TSF-6522

M Litton Litton Kester Solder TSF-6522 No-Clean Tacky Soldering Flux Product Description Kester formula TSF-6522 is a no-clean tacky soldering flux formula designed to be used with a rotating disc, a doctor blade, or a drum fluxer. The TSF-6522 can also be used in dot dispensing for BGA/PGA sites or in a rework application for surface mount packages. TSF-6522 maintains its activity and dispensing characteristics for up to 8 hours and can be used in a wide range of temperature and humidity conditions. Kester maintains the highest standards by manufacturing the TSF-6522 under a vacuum environment. • • • • High tack values and long tack life Leaves bright/shiny solder joints after reflow ANSI/J-STD-004 flux designator ROL0 Can reflow in air or nitrogen environments • Copper Mirror Corrosion: Low Tested to J-STD-004, IPC-TM-650, Method 2.3.32 • Corrosion Test: Low Tested to J-STD-004, IPC-TM-650, Method 2.6.15 • pH 5% Solution: 7.7 Kester Method #1W-QC-G-15 Qualitative Halide Tests: • Silver Chromate: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.33 • Fluorides by Spot Test: Pass Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1 • Typical S.I.R., IPC: Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3, (B-24 coupon) 10 Blank at 24 hours: 3.08 x 10 ohms Blank at 96 hours: 1.27 x 1010 ohms Blank at 168 hours: 8.79 x 109 ohms Physical Properties (typical) • Viscosity: 285 poise Kester Method #1W-QC-3-09 Uncleaned at 24 hours: 2.56 x 108 ohms Uncleaned at 96 hours: 4.17 x 108 ohms Uncleaned at 168 hours: 6.38 x 108 ohms • Typical S.I.R., Bellcore: Tested to TR-NWT-000078, IPC B-24 coupon 12 • Tackiness (grams-force): 100 Kester Method #1W-QC-03-04 Blank at 24 hours: 1.44 x 10 ohms Blank at 96 hours: 1.38 x 1013 ohms Uncleaned at 24 hours: 2.19 x 1013 ohms Uncleaned at 96 hours: 1.56 x 1013 ohms • Acid Number: 75.4 Kester Method #1W-QC-G-01 • Color: Yellow to Light Amber Kester Method #1W-QC-G-18 Reliability Properties (typical) KESTER SOLDER 515 East Touhy Ave. Des Plaines, IL 60018-2675 847 297 1600 847 390 9338 FAX 1-800-2-KESTER www.kester.com The data and recommendations presented are based on tests which we consider reliable. Because Kester Solder has no control over the conditions of use, we disclaim any responsibility connected with the use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the potential hazards involved and the necessity for reasonable care in their handling. BRANCHES: ANAHEIM, CA • JAMESTOWN, NY BRANTFORD, ONTARIO, CANADA • SINGAPORE • GERMANY • TAIWAN Standard Applications: • Works on flip chip, chip scale package and flip chip bumping sites assemblies as a soldering flux. • Tacky solder flux formulations are designed for pin transfer, dot dispensing and/or syringe applications. • Tacky solder flux formulations can be used as a tack and flux vehicle for soldering components to a solid solder deposit (SSD), or precision pad technology (PPT) board surfaces. • Great for rework applications on all PCB packages. • Can be used in BGA/PGA sphere/pin attachment vehicle or for repair and reballing/repinning. Application Notes Reflow Profiles: Plastic Ball Grid Array vs.Standard Kester Reflow Profile TSF-6522 No-Clean Tacky Soldering Flux Temperature (°C) 240 220 200 180 180 160 140 120 100 80 60 40 20 0 0 1.75°C/sec. 0.50°C/sec. 0.33°C/sec. 160 140 120 100 TSF-6522 No-Clean Tacky Soldering Flux Reflow Profile Standard Surface Mount Packages Temperature (°C) 240 Standard Reflow Profile BGA Reflow Profile Peak Temp. 210°C max. 220 200 . . . . . . . . . . . . . . . 1.3 - 1.6°C/Sec Peak Temp. 210 - 235°C . . . . . Primary Pre-heat Zone (45-55sec.) 30 60 Secondary Pre-heat Zone (60-75 sec.) 80 Soak Zone (~120 sec.) Reflow Zone (45-60 sec.) 60 40 20 ......... . Soaking Zone . . ( 2.0 min. max. ) ~ 60 - 90 sec. ideal .