SM5103-003-G

SILICON MICROSTRUCTURES INCORPORATED • HIGH SENSITIVITY, LOW-PRESSURE SILICON DIE SM5103 Low-Pressure Die DESCRIPTION The SM5103 is a silicon micro-machined, piezoresistive low pressure sensing chip. These devices are available in full-scale ranges from 0.3 to 3.0 psi and are ideal for OEM and high volume applications. Provided in die form, these sensors can be mounted on ceramic or PC board substrates as part of an OEM system. They also may be packaged into proprietary or applicationspecified sensor lines. Die are probed, inked and diced, and shipped on tape. Custom pressure ranges available in highvolume applications. FEATURES • • • • Low Pressure (from 0-0.3 to 0-3.0 PSI) High Performance at Low Pressures Constant Current or Constant Voltage Drive High Volume, Low Cost High Millivolt Output • APPLICATIONS • • • • • Air Flow Level Detection HVAC Instrumentation Gas Analysis Rev 1.2 8_02  2001-2002 Silicon Microstructures, Inc. ♦ 1701 McCarthy Blvd. ♦ Milpitas, CA 95035 USA Tel: 408-577-0100 ♦ Fax: 408-577-0123 ♦ Sales@Si-Micro.Com ♦ WWW.Si-Micro.Com SM5103 CHARACTERISTICS FOR SM5103 - SPECIFICATIONS All parameters are measured at 5.000V supply at room temperature, unless otherwise specified. Min. Excitation Voltage Excitation Current Span (FS Range) 0.3 PSI 0.8 PSI 1.5 PSI 3.0 PSI Offset TC Span TC Offset TC Resistance Linearity Bridge Impedance Proof Pressure Burst Pressure Operating Temperature Storage Temperature 0 0 25 25 25 25 -75 -24 -7 24 -0.3 2.7 10X 15X -40 -55 Typ. 5.0 1.5 50 50 50 50 0 -19 -1 27.5 +0.1 3.3 Max. 10.0 3.0 75 75 75 75 25 -15.5 +7 33 0.3 4.0 Units V mA mV mV mV mV mV %FS/100°C %FS/100°C %/100°C %FS kΩ Rated FS Rated FS °C °C Notes 1 1 2 3 3 4 5 125 150 Notes: 1. Bridge may be driven with positive or negative excitation as long as Vsub is not connected. SMI does recommend connecting the Vsub to the highest voltage in the bridge for added offset stability. 2. Measured at 5V constant voltage excitation. 3. Measured from 0 to 70 C 4. Defined as best straight line; 0.3 PSI linearity is + 0.5% FS (max). 5. Burst Pressure is the pressure where the part can survive the overpressure but may degrade over repeated cycles. 0.5 mm +Vexc1 1.0 mm Vsub 1.0 mm Sig- 0.5 mm 3.15 mm 3.4 mm Positive output for pressure applied to the top (circuit) side of the sensor Die dimensions in mm Pressure Ranges ORDERING INFORMATION: Model Number SM5103 - 003 - G Pressure range Pressure Type PSI 0.3 0.8 1.5 3.0 5103 003 008 015 030 Sig+ Sig- +Vexc 0.5 mm 0.375 mm 0.375 mm -Vexc -Vexc1 +Vexc1 Gage only. Custom ranges available in high volumes SM5103 Die (3.4X3.2 mm as sawn) Covered under USA Mask-Copyright See separate Application Notes for typical range of variation in Saw dimensions. Notice: Silicon Microstructures, Inc. reserves the right to make changes to the product contained in this publication. Silicon Microstructures, Inc. assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. While the information in this publication has been checked, no responsibility, however, is assumed for inaccuracies. Silicon Microstructures, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of a life-support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications. Rev 1.2 8_02  2001-2002 Silicon Microstructures, Inc. ♦ 1701 McCarthy Blvd. ♦ Milpitas, CA 95035 USA Tel: 408-577-0100 ♦ Fax: 408-577-0123 ♦ Sales@Si-Micro.Com ♦ WWW.Si-Micro.Com