FA1101F

Product Guide Product F_1101F Series Right Angle AlInGaP SMT LED s Features • Compact, super bright AlInGaP die • Excellent for indicators and backlighting LCDs s Applications • Mobile devices (cellular telephones, PDAs, pagers) • Audio visual equipment • Telecommunications s Outline Dimensions Cathode Mark R0.8 Epoxy PCB Cathode Unit: mm Tolerances + 0.15 s Electro-Optical Characteristics Part No. Material Emitted Lens Color Color AlInGaP AlInGaP AlInGaP Red Orange Yellow Water Clear (Ta=25°C) Wavelength Peak λp TYP. Dominant λd TYP. Spectral Line Half Width ∆λ TYP. IF Luminous Intensity IV MIN. TYP. IF Forward Voltage V TYP. MAX. F Reverse Viewing Current IR Angle IF MAX. VR (2 θ 1/2) FR1101F FA1101F FY1101F 25 25 25 50 65 65 20 20 20 mA 635 609 592 626 605 590 nm 15 15 15 20 20 20 mA 1.9 1.9 1.9 V 2.4 2.4 2.4 20 20 20 mA 100 100 100 µA 5 5 5 V Deg. 140° Units mcd s Absolute Maximum Ratings Red Orange FA 81 30 100 5 -40 to +85 -40 to +100 0.43 (DC) 1.0 (Pulse) Yellow (Ta=25°C) Item Symbol Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Derating* Pd IF IFM VR Topr Tstg ∆IF FR 81 30 100 5 FY 81 30 100 5 Units mW mA mA V °C °C mA/°C * Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20. s Taping Specifications φ 1.5 +0.1 0 (2.3) 1.75 + 0.1 s Operation Current Derating Chart (DC) 4+ 0.1 (0.2) 8.0 + 0.2 Center Hole (3.35) Quantity on tape: Quantity on tape: 3000 pieces 4000 pieces per reel per reel 2+0.5 φ 21+0.8 (φ 1.1) Center Hole 4+ 0.1 2+0.05 3.5 + 0.05 (1.2) Direction to pull φ 13+0.2 +1 φ 60 -0 φ 13+0.2 FR, FA, FY 9+0.3 11.4+1 +0 φ 180 3 s Precautions Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: • Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max. • Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max. • Reflow Soldering: °C Operation Heating 240 Temperature rise: 5°C/sec. Cooling: —5°C/sec. LED Surface Temperature s Spatial Distribution 150 120 Pre-heating 2. Cleaning: • If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C. • Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. • Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PGF_1101F-0301 ~ 0 60 to 120 sec. 5 sec. max Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555 Website: www.stanley-electric.com