AUIRF8739L2TR
AUTOMOTIVE GRADE
Automotive DirectFET® Power MOSFET
V(BR)DSS
RDS(on) typ.
max.
ID (Silicon Limited)
Qg
Advanced Process Technology
Optimized for Automotive Motor Drive, DC-DC and
other Heavy Load Applications
Exceptionally Small Footprint and Low Profile
High Power Density
Low Parasitic Parameters
Dual Sided Cooling
175°C Operating Temperature
Repetitive Avalanche Allowed up to Tjmax
Lead Free, RoHS Compliant and Halogen Free
Automotive Qualified *
S
SC
M2
S
S
D
Applicable DirectFET® Outline and Substrate Outline
SB
40V
0.35m
0.6m
545A
375nC
G
S
S
S
S
S
D
DirectFET2 L-can
L8
M4
L4
L6
L8
Description
The AUIRF8739L2 combines the latest Automotive HEXFET® Power MOSFET Silicon technology with the advanced DirectFET® packaging
technology to achieve exceptional performance in a package that has the footprint of an SO-8 or 5X6mm PQFN and only 0.7mm profile. The
DirectFET® package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or
convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET®
package allows dual sided cooling to maximize thermal transfer in automotive power systems.
This HEXFET® Power MOSFET is designed for applications where efficiency and power density are of value. The advanced DirectFET® packaging
platform coupled with the latest silicon technology allows the AUIRF8739L2 to offer substantial system level savings and performance improvement
specifically in motor drive, DC-DC and other heavy load applications on ICE, HEV and EV platforms. This MOSFET utilizes the latest processing
techniques to achieve ultra low on-resistance per silicon area. Additional features of this MOSFET are 175°C operating junction temperature and high
repetitive peak current capability. These features combine to make this MOSFET a highly efficient, robust and reliable device for high current
automotive applications.
Base Part Number
Package Type
AUIRF8739L2
DirectFET®
Standard Pack
Form
Quantity
Tape and Reel
4000
Orderable Part Number
AUIRF8739L2TR
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only; and
functional operation of the device at these or any other condition beyond those indicated in the specifications is not implied. Exposure to absolutemaximum-rated conditions for extended periods may affect device reliability. The thermal resistance and power dissipation ratings are measured under
board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless otherwise specified.
Parameter
VDS
Drain-to-Source Voltage
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V
ID @ TC = 100°C
Continuous Drain Current, VGS @ 10V
ID @ TA = 25°C
Continuous Drain Current, VGS @ 10V
ID @ TC = 25°C
Continuous Drain Current, VGS @ 10V (Package limit)
IDM
Pulsed Drain Current
PD @TC = 25°C
Power Dissipation
PD @TA = 25°C
Power Dissipation
EAS
Single Pulse Avalanche Energy (Thermally Limited)
EAS (Tested)
Single Pulse Avalanche Energy
IAR
Avalanche Current
EAR
Repetitive Avalanche Energy
TP
Peak Soldering Temperature
TJ
Operating Junction and
TSTG
Storage Temperature Range
*Qualification standards can be found at http://www.irf.com/
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Max.
40
545
385
57
375
1150
340
3.8
312
1500**
See Fig. 14, 15, 22a, 22b
Units
V
270
-55 to + 175
mJ
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A
W
mJ
A
°C
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AUIRF8739L2TR
Thermal Resistance
Symbol
Parameter
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Can
Junction-to-PCB Mounted
Linear Derating Factor
RJA
RJA
RJA
RJ-Can
RJ-PCB
Typ.
–––
12.5
20
–––
–––
Max.
40
–––
–––
0.44
0.5
2.3
Units
°C/W
W/°C
Static Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
Drain-to-Source Breakdown Voltage
40
–––
–––
V
VGS = 0V, ID = 250µA
Breakdown
Voltage
Temp.
Coefficient
–––
0.03
–––
V/°C
Reference to 25°C, ID = 5.0mA
V(BR)DSS/TJ
––– 0.35 0.60
RDS(on)
Static Drain-to-Source On-Resistance
m VGS = 10V, ID = 195A
V
VGS(th)
Gate Threshold Voltage
2.2
–––
3.9
VDS = VGS, ID = 250µA
Gate
Threshold
Voltage
Coefficient
–––
-12
–––
mV/°C
VGS(th)/TJ
gfs
Forward Transconductance
250
–––
–––
S
VDS = 10V, ID = 195A
RG
Internal Gate Resistance
––– 0.81 –––
–––
–––
1.0
VDS = 40V, VGS = 0V
IDSS
Drain-to-Source Leakage Current
µA
–––
–––
150
VDS = 40V, VGS = 0V, TJ = 125°C
IGSS
Gate-to-Source Forward Leakage
–––
–––
100
VGS = 20V
nA
Gate-to-Source Reverse Leakage
–––
––– -100
VGS = -20V
Dynamic Electrical Characteristics @ T J = 25°C (unless otherwise specified)
Symbol
Parameter
Min. Typ. Max. Units
Conditions
Qg
Total Gate Charge
–––
375
562
VDS = 20V
VGS = 10V
Qgs1
Gate-to-Source Charge
–––
60
–––
Qgs2
Gate-to-Source Charge
–––
40
–––
nC ID = 195A
Qgd
Gate-to-Drain ("Miller") Charge
–––
120
–––
Qgodr
Gate Charge Overdrive
–––
155
–––
Qsw
Switch Charge (Qgs2 + Qgd)
–––
160
–––
Qoss
Output Charge
–––
151
–––
nC VDS = 32V, VGS = 0V
td(on)
Turn-On Delay Time
–––
34
–––
VDD = 20V, VGS = 10V
ID = 195A
tr
Rise Time
–––
117
–––
ns
td(off)
Turn-Off Delay Time
–––
120
–––
RG = 1.8
tf
Fall Time
–––
95
–––
Ciss
Input Capacitance
––– 17890 –––
VGS = 0V
VDS = 25V
Coss
Output Capacitance
––– 2640 –––
pF
ƒ = 500 kHz
Crss
Reverse Transfer Capacitance
––– 1830 –––
Coss eff.
Effective Output Capacitance
––– 3785 –––
VGS = 0V, VDS = 0V to 32V
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AUIRF8739L2TR
Diode Characteristics
Symbol
Parameter
Continuous Source Current
IS
(Body Diode)
Pulsed Source Current
ISM
(Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Surface mounted on 1 in.
square Cu board (still air).
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Min.
–––
Typ.
–––
Max.
545
–––
–––
1150
–––
–––
–––
–––
47
66
1.2
–––
–––
Units
A
A
V
ns
nC
Conditions
MOSFET symbol
showing the
integral reverse
p-n junction diode.
TJ = 25°C, IS = 195A, VGS = 0V
IF = 195A, VDD = 20V
dv/dt = 100A/µs
Mounted to a PCB with
small clip heatsink (still air)
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Mounted on minimum
footprint full size board with
metalized back and with small
clip heatsink (still air).
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AUIRF8739L2TR
Fig. 1 Typical Output Characteristics
Fig. 2 Typical Output Characteristics
Fig. 3 Typical On-Resistance vs. Gate Volt-
Fig. 4 Typical On-Resistance vs. Drain Current
Fig 5. Transfer Characteristics
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Fig 6. Normalized On-Resistance vs. Temperature
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Fig. 7 Typical Threshold Voltage vs.
Junction Temperature
Fig 9. Typical Forward Transconductance vs. Drain Cur-
Fig 11. Typical Gate Charge vs.
Gate-to-Source Voltage
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Fig 8. Typical Source-Drain Diode Forward Voltage
Fig 10. Typical Capacitance vs. Drain-to-Source Volt-
Fig 12. Maximum Drain Current vs. Case Temperature
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Fig 13. Maximum Safe Operating Area
Fig 14. Maximum Avalanche Energy vs. Temperature
Fig 15. Maximum Effective Transient Thermal Impedance, Junction -to-Case
Fig 16. Typical Avalanche Current vs. Pulse Width
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AUIRF8739L2TR
Notes on Repetitive Avalanche Curves , Figures 16, 17:
(For further info, see AN-1005 at www.irf.com)
1. Avalanche failures assumption:
Purely a thermal phenomenon and failure occurs at a temperature far in
excess of Tjmax. This is validated for every part type.
2. Safe operation in Avalanche is allowed as long as Tjmax is not exceeded.
3. Equation below based on circuit and waveforms shown in Figures 18a, 18b.
4. PD (ave) = Average power dissipation per single avalanche pulse.
5. BV = Rated breakdown voltage (1.3 factor accounts for voltage increase
during avalanche).
6. Iav = Allowable avalanche current.
7. T = Allowable rise in junction temperature, not to exceed Tjmax (assumed as
25°C in Figure 16, 17).
tav = Average time in avalanche.
D = Duty cycle in avalanche = tav ·f
ZthJC(D, tav) = Transient thermal resistance, see Figures 15)
PD (ave) = 1/2 ( 1.3·BV·Iav) = T/ ZthJC
Iav = 2T/ [1.3·BV·Zth]
EAS (AR) = PD (ave)·tav
Fig 17.
Fig 18a. Unclamped Inductive Test Circuit
Fig
VDD
Fig 19a. Gate Charge Test Circuit
Fig 20a. Switching Time Test Circuit
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Fig 19b. Gate Charge Waveform
Fig 20b. Switching Time Waveforms
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AUIRF8739L2TR
DirectFET® Board Footprint, L8 Outline
(Large Size Can, 8-Source Pads)
Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFET.
This includes all recommendations for stencil and substrate designs.
G = GATE
D = DRAIN
S = SOURCE
D
D
D
S
S
S
S
S
S
S
S
G
D
D
D
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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AUIRF8739L2TR
DirectFET® Outline Dimension, L8 Outline
(Large Size
Can, 8-Source
Pads)Dimension,
DirectFET™
Outline
L8 Outline
(Large Size Can, 8-Source Pads)
Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFET. This includes all
Please see AN-1035 for DirectFET assembly details, stencil and substrate design recommendations
recommendations for stencil and substrate designs.
DIMENSIONS
CODE
A
B
C
D
E
F
G
H
J
K
L
L1
M
P
R
METRIC
MIN MAX
9.05
9.15
6.85
7.10
5.90
6.00
0.55
0.65
0.58
0.62
1.18
1.22
0.98
1.02
0.73
0.77
0.38
0.42
1.35
1.45
2.55
2.65
5.45
5.35
0.68
0.74
0.09
0.17
0.02
0.08
IMPERIAL
MIN
MAX
0.356
0.360
0.270
0.280
0.232
0.236
0.022
0.026
0.023
0.024
0.046
0.048
0.039
0.040
0.029
0.030
0.015
0.017
0.053
0.057
0.100
0.104
0.211
0.215
0.027
0.029
0.003
0.007
0.001
0.003
Dimensions are shown in
millimeters (inches)
DirectFET® Part Marking
"AU" = GATE AND
AUTOMOTIVE MARKING
LOGO
PART NUMBER
BATCH NUMBER
DATE CODE
Line above the last character of
the date code indicates "Lead-Free"
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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AUIRF8739L2TR
DirectFET® Tape & Reel Dimension (Showing component orientation)
NOTE: Controlling dimensions in mm
Std reel quantity is 4000 parts, ordered as AUIRF8739L2TR.
REEL DIMENSIONS
STANDARD OPTION (QTY 4000)
IMPERIAL
METRIC
MIN
CODE
MAX
MIN
MAX
12.992
A
N.C
330.00
N.C
0.795
B
20.20
N.C
N.C
0.504
C
12.80
0.520
13.20
0.059
D
1.50
N.C
N.C
E
3.900
99.00 100.00
3.940
F
N.C
N.C
0.880
22.40
G
0.650
16.40
0.720
18.40
H
0.630
15.90
0.760
19.40
LOADED TAPE FEED DIRECTION
NOTE: CONTROLLING
DIMENSIONS IN MM
CODE
A
B
C
D
E
F
G
H
DIMENSIONS
IMPERIAL
METRIC
MIN
MAX
MIN
MAX
4.69
0.476
11.90
12.10
0.154
0.161
3.90
4.10
0.623
0.642
15.90
16.30
0.291
0.299
7.40
7.60
0.283
0.291
7.20
7.40
0.390
0.398
9.90
10.10
0.059
N.C
1.50
N.C
0.059
1.50
0.063
1.60
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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AUIRF8739L2TR
Qualification Information†
Automotive
(per AEC-Q101)
Comments: This part number(s) passed Automotive qualification. IR’s
Industrial and Consumer qualification level is granted by extension of the
higher Automotive level.
Qualification Level
Moisture Sensitivity Level
Machine Model
DirectFET2 L-CAN
MSL1
Class M4 (+/- 800V)
††
AEC-Q101-002
ESD
Human Body Model
Class H2 (+/- 4000V)††
AEC-Q101-001
RoHS Compliant
Yes
† Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/
†† Highest passing voltage.
Revision History
Date
Rev.
02/17/2015
2.0
06/15/2022
2.1
Comments
Final data sheet
Update Fig.13_SOA curve
Corrected typo on Absolute Maximum Ratings Table from ”VGS” to “VDS” on page 1
Click on this section to link to the appropriate technical
paper.
Click on this section to link to the DirectFET ® Website.
Surface mounted on 1 in. square Cu board, steady state.
TC measured with thermocouple mounted to top (Drain)
of part.
Repetitive rating; pulse width limited by max. junction
temperature.
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Starting TJ = 25°C, L = 0.016mH, RG = 50, IAS = 195A,
Vgs = 20V.
Pulse width 400µs; duty cycle 2%.
Used double sided cooling, mounting pad with large
heatsink.
Mounted on minimum footprint full size board with
metalized back and with small clip heatsink.
R is measured at TJ of approximately 90°C.
** Starting TJ = 25°C, L = 0.1mH, RG = 50, IAS = 288A,
Vgs = 20V
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IMPORTANT NOTICE
Unless specifically designated for the automotive market, International Rectifier Corporation and its subsidiaries (IR) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and
services at any time and to discontinue any product or services without notice. Part numbers designated with the “AU” prefix follow automotive industry and / or customer specific requirements with regards to product discontinuance and process
change notification. All products are sold subject to IR’s terms and conditions of sale supplied at the time of order acknowledgment.
IR warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with IR’s
standard warranty. Testing and other quality control techniques are used to the extent IR deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
IR assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using IR components. To minimize the risks with customer products and applications, customers
should provide adequate design and operating safeguards.
Reproduction of IR information in IR data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alterations is an unfair and deceptive business practice. IR is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions.
Resale of IR products or serviced with statements different from or beyond the parameters stated by IR for that product or
service voids all express and any implied warranties for the associated IR product or service and is an unfair and deceptive
business practice. IR is not responsible or liable for any such statements.
IR products are not designed, intended, or authorized for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or in any other application in which the failure of the IR
product could create a situation where personal injury or death may occur. Should Buyer purchase or use IR products for
any such unintended or unauthorized application, Buyer shall indemnify and hold International Rectifier and its officers,
employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that IR was negligent regarding the design or manufacture of the
product.
Only products certified as military grade by the Defense Logistics Agency (DLA) of the US Department of Defense, are designed and manufactured to meet DLA military specifications required by certain military, aerospace or other applications.
Buyers acknowledge and agree that any use of IR products not certified by DLA as military-grade, in applications requiring
military grade products, is solely at the Buyer’s own risk and that they are solely responsible for compliance with all legal
and regulatory requirements in connection with such use.
IR products are neither designed nor intended for use in automotive applications or environments unless the specific IR
products are designated by IR as compliant with ISO/TS 16949 requirements and bear a part number including the designation “AU”. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, IR
will not be responsible for any failure to meet such requirements.
For technical support, please contact IR’s Technical Assistance Center
http://www.irf.com/technical-info/
WORLD HEADQUARTERS:
101 N. Sepulveda Blvd., El Segundo, California 90245
Tel: (310) 252-7105
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