PDV-C173SM

PDV-C173SM Photodiode in Plastic Surface Mount Package PACKAGE DIMENSIONS INCH [mm] PACKAGE DIMENSIONS INCH [mm] .158 [4.00] .079 [2.00] CATHODE .043 [1.10] .019 [0.48] CATHODE MARK 2X .020 [0.51] .085 [2.15] .197 [5.00] 130° VIEWING ANGLE .173 [4.40] .158 [4.00] ANODE .012 [0.30] 2X .047 [1.19] .142 [3.61] CHIP DIMENSIONS INCH [mm] CHIP DIMENSIONS INCH [mm] .118 [3.00] SQUARE 2X .158 [4.00] .109 [2.77] SQUARE ACTIVE AREA SURFACE MOUNT PACKAGE SUGGESTED PAD LAYOUT FOR REFLOW SOLDERING SURFACE MOUNT PACKAGE FEATURES • • • • Surface mount Photoconductive Low cost High speed DESCRIPTION The PDV-C173SM is a blue enhanced PIN silicon photodiode ideal for high speed photoconductive or photovoltaic applications packaged in a red plastic surface mount package. APPLICATIONS • • • • Photointerrupters Oximeter sensors Barcode Glucometers ABSOLUTE MAXIMUM RATING (TA)= 23°C UNLESS OTHERWISE NOTED SYMBOL VBR TSTG TO TS PARAMETER Reverse Voltage Storage Temperature Operating Temperature Soldering Temperature* -55 -40 MIN MAX 60 +100 +80 +260 UNITS V °C °C °C Responsivity (A/W) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 250 SPECTRAL RESPONSE * 1/16 inch from case for 3 seconds max. 350 450 550 650 750 850 950 1050 1150 Wavelength (nM) ELECTRO-OPTICAL CHARACTERISTICS RATING (TA)= 23°C UNLESS OTHERWISE NOTED SYMBOL ISC ID RSH CJ lrange VBR NEP tr CHARACTERISTIC Short Circuit Current Dark Current Shunt Resistance Junction Capacitance Spectral Application Range Breakdown Voltage Noise Equivalent Power Response Time TEST CONDITIONS H = 100 fc, 2850 K VR = 10 V VR = 10 mV VR = 10 V, f = 1 MHz Spot Scan I = 10 μA VR = 10V @ l=Peak RL = 1KΩ,VR = 10 V MIN TYP 90 4 400 15 600 60 4x10-14 20 MAX 30 UNITS μA nA MW pF nm V W/ √ Hz nS 1050 **Response time of 10% to 90% is specified at 660nm wavelength light. Information in this technical datasheet is believed to be correct and reliable. However, no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change without notice. www.lasercomponents.com Issue: 08/06 / V1 / HW / api/si-pin/plastic-encap-sm/ pdv-c173sm.pdf Germany and other countries: LASER COMPONENTS GmbH, Phone: +49 8142 2864 0, Fax: +49 8142 2864 11, info@lasercomponents.com Great Britain: LASER COMPONENTS (UK) Ltd., Phone: +44 1245 491 499, Fax: +44 1245 491 801, info@lasercomponents.co.uk