EiceDRIVER™ SIL
High Voltage IGBT Driver for Automotive Applications
1EDI2002AS
Single Channel Isolated Driver for Inverter Systems
AD Step
Datasheet
Hardware Description
Rev. 3.1, 2015-07-30
ATV HP EDT
Edition 2015-07-30
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2015 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
EiceDRIVER™ SIL
1EDI2002AS
Revision History
Page or Item
Subjects (major changes since previous revision)
Rev 2.2, 2014-07-25
Page 29
Added note: “the contents of a frame...”
Page 29
Added note: “in case of permanent...”
Page 44
Added note: “the Pulse suppressor...”
Page 51
Corrected Table 2-14
Page 54
Updated Chapter 2.4.10.1.17
Page 55
Updated Chapter 2.4.10.1.19 .
Page 83
Update PID value.
Page 86
Updated reset value of register PSTAT2.
Page 102
Update SID value.
Page 103
Correct SSTAT definition of bits 15 and 14 to rh.
Page 117
Updated definition of bit field DSATBT.
Page 118
Updated definition of bit field OCPBT.
Page 127
Updated Table 5-1
Page 129
Updated Figure 5-1
Page 130
Corrected Table 5-2
Page 131
Updated footnote 2) in Table 5-3.
Page 131
Updated value Rthjcbot in Table 5-4
Page 132
Updated parameters VUVLO2 and VOVLO2 in Table 5-5.
Page 133
Updated parameter fclk1 in Table 5-6
Page 134
Updated parameters RPDIN1 and IINPR1 in Table 5-7
Page 136
Updated parameters RPDIN2 and RPDIO2 and updated parameter RPDOSD2 in Table 5-13
Page 138
Updated parameters VGPON0, VGPON1 VGPON2, tPDISTO, VGPOF15 in Table 5-17
Page 140
Updated parameters RPUDESAT2, VDESAT0, VDESAT1, VDESAT2 in Table 5-18
Page 140
Updated parameter RPUOCP2 in Table 5-19
Page 143
Updated parameter tDEAD , tOFFDESAT2 in Table 5-23
Page 144
Updated parameter tFSCLK, removed parameter tSCLKp Table 5-24
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,
CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™,
EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™,
ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™,
PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™,
SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
Datasheet
Hardware Description
3
Rev. 3.1, 2015-07-30
EiceDRIVER™ SIL
1EDI2002AS
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™
of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,
OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.
RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.
SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden
Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.
UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™
of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of
Diodes Zetex Limited.
Last Trademarks Update 2011-02-24
Datasheet
Hardware Description
4
Rev. 3.1, 2015-07-30
EiceDRIVER™ SIL
1EDI2002AS
Table of Contents
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1
1.1
1.2
1.3
Product Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Feature Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Target Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
11
11
12
2
2.1
2.2
2.2.1
2.2.2
2.2.2.1
2.2.2.2
2.2.2.3
2.3
2.4
2.4.1
2.4.2
2.4.3
2.4.4
2.4.4.1
2.4.4.2
2.4.4.3
2.4.4.4
2.4.4.4.1
2.4.4.4.2
2.4.4.5
2.4.4.5.1
2.4.4.5.2
2.4.4.5.3
2.4.4.5.4
2.4.4.5.5
2.4.4.5.6
2.4.4.5.7
2.4.4.5.8
2.4.4.5.9
2.4.5
2.4.5.1
2.4.5.2
2.4.5.2.1
2.4.5.2.2
2.4.5.2.3
2.4.5.3
2.4.5.4
2.4.5.5
2.4.5.6
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Configuration and Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Primary Side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Secondary Side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pull Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clock Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PWM Input Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI Data Integrity Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parity Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Protocol Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Command Catalog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Word Convention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ENTER_CMODE Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ENTER_VMODE Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
EXIT_CMODE Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NOP Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
READ Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
WRITEH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
WRITEL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Events and State Transitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Emergency Turn-Off Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ready, Disabled, Enabled and Active State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operation Modes Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Activating the device after reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Activating the device after an Event Class A or B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Debug Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13
13
14
14
16
16
17
18
20
21
21
21
22
24
24
25
27
29
29
29
30
30
30
31
31
31
32
32
32
33
34
34
35
35
36
36
37
38
38
39
Datasheet
Hardware Description
5
Rev. 3.1, 2015-07-30
EiceDRIVER™ SIL
1EDI2002AS
Table of Contents
2.4.6
Driver Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.6.1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.6.2
Switching Sequence Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.6.3
Disabling the output stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.6.4
Passive Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.7
Fault Notifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.8
EN Signal Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.9
Reset Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10
Operation in Configuration Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1
Static Configuration Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.1
Configuration of the SPI Parity Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.2
Configuration of NFLTA Activation in case of Tristate Event . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.3
Configuration of the STP Minimum Dead Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.4
Configuration of the EN/FEN Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.5
Configuration of the Digital Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.6
Configuration of DOUT Signal Activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.7
Configuration of the VBE Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.8
Deactivation of Output Stage Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.9
Deactivation of Events Class A due to pin OSD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.10
Clamping of DESAT pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.11
Activation of the Pulse Suppressor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.12
Configuration of the Verification Mode Time Out Duration . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.13
DESAT Threshold Level Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.14
Configuration of the TTON Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.15
Configuration of DACLP Activation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.16
OVLO3 Operation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.17
Configuration of the TTOFF Delays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.18
Configuration of the Safe TTOFF Plateau Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.19
Configuration of the DESAT Blanking Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.20
Configuration of the OCP Blanking Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.1.21
Configuration of DACLP Activation Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.2
Dynamic Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.10.3
Delay Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.11
Low Latency Digital Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
40
40
45
47
47
48
49
49
52
52
52
52
52
53
53
53
53
53
53
53
54
54
54
54
54
54
54
55
55
55
55
55
56
57
3
3.1
3.2
3.2.1
3.2.2
3.2.3
3.2.4
3.3
3.3.1
3.3.2
3.3.2.1
3.3.2.2
3.3.2.3
3.4
3.4.1
3.4.2
3.4.3
58
58
60
60
62
64
65
66
66
67
68
68
68
69
69
70
71
Protection and Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supervision Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Protection Functions: Category A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Desaturation Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Overcurrent Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Stage Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Protection Functions: Category B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supply Voltage Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Supervision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lifesign watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Oscillator Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Supervision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Protection Functions: Category C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Shoot Through Protection function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Gate Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Temperature Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Table of Contents
3.4.4
3.4.5
3.4.6
3.5
3.5.1
3.5.2
3.5.3
3.5.4
3.5.5
3.5.6
3.5.7
3.5.8
3.5.9
3.5.10
SPI Error Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Active Short Circuit Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
IGBT State Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Protection Functions: Category D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operation in Verification Mode and Weak Active Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Weak Turn On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DESAT Supervision Level 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DESAT Supervision Level 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DESAT Supervision Level 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP Supervision Level 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP Supervision Level 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supply Monitoring Supervision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Clock Supervision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DIO Supervision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4
4.1
4.2
4.3
Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Primary Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Secondary Registers Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Read / Write Address Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
5
5.1
5.2
5.3
5.4
5.5
5.5.1
5.5.2
5.5.3
5.5.4
5.5.5
5.5.6
5.5.7
5.5.8
5.5.9
5.5.10
5.5.11
5.5.12
5.5.13
Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Primary I/O Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Secondary I/O Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Desaturation Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Overcurrent Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Low Latency Digital Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Over temperature Warning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Error Detection Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Insulation Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
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7
71
72
73
74
74
74
76
76
77
77
78
78
79
79
127
127
130
131
131
132
132
133
134
136
138
140
140
141
141
142
143
144
145
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List of Figures
List of Figures
Figure 2-1
Figure 2-2
Figure 2-3
Figure 2-4
Figure 2-5
Figure 2-6
Figure 2-7
Figure 2-8
Figure 2-9
Figure 2-10
Figure 2-11
Figure 2-12
Figure 2-13
Figure 2-14
Figure 2-15
Figure 2-16
Figure 2-17
Figure 2-18
Figure 3-1
Figure 3-2
Figure 3-3
Figure 3-4
Figure 3-5
Figure 3-6
Figure 3-7
Figure 3-8
Figure 3-9
Figure 5-1
Figure 5-2
Figure 6-1
Figure 6-2
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
PWM Input Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
STP: Inhibition Time Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
STP: Example of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
SPI Regular Bus Topology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
SPI Daisy Chain Bus Topology. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Response Answer Principle - Daisy Chain Topology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Response Answer Principle - Regular Topology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
SPI Commands Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Operating Modes State Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Output Stage Diagram of Principle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
TTOFF: Principle of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
TTON: Principle of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
TTOFF: pulse suppressor aborting a turn-on sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Idealized Switching Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Output Stage Disable: Principle of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Low Latency Digital Channel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
DESAT Function: Diagram of Principle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
DESAT Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
DESAT Operation with DESAT clamping enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
OCP Function: Principle of Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Power Supply Supervision Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Shoot Through Protection: Principle of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Gate Monitoring Function: Timing Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
ASC Strategy Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Idealized Weak Turn-On Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Typical Application Example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
SPI Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
Recommended Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146
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Hardware Description
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List of Tables
List of Tables
Table 2-1
Table 2-2
Table 2-3
Table 2-4
Table 2-5
Table 2-6
Table 2-7
Table 2-8
Table 2-9
Table 2-10
Table 2-11
Table 2-12
Table 2-13
Table 2-14
Table 2-15
Table 3-1
Table 3-2
Table 3-3
Table 3-4
Table 3-5
Table 3-6
Table 3-7
Table 3-8
Table 3-9
Table 3-10
Table 3-11
Table 3-12
Table 3-13
Table 3-14
Table 3-15
Table 3-16
Table 3-17
Table 3-18
Table 3-19
Table 3-20
Table 3-21
Table 4-1
Table 4-2
Table 4-3
Table 4-4
Table 5-1
Table 5-2
Table 5-3
Table 5-4
Table 5-5
Table 5-6
Table 5-7
Table 5-8
Table 5-9
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Internal pull devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SPI Command Catalog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Word Convention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
ENTER_CMODE request and answer messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
ENTER_VMODE request and answer messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
EXIT_CMODE request and answer messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
NOP request and answer messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
READ request and answer messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
WRITEH request and answer messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
WRITEL request and answer messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Failure Notification Clearing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Reset Events Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Pin behavior (primary side) in case of reset condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Pin behavior (secondary side) in case of reset condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Safety Related Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
DESAT Protection Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
OCP Function Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
External Enable Function Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Output Stage Monitoring Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Power Supply Voltage Monitoring Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
System Supervision Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
STP Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Gate Monitoring Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Temperature Monitoring Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
SPI Error Detection Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Active Short Circuit Support Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
IGBT State Monitoring Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
DESAT Supervision Level 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
DESAT Supervision Level 2 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
DESAT Supervision Level 3 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
OCP Supervision Level 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
OCP Supervision Level 3 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Power Supply Monitoring Supervision Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Primary Clock Supervision Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
DIO Supervision Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Register Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Bit Access Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Read Access Validity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Write Access Validity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Component Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
Power Supplies Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
Internal Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
Electrical Characteristics for Pins: INP, INSTP, EN/FEN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134
Electrical Characteristics for Pins: NRST/RDY, SCLK, SDI, NCS, DIO1 (input) . . . . . . . . . . . . . 134
Electrical Characteristics for Pins: SDO, DOUT, DIO1 (output) . . . . . . . . . . . . . . . . . . . . . . . . . 135
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Hardware Description
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1EDI2002AS
List of Tables
Table 5-10
Table 5-11
Table 5-12
Table 5-13
Table 5-14
Table 5-15
Table 5-16
Table 5-17
Table 5-18
Table 5-19
Table 5-20
Table 5-21
Table 5-22
Table 5-23
Table 5-24
Table 5-25
Table 5-26
Electrical Characteristics for Pins: NFLTA, NFLTB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics for Pins: GATE, DESAT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics for Pins: TON, TOFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics for Pins: OSD, DEBUG, DIO2 (input) . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics for Pin: NUV2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics for Pins: DACLP, DIO2 (output) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics for Pin: VREG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DESAT characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OCP characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital channel characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Data Out characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Over temperature Warning Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Error Detection Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPI Interface Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Isolation Characteristics referring to DIN EN 60747-5-2 (VDE 0884 - 2):2003-01 . . . . . . . . . . . .
Isolation Characteristics referring to UL 1577. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Hardware Description
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1
Product Definition
1.1
Overview
The 1EDI2002AS is a high-voltage IGBT gate driver designed for
automotive motor drives above 5 kW. The 1EDI2002AS is based on
Infineon’s Coreless Transformer (CLT) technology, providing galvanic
insulation between low voltage and high voltage domains. The device has
been designed to support 400 V, 600 V and 1200 V IGBT technologies.
The 1EDI2002AS can be connected on the low voltage side (“primary”
side) to 5 V logic. A standard SPI interface allows the logic to configure
and to control the advanced functions implemented in the driver.
On the high voltage side (“secondary” side), the 1EDI2002AS is dimensioned to drive an external booster stage.
Short propagation delays and controlled internal tolerances lead to minimal distortion of the PWM signal.
A large panel of safety-related functions has been implemented in the 1EDI2002AS, in order to support functional
safety requirements at system level (as per ISO 26262). Besides, those integrated features ease the
implementation of Active Short Circuit (ASC) strategies.
The 1EDI2002AS can be used optimally with Infineon’s 1EBN100XAE “EiceDRIVER™ Boost” booster stage
family.
1.2
Feature Overview
The following features are supported by the 1EDI2002AS:
Functional Features
•
•
•
•
•
•
•
•
•
•
•
Single Channel IGBT Driver.
On-chip galvanic insulation (up to 6kV).
Support of 600 V and 1200 V IGBT technologies.
Low propagation delay and minimal PWM distortion.
Support of 5 V logic levels (primary side).
16-bit Standard SPI interface (up to 2 MBaud) with daisy chain support (primary side).
Enable input pin (primary side).
Pseudo-differential inputs for critical signals (primary side).
Power-On Reset pin (primary side).
Debug mode.
Pulse Suppressor.
Product Name
Ordering Code
Package
1EDI2002AS
SP001362894
PG-DSO-36
Datasheet
Hardware Description
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1EDI2002AS
Product Definition
•
•
•
•
•
•
Fully Programmable Active Clamping Inhibit signal (secondary side).
Fully programmable Two-Level Turn On (TTON).
Low latency digital channel.
Optimal support of EiceBoost functions.
36-pin PG-DSO-36 green package.
Automotive qualified (as per AEC Q100).
Safety Relevant Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Programmable Desaturation monitoring.
Overcurrent protection.
Fully programmable Two-Level Turn-Off.
Automatic Emergency Turn-Off in failure case.
Automatic or externally triggered disabling of the output stage (tristate).
Under- and over-voltage supervision of all the power supplies (both primary and secondary sides).
NFLTA and NFLTB notification pins for fast system response time (primary side).
Safe internal state machine.
Weak Turn-On functionality.
Internal overtemperature sensor (secondary side).
Internal clock monitoring.
Gate signal monitoring.
IGBT state monitoring.
Individual error and status flags readable via SPI.
Support for Active Short Circuit strategies.
Full diagnosticability.
In-application testability of safety critical functions.
Suitable for systems up to ASIL D requirements (as per ISO 26262).
1.3
•
•
•
Target Applications
Inverters for automotive Hybrid Electric Vehicles (HEV) and Electric Vehicles (EV).
High Voltage DC/DC converter.
Industrial Drive.
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Hardware Description
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1EDI2002AS
Functional Description
2
Functional Description
2.1
Introduction
The 1EDI2002AS is an advanced single channel IGBT driver that can also be used for driving power MOS devices.
The device has been developed in order to optimize the design of high performance safety relevant automotive
systems.
The device is based on Infineon’s Coreless Transformer Technology and consist of two chips separated by a
galvanic isolation. The low voltage (primary) side can be connected to a standard 5 V logic. The high voltage
(secondary) side is in the DC-link voltage domain.
Internally, the data transfers are ensured by two independent communication channels. One channel is dedicated
to transferring the ON and OFF information of the PWM input signal only. This channel is unidirectional (from
primary to secondary). Because this channel is dedicated to the PWM information, latency time and PWM
distortion are minimized. The second channel is bidirectional and is used for all the other data transfers (e.g. status
information, etc).
The 1EDI2002AS supports advanced functions in order to optimize the switching behavior of the IGBT.
Furthermore, it supports several monitoring and protection functions, making it suitable for systems having to fulfill
ASIL requirements (as per ISO 26262).
Datasheet
Hardware Description
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1EDI2002AS
Functional Description
2.2
Pin Configuration and Functionality
2.2.1
Pin Configuration
1
VEE2
GND1
36
2
TON
IREF1
35
3
VCC2
VCC1
34
4
TOFF
INSTP
33
5
DESAT
INP
32
6
GATE
REF0
31
7
GND2
EN/FEN
30
8
IREF2
NRST /RDY
29
9
VEE2
GND1
28
10
VREG
NFLTA
27
11
OCP
NFLTB
26
12
OCPG
DOUT
25
13
DEBUG
SDO
24
14
DACLP
NCS
23
15
OSD
SDI
22
16
DIO2
SCLK
21
17
NUV2
DIO1
20
18
VEE2
GND1
19
Figure 2-1 Pin Configuration
Table 2-1
Pin Configuration
Pin
Number
Symbol
I/O
Voltage Class
Function
1,9,18
VEE2
Supply
Supply
Negative Power Supply1).
2
TON
Output
15V Secondary Turn-On Output.
3
VCC2
Supply
Supply
4
TOFF
Output
15V Secondary Turn-Off Output.
5
DESAT
Input
15V Secondary Desaturation Protection Input.
6
GATE
Input
15V Secondary Gate Monitoring Input.
7
GND2
Ground
Ground
Ground.
8
IREF2
Input
5V Secondary
External Reference Input.
10
VREG
Output
5V Secondary
Reference Output Voltage.
11
OCP
Input
5V Secondary
Over Current Protection.
12
OCPG
Ground
Ground
Ground for the OCP function,
13
DEBUG
Input
5V Secondary
Debug Input.
Datasheet
Hardware Description
Positive Power Supply.
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1EDI2002AS
Functional Description
Table 2-1
Pin Configuration (cont’d)
Pin
Number
Symbol
I/O
Voltage Class
Function
14
DACLP
Output
5V Secondary
Active Clamping Disable Output.
15
OSD
Input
5V Secondary
Output Stage Disable Input.
16
DIO2
Input / Output
5V Secondary
Digital I/O.
17
NUV2
Output
5V Secondary
VCC2 not valid notification output.
19, 28, 36 GND1
Ground
Ground
Ground2).
20
DIO1
Input / Output
5V Primary
Digital I/O.
21
SCLK
Input
5V Primary
SPI Serial Clock Input.
22
SDI
Input
5V Primary
SPI Serial Data Input.
23
NCS
Input
5V Primary
SPI Chip Select Input (low active).
24
SDO
Output
5V Primary
SPI Serial Data Output.
25
DOUT
Output
5V Primary
DESAT comparator output.
26
NFLTB
Output
5V Primary
Fault B Output (low active, open drain).
27
NFLTA
Output
5V Primary
Fault A Output (low active, open drain).
29
NRST/RDY
Input/Output
5V Primary
Reset Input (low active, open drain). This signal
notifies that the device is “ready”.
30
EN/FEN
Input
5V Primary
Enable Input.
31
REF0
Ref. Ground
Ground
Reference Ground for signals INP, INSTP,
EN/FEN.
32
INP
Input
5V Primary
Positive PWM Input.
33
INSTP
Input
5V Primary
Monitoring PWM Input.
34
VCC1
Supply Input
Supply
Positive Power Supply.
IREF1
Input
5V Primary
External Reference Input.
35
1)
2)
All VEE2 pins must be connected together.
All GND1 pins must be connected together.
Datasheet
Hardware Description
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1EDI2002AS
Functional Description
2.2.2
Pin Functionality
2.2.2.1
Primary Side
GND1
Ground connection for the primary side.
VCC1
5V power supply for the primary side (referring to GND1).
INP
Non-inverting PWM input of the driver. The internal structure of the pad makes the IC robust against glitches. An
internal weak pull-down resistor to VREF0 drives this input to Low state in case the pin is floating.
INSTP
Monitoring PWM input for shoot through protection. The internal structure of the pad makes the IC robust against
glitches. An internal weak pull-down resistor to VREF0 drives this input to Low state in case the pin is floating.
REF0
Reference Ground signal for the signals INP, INSTP, EN/FEN. This pin should be connected to the ground signal
of the logic issuing those signals.
EN/FEN
Enable Input Signal. This signal allows the logic on the primary side to turn-off and deactivate the device. An
internal weak pull-down resistor to VREF0 drives this input to Low state in case the pin is floating. This pin reacts
on logic levelsor on a periodic signal, depending on the device’s configuration.
NFLTA
Open-Drain Output signal used to report major failure events (Event Class A). In case of an error event, NFLTA
is driven to Low state. This pin shall be connected externally to VCC1 with a pull-up resistance.
NFLTB
Open-Drain Output signal used to report major failure events (Event Class B). In case of an error event, NFLTB
is driven to Low state. This pin shall be connected externally to VCC1 with a pull-up resistance.
SCLK
Serial Clock Input for the SPI interface. An internal weak pull-up device to VCC1 drives this input to high state in
case the pin is floating.
SDO
Serial Data Output (push-pull) or the SPI interface.
SDI
Serial Data Input for the SPI interface. An internal weak pull-up device to VCC1 drives this input to high state in case
the pin is floating.
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Hardware Description
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1EDI2002AS
Functional Description
NCS
Chip Select input for the SPI interface. This signal is low active. An internal weak pull-up device to VCC1 drives this
input to High state in case the pin is floating.
IREF1
Reference input of the primary chip. This pin shall be connected to VGND1 via an external resistor.
NRST/RDY
Open drain reset input. This signal is low-active. When a valid signal is received on this pin, the device is brought
in its default state. This signal is also used as a “ready notification”. A high level on this pin indicates that the
primary chip is functional.
DOUT
Enhanced DESAT functionality comparator status output. This signal allows real-time monitoring of the IGBT
state.
DIO1
I/O for the digital channel. Depending of the chosen configuration of the device, this pin can be an input or an
output (push-pull). An internal weak pull-down resistor to VGND1 drives this input to Low state in case the pin is
floating.
2.2.2.2
Secondary Side
VEE2
Negative power supply for the secondary side, referring to VGND2.
VCC2
Positive power supply for the secondary side, referring to VGND2.
GND2
Reference ground for the secondary side.
DESAT
Desaturation Protection input pin. The function associated with this pin monitors the VCE voltage of the IGBT. The
detection threshold is programmable. An internal pull-up resistor to VCC2 drives this signal to High level in case it
is floating.
OCP
Over Current Protection input pin. The function associated with this pin monitors the voltage across a sensing
resistance located on the auxiliary path of a Current Sense IGBT. An internal weak pull-up resistor to the internal
5V reference drives this input to High state in case the pin is floating.
OCPG
Over Current Protection Ground.
Datasheet
Hardware Description
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Functional Description
TON
Output pin for turning on the IGBT.
TOFF
Output pin for turning off the IGBT.
GATE
Input pin used to monitor the IGBT gate voltage.
OSD
Output Stage Disable input. A High Level on this pin tristates the output stage. An internal weak pull-down resistor
to VGND2 drives this input to Low state in case the pin is floating.
DACLP
Output pin used to disable the active clamping function of the booster.
DEBUG
Debug input pin. This pin is latched at power-up. When a High level is detected on this pin, the device enters a
special mode where it can be operated without SPI interface. This feature is for development purpose only. This
pin should normally be tied to VGND2. An internal weak pull-down resistor to VGND2 drives this input to Low state in
case the pin is floating.
IREF2
Reference input of the secondary chip. This pin shall be connected to VGND2 via an external resistor.
VREG
Reference Output voltage. This pin shall be connected to an external capacitance to VGND2.
NUV2
VCC2 not valid notification signal (Open Drain). This signal drives a low level when VCC2 is not valid or when the
internal 5V digital supply is not valid. When both supplies are valid, this pin is in high impedance state. This pin
shall be connected externally to a 5V reference with a pull-up resistance.
DIO2
I/O for the digital channel. Depending of the chosen configuration of the device, this pin can be an input or an
output (push-pull). An internal weak pull-down resistor to VGND2 drives this input to Low state in case the pin is
floating.
2.2.2.3
Pull Devices
Some of the pins are connected internally to pull-up or pull-down devices. This is summarized in Table 2-2.
Table 2-2
Internal pull devices
Signal
Device
INP
Weak pull down to VREF0
INSTP
Weak pull down to VREF0
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Hardware Description
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1EDI2002AS
Functional Description
Table 2-2
Internal pull devices
Signal
Device
EN/FEN
Weak pull down to VREF0
SCLK
Weak pull up to VCC1
SDI
Weak pull up to VCC1
NCS
Weak pull up to VCC1
DIO1
Weak pull down to VGND1
DESAT
Weak pull up to VCC2
DIO2
Weak pull down to VGND2
OSD
Weak pull down to VGND2
OCP
Weak pull up to 5V internal reference
DEBUG
Weak pull down to VGND2
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Hardware Description
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1EDI2002AS
Functional Description
2.3
Block Diagram
IREF1
OSC 1
WDG
WDG
OSC2
IREF2
Vcc1
GND2
P-Supply
Vee2
GND1
INP
EN/FEN
INSTP
P-Supply
Vcc2
NUV2
PWM
Input
Stage
VREG
Start-Stop
Osc
REF0
OSD
NCS
TON
SDI
SPI
Interface
SDO
Secondary
Primary
Output
Stage
Switching
Control
GATE
TOFF
Logic
Logic
SCLK
DACLP
NFLTA
OCP
OCP
NFLTB
OCPG
NRST/RDY
DESAT
DOUT
DESAT
DEBUG
DIO1
DIO2
T sensor
Figure 2-2 Block Diagram
Datasheet
Hardware Description
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1EDI2002AS
Functional Description
2.4
Functional Block Description
2.4.1
Power Supplies
On the primary side, the 1EDI2002AS needs a single 5 Vsupply source VCC1 for proper operation. This makes the
device compatible to most of the microcontrollers available for automotive applications.
On the secondary side, the 1EDI2002AS needs two power supplies for proper operation.
•
•
The positive power supply VCC2 is typically set to 15 V (referring to VGND2).
The negative supply VEE2 is typically set to -8 V (referring to VGND2).
Under- and over-voltage monitoring is performed continuously during operation of the device (see Chapter 3.3.1).
A 5V supply for the digital domain on the secondary side is generated internally (present at pin VREG).
2.4.2
Clock Domains
The clock system of the 1EDI2002AS is based on three oscillators defining each a clock domain:
•
•
•
One RC oscillator (OSC1) for the primary chip.
One RC oscillator (OSC2) for the secondary chip excepting the output stage.
One Start-Stop oscillator (SSOSC2) for the output stage on the secondary side.
The two RC oscillators are running constantly. They are also monitored constantly, and large deviations from the
nominal frequency are identified as a system failure (Event Class B, see Chapter 3.3.2.2).
The Start Stop oscillator is controlled by the PWM command.
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Hardware Description
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Functional Description
2.4.3
PWM Input Stage
The PWM input stage generates from the external signals INP, INSTP and EN/FEN the turn-on and turn-off
commands to the secondary side. The general structure of the PWM input block is shown Figure 2-3.
VCC1
EN
inhibit_act.
en_valid
LO GIC
Inhibit Time
Generation
INSTP
Validity
Check
INP
pwm_cmd
REF0
Figure 2-3 PWM Input Stage
Signals INP, INSTP and EN/FEN are pseudo-differential, in the sense that they are not referenced to the common
ground GND1 but to signal REF0. This is intended to make the device more robust against ground bouncing
effects.
Note: Glitches shorter than tINPR1occurring at signal INP are filtered internally.
Note: Pulses at INP below tINPPD might be distorted or suppressed.
The 1EDI2002AS supports non-inverted PWM signals only. When a High level on pin INP is detected while signals
INSTP and EN/FEN are valid, a turn-on command is issued to the secondary chip. A Low level at pin INP issues
a turn-off command to the secondary chip.
Signal EN/FEN can inhibit turn-on commands received at pin INP. A valid signal EN/FEN is required in order to
have turn-on commands issued to the secondary chip. If an invalid signal is provided, the PWM input stage issues
constantly turn-off commands to the secondary chip. The functionality of signal EN/FEN is detailed in
Chapter 2.4.8.
Note: After an invalid-to valid-transition of signal EN/FEN, a minimum delay of tINPEN should be inserted before
turning INP on.
As shown in Figure 2-4, signal INSTP provides a Shoot-Through Protection (STP) to the system. When signal at
pin INSTP is at High level, the internal signal inhibit_act is activated. The inhibition time is defined as the pulse
duration of signal inhibit_act. It corresponds to the pulse duration of signal INSTP to which a minimum dead time
is added. During the inhibition time, rising edges of signal INP are inhibited. Bit PSTAT2.STP is set for the duration
of the inhibition time.
The deadtime is programmable with bit field PCFG2.STPDEL.
Datasheet
Hardware Description
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1EDI2002AS
Functional Description
INSTP
dead time
inhibit_act
INP
Inhibition time
pwm_cmd
Figure 2-4 STP: Inhibition Time Definition
It shall be noted that during the inhibition time, signal pwm_cmd is not forced to Low. It means that if the device is
already turned-on when INSTP is High, it stays turned-on until the signal at pin INP goes Low. This is depicted in
Figure 2-5.
INSTP
dead time
inhibit_act
Inhibited
edge
INP
pwm_cmd
Inhibition time
Figure 2-5 STP: Example of Operation
When a condition occurs where a rising edge of signal INP is inhibited, an error notification is issued. See
Chapter 3.4.1 for more details.
Datasheet
Hardware Description
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1EDI2002AS
Functional Description
2.4.4
SPI Interface
This chapter describes the functionality of the SPI block.
2.4.4.1
Overview
The standard SPI interface implemented on the 1EDI2002AS is compatible with most of the microcontrollers
available for automotive and industrial applications. The following features are supported by the SPI interface:
•
•
•
•
•
•
Full-duplex bidirectional communication link.
SPI Slave mode (only).
16-bit frame format.
Daisy chain capability.
MSB first.
Parity Check (optional) and Parity Bit generation (LSB).
The SPI interface of the 1EDI2002AS provides a standardized bidirectional communication interface to the main
microcontroller. From the architectural point of view, it fulfills the following functions:
•
•
•
•
Initialization of the device.
Configuration of the device (static and runtime).
Reading of the status of the device (static and runtime).
Operation of the verification modes of the device.
The purpose of the SPI interface is to exchange data which have relaxed timing constraints compared to the PWM
signals (from the point of view of the motor control algorithm). The IGBT switching behavior is for example
controlled directly by the PWM input. Similarly, critical application failures requiring fast reaction are notified on the
primary side via the feedback signals NFLTA, NFLTB and NRST/RDY.
In order to minimize the complexity of the end-application and to optimize the microcontroller’s resources, the
implemented interface has daisy chain capability. Several (typically 6) 1EDI2002AS devices can be combined into
a single SPI bus.
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2.4.4.2
General Operation
The SPI interface of the 1EDI2002AS supports full duplex operation. The interface relies on four communication
signals:
•
•
•
•
NCS: (Not) Chip Select.
SCLK: Serial Clock.
SDI: Serial Data In.
SDO: Serial Data Out.
The SPI interface of the 1EDI2002AS supports slave operation only. An SPI master (typically, the main
microcontroller) is connected to one or several 1EDI2002AS devices, forming an SPI bus. Several bus topologies
are supported.
A regular SPI bus topology can be used where each of the slaves is controlled by an individual chip select signal
(Figure 2-6). In this case, the number of slaves on the bus is only limited by the application’s constraints.
SCLK
Master
SCLK
SDO
SDI
SDI
SDO
NCS1
NCS
Slave 1
NCS2
SCLK
...
SDI
NCSn
Slave 2
...
SDO
NCS
...
...
...
SCLK
SDI
Slave n
SDO
NCS
Figure 2-6 SPI Regular Bus Topology
In order to simplify the layout of the PCB and to reduce the number of pins used on the microcontroller’s side, a
daisy chain topology can also be used. The chain’s depth is not limited by the 1EDI2002AS itself. A possible
topology is shown Figure 2-7.
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SCLK
Master
SCLK
SDO
SDI
SDI
SDO
NCS
NCS
Slave 1
SCLK
SDI
Slave 2
...
SDO
NCS
...
...
SCLK
...
SDI
Slave n
SDO
NCS
Figure 2-7 SPI Daisy Chain Bus Topology
Physical Layer
The SPI interface relies on two shift registers:
•
•
A shift output register, reacting on the rising edges of SCLK.
A shift input register, reacting on the falling edges of SCLK.
When signal NCS is inactive, the signals at pins SCLK and SDI are ignored. The output SDO is in tristate.
When NCS is activated, the shift output register is updated internally with the value requested by the previous SPI
access.
At each rising edge of the SCLK signal (while NCS is active), the shift output register is serially shifted out by one
bit on the SDO pin (MSB first). At each falling edge of the clock pulse, the data bit available at the input SDI is
latched and serially shifted into the shift input register.
At the deactivation of NCS, the SPI logic checks how many rising and falling edges of the SCLK signal have been
received. In case both counts differ and / or are not a multiple of 16, an SPI Error is generated. The SPI block then
checks the validity of the received 16-bit word. In case of a non valid data, an SPI error is generated. In case no
error is detected, the data is decoded by the internal logic.
The NCS signal is active low.
Input Debouncing Filters
The input stages of signals SDI, SCLK, and NCS include each a Debouncing Filter. The input signals are that way
filtered from glitches and noise.
The input signals SDI and SCLK are analyzed at each edge of the internal clock derived from OSC1. If the same
external signal value is sampled three times consecutively, the signal is considered as valid and is processed by
the SPI logic. Otherwise, the transition is considered as a glitch and is discarded.
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The input signal NCS is sampled at a rate corresponding to the period of the internal clock derived from OSC1. If
the same external signal value is sampled two times consecutively, the signal is considered as valid and is
processed by the SPI logic. Otherwise, the transition is considered as a glitch and is discarded.
2.4.4.3
Definitions
Command
A command is a high-level command issued by the SPI master which aims at generating a specific reaction in the
addressed slave. The command is physically translated into a Request Message by the SPI master. The correct
reception of the Request Message by the SPI slave leads to a specific action inside the slave and to the emission
of an Answer Message by the slave.
Example: the READ command leads to the transfer of the value of the specified register from the device to the SPI
master.
Word
A word is a 16-bit sequence of shifted data bits.
Transfer
A transfer is defined as the SPI data transfers (in both directions) occurring between a falling edge of NCS and
the next consecutive rising edge of NCS.
Request Message
A request message is a word issued by the SPI master and addressing a single slave. A request message relates
to a specific command.
Answer Message
An answer message is a well-defined word issued by a single SPI slave as a response to a request message.
Transmit Frame
A transmit frame is a sequence of one or several words sent by the SPI Master within one SPI transfer. In regular
SPI topologies, a transmit frame is in practice identical to a data word. In daisy chain topologies, a transmit frame
is a sequence of data words belonging to different request messages.
Receive Frame
A receive frame is a sequence of one or several words received by the SPI Master within one SPI transfer. In
regular SPI topologies, a receive frame is in practice identical to a data word. In daisy chain topologies, a receive
frame is a sequence of data words belonging to different Answer Messages.
The SPI protocol supported by the 1EDI2002AS is based on the Request / Answer principle. The master sends a
defined request message to which the slave answers with the corresponding answer message (Figure 2-8,
Figure 2-9). Due to the nature of the SPI interface, the Answer Message is shifted, compared to the Request
Message, by one SPI transfer. It means, for example, that the last word of answer message n is transmitted by
the slave while the master sends the first word of request message n+1.
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Transfer
...
inactive
Chip Select
NCS
active
Word i
Transmit Frame
Master
Serial Output
(seen at SDI)
...
RM1
...
...
RM2
...
...
...
RMn
Wn
...
...
AM2
...
...
...
...
...
AMn
...
Request Message for Slave i
Receive Frame
Master
Serial Input
(seen at SDO)
...
...
...
...
AM1
...
...
Answer Message of Slave i
Figure 2-8 Response Answer Principle - Daisy Chain Topology
Transfer
...
inactive
Chip Select
NCS for
Slave i
Master
Serial Output
(seen at SDI)
active
Transmit Frame
Request Message
RM1
RM2
...
...
RMn
Word
Master
Serial Input
(seen at SDO)
...
AM1
AM2
...
AMn
Answer Meassage
Receive Frame
Figure 2-9 Response Answer Principle - Regular Topology
The first word transmitted by the device after power-up is the content of register PSTAT.
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2.4.4.4
2.4.4.4.1
SPI Data Integrity Support
Parity Bit
By default, the SPI link relies on an odd parity protection scheme for each transmitted or received 16-bit word of
the SPI message. The parity bit corresponds to the LSB of the 16-bit word. Therefore, the effective payload of a
16-bit word is 15 data bit (plus one parity bit). The parity bit check (on the received data) can be disabled by
clearing bit PCFG.PAREN. In this case, the parity bit is considered as “don’t care”. The generation of the parity bit
by the driver for transmitted words can not be disabled (but can be considered as “don’t care” by the SPI master).
Note: For fixed value commands (ENTER_CMODE, ENTER_VMODE, EXIT_CMODE, NOP), it has to be ensured
that the value of the parity bit is correct even if parity check is disabled. Otherwise, an SPI error will be
generated.
2.4.4.4.2
SPI Error
When the device is not able to process an incoming request message, an SPI error is generated: the received
message is discarded by the driver, bit PER.SPIERis set and the erroneous message is answered with an error
notification (bit LMI set).
Several failures generate an SPI error:
•
•
•
•
•
A parity error is detected on the received word.
An invalid data word format is received (e.g. not a 16 bit word).
A word is received, which does not corresponding to a valid Request Message.
A command is received which can not be processed. For example, the driver receives in Active Mode a
command which is only valid in other operating modes. Another typical example is a read access to the
secondary while the previous read access is not yet completed (device “busy”).
An SPI access to an invalid address.
Note: the content of a frame with LMI bit set is the value of register PSTAT.
Note: In case of permanent LMI error induced by system failures, it is recommended to apply a reset via pin
NRST/RDY.
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2.4.4.5
Protocol Description
2.4.4.5.1
Command Catalog
Table 2-3 gives an overview of the command catalog supported by the device. The full description of the
commands and of the corresponding request and answer messages is provided in the following sections.
Table 2-3
SPI Command Catalog
Acronym
Short Description
Valid in Mode
ENTER_CMODE
Enters into Configuration Mode.
OPM0, OPM1
ENTER_VMODE
Enters into Verification Mode.
OPM2
EXIT_CMODE
Leaves Configuration Mode to enter into Configured Mode.
OPM2
READ
Reads the register value at the specified address.
All
NOP
Triggers no action in the device (equivalent to a “nop”).
All
WRITEH
Update the most significant byte of the internal write buffer.
All
WRITEL
Updates the least significant byte of the internal write buffer, and All (with restrictions)
copies the contents of the complete buffer into the addressed
register. The write buffer is cleared afterwards.
An overview of the commands is given Figure 2-10.
Message
ENTER_CMODE
ENTER_VMODE
EXIT_CMODE
NOP
READ
WRITEH
WRITEL
0
0
0
0
0
0
1
Command
0
0
0
0
0
0
0
0
0
0
0
1
0
1
1
1
1
1
0
0
0
1
0
0
0
A4
0
A4
0
0
0
1
A3
1
A3
0
0
1
0
A2
0
A2
0
1
0
0
A1
D15
A1
1
0
0
0
A0
D14
A0
Data
0
1
0
0
0
D13
D7
0
0
1
0
1
D12
D6
0
0
0
1
0
D11
D5
0
0
0
0
1
D10
D4
0
0
0
0
0
D9
D3
0
0
0
0
1
D8
D2
P
0
0
0
0
X
X
X
Figure 2-10 SPI Commands Overview
2.4.4.5.2
Word Convention
In order to simplify the description of the SPI commands, the following conventions are used (Table 2-4).
Table 2-4
Word Convention
Acronym
Value
Va(REGISTER)
Value of register REGISTER
PB
Parity Bit
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Table 2-4
Word Convention (cont’d)
Acronym
Value