BQ3287AMTI

bq3287/bq3287A Real-Time Clock (RTC) Module Features ® Direct clock/calendar replacement for IBM ® AT-compatible computers and other applications ® Functionally compatible with the DS1287/DS1287A and MC146818A ® 114 bytes of general nonvolatile storage ® Integral lithium cell and crystal ® 160 ns cycle time allows fast bus operation ® Selectable Intel or Motorola bus timing ® 14 bytes for clock/calendar and control ® BCD or binary format for clock and calendar data ® Time of day in seconds, minutes, and hours ® Calendar in day of the week, day of the month, months, and years with automatic leap-year adjustment ® Programmable square wave output ® Three individually maskable interrupt event flags: bq3287A version is identical to the bq3287, with the addition of the RAM clear input. The bq3287 is a fully compatible r e a l - t i m e c l o c k f o r I B M ATcompatible computers and other app l i c a t i o n s. T h e b q 3 2 8 7 w r i t e protects the clock, calendar, and storage registers during power failure. The integral backup energy source then maintains data and operates the clock and calendar. As shipped from Benchmarq, the real time clock is turned off to maximize battery capacity for in-system operation. The bq3287 is functionally equivalent to the bq3285, except that the battery (16, 20) and crystal (2, 3) pins are not accessible. These pins are connected internally to a coin cell and quartz crystal. The coin cell is sized to provide 10 years of data retention and clock operation in the absence of power. For a complete description of features, operating conditions, electrical characteristics, bus timing, and pin descriptions, see the bq3285 data sheet. - Periodic rates from 122 µ s to 500 ms Time-of-day alarm once per second to once per day End-of-clock update cycle ® Better than one minute per month clock accuracy General Description The CMOS bq3287/bq3287A is a low-power microprocessor peripheral providing a time-of-day clock and 100-year calendar with alarm features and battery operation. O t he r f e a tu re s i n cl u d e th re e maskable interrupt sources, squarewave output, and 114 bytes of gene r al n o n volatile storage. The - 12- or 24-hour format Optional daylight saving adjustment Pin Connections MOT NC NC AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 VSS 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 VCC SQW NC NC/RCL NC INT RST DS NC R/W AS CS Pin Names AD0–AD7 Multiplexed address/data input/output Bus type select input Chip select input Address strobe input Data strobe input Read/write input Interrupt request output RST SQW NC RCL Reset input Square wave output No connect RAM clear input (bq3287A only) +5V supply Ground MOT CS AS DS R/W INT VCC VSS 24-Pin DIP Module PN328701.eps Sept. 1996 D 1 bq3287/bq3287A Absolute Maximum Ratings Symbol VCC VT TOPR TSTG TBIAS TSOLDER Note: Parameter DC voltage applied on VCC relative to VSS DC voltage applied on any pin excluding VCC relative to VSS Operating temperature Storage temperature Temperature under bias Soldering temperature Value -0.3 to 7.0 -0.3 to 7.0 0 to +70 -20 to +70 -40 to +70 -40 to +70 -10 to +70 -20 to +70 260 Unit V V °C °C °C °C °C °C °C VT ≤ VCC + 0.3 Commercial Extended “I” Commercial Extended “I” Commercial Extended “I” For 10 seconds Conditions Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to conditions beyond the operational limits for extended periods of time may affect device reliability. Recommended DC Operating Conditions (TA = TOPR) Symbol VCC VSS VIL VIH Note: Parameter Supply voltage Supply voltage Input low voltage Input high voltage Typical values indicate operation at TA = 25°C. Minimum 4.5 0 -0.3 2.2 Typical 5.0 0 Maximum 5.5 0 0.8 VCC + 0.3 Unit V V V V DC Electrical Characteristics (TA = TOPR, VCC = 5V ± 10%) Symbol ILI ILO VOH VOL ICC VSO VPFD IRCL IMOTH Note: Parameter Input leakage current Output leakage current Output high voltage Output low voltage Operating supply current Supply switch-over voltage Power-fail-detect voltage Input current when RCL = VSS Input current when MOT = VCC Minimum 2.4 4.0 Typical 7 3.0 4.17 Maximum ±1 ±1 0.4 15 4.35 185 -185 Unit µA µA V V mA V V µA µA Internal 30K pull-up (bq3287A only) Internal 30K pull-down Conditions/Notes VIN = VSS to VCC AD0–AD7, INT and SQW in high impedance IOH = -1.0 mA IOL = 4.0 mA Min. cycle, duty = 100%, IOH = 0mA, IOL = 0mA Typical values indicate operation at TA = 25°C, VCC = 5V. Sept. 1996 D 2 bq3287/bq3287A Power-Down/Power-Up Timing Symbol tF tR tCSR Parameter VCC slew from 4.5V to 0V VCC slew from 0V to 4.5V CS at VIH after power-up Data-retention and timekeeping time 300 100 20 (TA = TOPR) Typical Maximum 200 Unit µs µs ms Internal write-protection period after VCC passes VPFD on power-up. TA = 25°C. Conditions Minimum tDR Note: 10 - - years Clock accuracy is better than ± 1 minute per month at 25°C for the period of tDR. Caution: Negative undershoots below the absolute maximum rating of -0.3V in battery-backup mode may affect data integrity. Power-Down/Power-Up Timing Sept. 1996 D 3 bq3287/bq3287A 24-Pin MT (T-type module) 24-Pin MT (T-type module) Dimension A A1 B C D E e G L S Minimum 0.360 0.015 0.015 0.008 1.320 0.685 0.590 0.090 0.120 0.100 Maximum 0.375 0.022 0.013 1.335 0.700 0.620 0.110 0.130 0.120 All dimensions are in inches. Sept. 1996 D 4 bq3287/bq3287A Data Sheet Revision History Change No. 1 1 Page No. 1 2 Description Address strobe input Power-fail detect voltage VPFD Was : “As shipped from Benchmarq, the backup cell is electrically isolated from the memory. ” Is: “As shipped from Benchmarq, the backup cell is electrically isolated from the active circuitry. ” Changed temperature from N (industrial, -40 to +85°C) to I (extended, -20 to +70°C) Nature of Change Clarification Was 4.1 min, 4.25 max; is 4.0 min, 4.35 max 2 1 Clarification 2 3 Notes: 2, 4 2 Specification change IRCL max. was 275; is now 185. Pull-up = 30K IMOTH max. was -275; is now -185. Pull-down = 30K Changed values Change 1 = Nov. 1992 B changes from June 1991 A. Change 2 = Nov. 1995 C changes from Nov. 1992 B. Change 3 = Sept. 1996 D changes from Nov. 1995 C. Ordering Information bq3287 MT Temperature: blank = Commercial (0 to +70°C) I = Extended* (-20 to +70°C) Package Option: MT = T-type module RAM Clear Option: A = RAM clear on pin 21 no mark = No connect on pin 21 Device: bq3287 Real-Time Clock Module *Contact factory for availability. Sept. 1996 D 5 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device BQ3287AMT-I BQ3287AMT-SB2 BQ3287MT-I BQ3287MT-SB2 (1) Status (1) ACTIVE ACTIVE ACTIVE ACTIVE Package Type DIP MOD ULE DIP MOD ULE DIP MOD ULE DIP MOD ULE Package Drawing MT MT MT MT Pins Package Eco Plan (2) Qty 24 24 24 24 1 1 1 1 Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Lead/Ball Finish CU SN CU SN CU SN CU SN MSL Peak Temp (3) N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type N / A for Pkg Type The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 MECHANICAL DATA MPDI064 – MAY 2001 MT (R-PDIP-T**) 28 PINS SHOWN PLASTIC DUAL-IN-LINE Inches Dimension A A1 B C D/24 PIN D/28 PIN E D e G L S Min. 0.360 0.015 0.015 0.008 1.320 1.520 0.710 0.590 0.090 0.110 0.100 Max. 0.390 – 0.022 0.013 1.335 1.535 0.740 0.630 0.110 0.130 0.120 Millimeters Min. 9.14 0.38 0.38 0.20 33.53 38.61 18.03 14.99 2.29 2.79 2.54 Max. 9.91 – 0.56 0.33 33.91 38.99 18.80 16.00 2.79 3.30 3.05 E A A1 C L e S B G 4201978/A 03/01 NOTES: A. All linear dimensions are in inches (mm). B. This drawing is subject to change without notice. POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443 • • 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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