40 0.30 0.80 − 0.30 0.10 G G ARC241/ARC242 ARV241/ARV242 PACKAGE MARKING The packaging is also marked and includes resistance value, tolerance, catalogue number, quantity, production period, batch number and source code. Outlines MASS (g) 1.1 1.1 0.9186 0.9186 a handbook, 4 columns A B C a A T B 103 P L a P 103 a L W CCA863 C convex termination E C concave termination Dimensions in mm. For dimensions see Table 3. Fig.3 Outlines. ARV241 TOL. ±0.15 ±0.15 ±0.10 ±0.15 ±0.20 ±0.15 − ±0.15 min. ARV242 UNIT VALUE 3.20 1.60 0.55 0.60 0.30 0.80 − 0.30 0.40 TOL. ±0.15 mm ±0.15 mm ±0.10 mm ±0.05 mm ±0.20 mm ±0.15 mm − mm ±0.15 mm ±0.15 mm 4 TESTS AND REQUIREMENTS Essentially all tests are carried out in accordance with the schedule of “IEC publication 60 115-8”, category LCT/UCT/56 (rated temperature range: Lower Category Temperature, Upper Category Temperature; damp heat, long term, 56 days). The testing also covers the requirements specified by EIA and EIAJ. The tests are carried out in accordance with IEC publication 60 068, “Recommended basic climatic and mechanical robustness testing procedure for electronic components” and under standard atmospheric conditions according to “IEC 60 068-1”, subclause 5.3. Unless otherwise specified the following values apply: Array chip resistors size 4 × 0603 Temperature: 15 °C to 35 °C Relative humidity: 25% to 75% Air pressure: 86 kPa to 106 kPa (860 mbar to 1 060 mbar). In Table 4 the tests and requirements are listed with reference to the relevant clauses of “IEC publications 60 115-8 and 60 068” ; a short description of the test procedure is also given. In some instances deviations from the IEC recommendations were necessary for our method of specifying. All soldering tests are performed with mildly activated flux. Table 4 Test procedures and requirements IEC 60 068-2 TEST METHOD REQUIREMENTS TEST PROCEDURE ARC241 ARV241 ARC242 ARV242 IEC 60 115-8 CLAUSE Tests in accordance with the schedule of IEC publication 60 115-8 4.4.1 4.4.2 4.5 visual examination dimensions (outline; see Fig.3) resistance gauge (mm) applied voltage (+0/−10%): 10 Ω ≤ R < 100 Ω: 0.3 V 100 Ω ≤ R < 1 k Ω: 1 V 1 kΩ ≤ R < 10 kΩ: 3 V 10 kΩ ≤ R < 100 kΩ: 10 V 100 kΩ ≤ R < 1 M Ω: 25 V R ≥ 1 M Ω: 5 0 V 4.18 20 (Tb) resistance to soldering heat component solvent resistance solderability unmounted chips; 10 ±1 s; 260 ±5 °C no visible damage ∆R/R max.: ±(0.5% +0.05 Ω) isopropyl alcohol or H2O followed by brushing in accordance with “MIL 202 F” unmounted chips completely immersed for 2 ±0.5 s in a solder bath at 235 ±2 °C no visible damage good tinning (≥95% covered); no visible damage ∆R/R max.: ±(1% +0.05 Ω) no holes; clean surface; no visible damage see Table 3 R − Rnom: max. ±5% R − Rnom: max. ±1% − R − Rnom: max. ±5% 5 ARC241/ARC242 ARV241/ARV242 4.29 4.17 45 (Xa) 20 (Ta) IEC 60 115-8 CLAUSE 4.7 4.13 4.33 IEC 60 068-2 TEST METHOD REQUIREMENTS TEST PROCEDURE ARC241 voltage proof on insulation maximum voltage (RMS) during 1 minute, metal block method ARV241 ARC242 ARV242 Array chip resistors size 4 × 0603 no breakdown or flashover ∆R/R max.: ±(1% +0.05 Ω) no visible damage ∆R/R max.: ±(1% +0.05 Ω) ∆R/R max.: ±(0.5% +0.05 Ω) no visible damage ∆R/R max.: ±(0.5% +0.05 Ω) ∆R/R max.: ±(3% +0.1 Ω) ∆R/R max.: ±(2% +0.1 Ω) ∆R/R max.: ±(2% +0.1 Ω) ≤±200 × 10−6/K ∆R/R max.: ±(1% +0.05 Ω) ∆R/R max.: ±(1% +0.05 Ω) ∆R/R max.: ±(1% +0.05 Ω) ≤±100 × 10−6/K ∆R/R max.: ±(1% +0.05 Ω) ∆R/R max.: ±(2% +0.1 Ω) ∆R/R max.: ±(2% +0.1 Ω) ∆R/R max.: ±(2% +0.1 Ω) ≤±200 × 10−6/K ∆R/R max.: ±(1% +0.05 Ω) ∆R/R max.: ±(2% +0.1 Ω) shor t time overload room temperature; P = 6.25 × Pn; 5 s (V ≤ 2 × Vmax) bending resistors mounted on a 90 mm glass epoxy resin PCB (FR4), bending: 5 mm 30 minutes at LCT and 30 minutes at UCT; 5 cycles 56 days; 40 ±2 °C; 93 +2/−3% RH; loaded with 0.01 Pn 1 000 +48/−0 hours; 70 ±2 °C; loaded with Pn or V max; 1.5 hours on and 0.5 hours off 4.19 14 (Na) rapid change of temperature damp heat (steady state) endurance 4.24.2 4.25.1 6 4.23.2 3 (Ca) 27 (Ba) endurance at upper 1 000 +48/−0 hours; no load category temperature temperature coefficient at 20/LCT/20 °C and 20/UCT/20 °C 4.8.4.2 Other tests in accordance with IEC 60 115 clauses and IEC 60 068 test method 4.17 20 (Ta) solderability (after ageing) insulation resistance noise 8 hours steam or 16 hours 155 °C; unmounted chips completely immersed for 2 ±0.5 s in a solder bath at 235 ±2 °C voltage (DC) after 1 minute, metal block method: 10 V IEC publication 60 195 (measured with Quantech-equipment): R ≤ 100 Ω 100 Ω < R ≤ 1 kΩ 1 kΩ < R ≤ 10 kΩ 10 kΩ < R ≤ 100 kΩ 100 kΩ < R ≤ 1 MΩ max. 0.316 µV/V (−10 dB) max. 1 µV/V (0 dB) max. 3 µV/V (9.54 dB) max. 6 µV/V (15.56 dB) max. 10 µV/V (20 dB) good tinning (≥95% covered); no damage Rins min.: 10 3 MΩ 4.6.1.1 4.12 ARC241/ARC242 ARV241/ARV242 IEC 60 115-8 CLAUSE IEC 60 068-2 TEST METHOD REQUIREMENTS TEST PROCEDURE ARC241 ARV241 ARC242 ARV242 Array chip resistors size 4 × 0603 Other applicable tests (JIS) C 5202 7.9 EIA 575 3.13 EIA/IS 703 4.5 endurance (under damp and load) leaching load humidity 1 000 +48/−0 hours; 40 ±2 °C; 93 +2/−3% RH; loaded with P n or V max; 1.5 hours on and 0.5 hours off unmounted chips; 60 ±1 s; 260 ±5 °C 1 000 +48/−0 hours; 85 ±2 °C; 85 ±5% RH; loaded with 0.01 Pn or V max ∆R/R max.: ±(3% +0.1 Ω) ∆R/R max.: ±(2% +0.1 Ω) good tinning; no leaching ∆R/R max.: ±(2% +0.1 Ω) 7 ARC241/ARC242 ARV241/ARV242